• 대한기계학회논문집B
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• 제26권12호
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• pp.1639-1645
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• 2002

Micro engine that includes Micro scale combustor is fabricated. Design target was focused on the observation of combustion driven actuation in MEMS scale. Combustor design parameters are somewhat less than the size recommended by feasibility test. The engine structure is fabricated by isotropic etching of the photosensitive glass wafers. Electrode formed by electroplating of the Nickel. Photosensitive glass can be etched isotropically with almost vertical angle. Bonding and assembly of structured photosensitive glass wafer form the engine. Combustor size was determined to be 1 mm scale. Movable piston is engraved inside the wafer. Ignition was done by nickel spark plug which was electroplated with thickness of 40 ${\mu}{\textrm}{m}$. The wafers were bonded by epoxy that resists high temperature. In firing test due to the bonding method and design tolerance pressure buildup by reaction was not confirmed. But ignition, flame propagation and actuation of micro structure from the reaction was observed. From the result basement of design and fabrication technology was obtained.

• 대한기계학회논문집A
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• 제33권3호
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• pp.237-242
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• 2009

MEMS catalytic combustors were fabricated to use in micro-power sources as a heat source. The combustor was fabricated by photolithography and anisotropic wet etching of photosensitive glass wafers. Two different catalyst loading methods were used to complete the fabrication of the combustors. For thin film type, the $Al_2O_3$ was washcoated on the surface of the combustion chamber as a catalyst support, and for packed-bed type, ceramic foam was inserted after Pt was coated. The volume of the combustors was 1.8 $cm^3$ and 16W of heat was generated using the fabricated combustors with hydrogen. The energy density of combustor was about 8.9 W/$cm^3$.

• 한국항공우주학회지
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• 제30권6호
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• pp.1-6
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• 2002

마이크로 연소실을 장착한 MAV 추진 장치용 단기통 MEMS 엔진을 제작하였다. 본연구에서는 MEMS 크기의 왕복운동 내연기관의 타당성을 검증하고 실용화를 위한 설계 및 가공데이터를 축적하고자 하였다. 엔진 블록은 가공의 정밀도와 내열성등을 고려하여 감광유리 웨이퍼를 사용하였으며, 점화 전극은 베이스 플레이트 위에 니켈 도금으로 제작하였다. 감광유리판은 등방성 에칭의 특성이 탁월하여 마이크로 엔진의 실린더와 피스톤과 같이 비교적 깊은 식각이 가능함을 확인하였다. 전체 엔진은 세 개의 별도 가공된 레이어를 접착하여 조립한다. 본연구의 엔진 연소실은 깊이는 1mn, 폭 2mn이며, 피스턴은 수소-공기 예 혼합 가스의 연소압력에 의하여 구동된다. 가공된 엔진의 연소실험을 통하여, 점화, 화염전파 및 피스턴 구동을 확인하였으며, 실용화를 위한 연구가 요구되고 있다.

• 센서학회지
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• 제16권5호
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• pp.325-330
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• 2007

For the application to optic devices, wafer level package including spacer with particular thickness according to optical design could be required. In these cases, the uniformity of spacer thickness is important for bonding strength and optical performance. Packaging process has to be performed at low temperature in order to prevent damage to devices fabricated before packaging. And if photosensitive material is used as spacer layer, size and shape of pattern and thickness of spacer can be easily controlled. This paper presents polymer bonding using thick, uniform and patterned spacing layer of SU-8 2100 photoresist for wafer level package. SU-8, negative photoresist, can be coated uniformly by spin coater and it is cured at $95^{\circ}C$ and bonded well near the temperature. It can be bonded to silicon well, patterned with high aspect ratio and easy to form thick layer due to its high viscosity. It is also mechanically strong, chemically resistive and thermally stable. But adhesion of SU-8 to glass is poor, and in the case of forming thick layer, SU-8 layer leans from the perpendicular due to imbalance to gravity. To solve leaning problem, the wafer rotating system was introduced. Imbalance to gravity of thick layer was cancelled out through rotating wafer during curing time. And depositing additional layer of gold onto glass could improve adhesion strength of SU-8 to glass. Conclusively, we established the coating condition for forming patterned SU-8 layer with $400{\mu}m$ of thickness and 3.25 % of uniformity through single coating. Also we improved tensile strength from hundreds kPa to maximum 9.43 MPa through depositing gold layer onto glass substrate.

• 한국진공학회지
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• 제8권4A호
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• pp.465-469
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• 1999

In this paper, spacer process for FED (Field Emission Display ) was developed with the glass to glass anodic bonding technology using Al film as an interlayer. Characteristics, current density-time curves and force of the anodic boding were measured on various thickness of Al film; 1000$\AA$, 2000$\AA$, 3000$\AA$, 4000$\AA$ and 500$\AA$. Holders for spacer were fabricated with photosensitive glass and (110) Si wafer by bulk micromachining. Spacers was formed on glass substrate by spacer glass to glass anodic bonding and an evacuated panel was fabricated to prove the potential of application for FED.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.303-303
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• 2007

Photo-imageable thick-film lithography technology was developed for the fabrication of embedded passives such as inductors and capacitors. In this study, photo-imageable dielectric and conductor pastes have apoted a negative type. Sodalime glass wafer, alumina substrate and zero-shrinkage LTCC green tapes were used as substrates. In result, The lithographic patterns were designed as lines and spaces for conductor material, or via-holes for ceramic, LTCC, materials. The scattering and reflection of UV-beam on the substrate had negative effects on fine patterning. The patterning performance was varied with the exposing and developing process conditions, and also varied with the substrate materials. Fine resolution of less then $50/50{\mu}m$ in line and space was obtained, which is difficult in screen printing method.