• 제목/요약/키워드: Photo-mask

검색결과 93건 처리시간 0.028초

유기 자기조립 단분자막의 레이저 포토 패터닝을 이용한 금속 박막의 미세 형상 가공 기술 (Micromachining Thin Metal Film Using Laser Photo Patterning Of Organic Self-Assembled Monolayers)

  • 최무진;장원석;신보성;김재구
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2003년도 춘계학술대회 논문집
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    • pp.219-222
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    • 2003
  • Self-Assembled Monolayers(SAMs) by alkanethiol adsorption to thin metal film are widely being investigated for applications as coating layer for anti-stiction or friction reduction and in fabrication of micro structure of molecular and bio molecular. Recently, there have been many researches on micro patterning using the advantages of very thin thickness and etching resistance in selective etching of thin metal film of Self- Assembled Monolayers. In this report, we present the micromachining thin metal film by Mask-Less laser patterning of alknanethiolate Self-Assembled Monolayers.

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Preparation and Holographic Recording of Fluorescent Photopolymer Films Containing Anthracene Polymer for Security

  • Park, Tea-Hoon;Kim, Yoon-Jung;Kim, Jeong-Hun;Kim, Eun-Kyoung
    • Journal of the Optical Society of Korea
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    • 제14권4호
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    • pp.305-309
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    • 2010
  • Photopolymer films containing fluorescent anthracene polymer, polymethyleneanthracene (PMAn), were prepared with different concentrations of PMAn for holographic recording useful for security documents. The fluorescent photopolymer film showed enhanced fluorescent intensity due to the micro-separation which arose from grating formation and diffusion during photopolymerization. Experimental values of diffraction efficiency were well matched to the simulated values for photopolymers having different PMAn concentrations. Holography patterning was carried out using the fluorescent photopolymer under a photo-mask. A grating was confirmed using microscope techniques in the recorded area under the pattern. Importantly the recorded area showed enhanced fluorescence compared to the unrecorded part, allowing fluorescence patterns at micro scale along with the submicron grating pattern. The fluorescence pattern recorded on the photopolymer film provides additional readability of holographic reading and thus is useful for secure recording and reading of information.

Cl2/Ar gas mixture 중성빔을 이용한 블록공중합체 식각 연구 (Block Copolymer (PS-b-PMMA) Etching Using Cl2/Ar Gas Mixture in Neutral Beam System)

  • 윤덕현;김경남;성다인;박진우;김화성;염근영
    • 한국표면공학회:학술대회논문집
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    • 한국표면공학회 2015년도 추계학술대회 논문집
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    • pp.332-332
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    • 2015
  • Block Copolymer lithography는 deep nano-scale device 제작을 위한 기존의 top-down방식의 photo-lithography를 대체할만한 기술로 많은 연구가 진행되고 있다. polystyrene(PS)/poly-methyl methacrylate (PMMA)로 구성된 BCP의 nano-scale PS mask는 일반적인 플라즈마 공정에 쉽게 damage를 입는다. 중성빔 식각을 이용하여 식각 공정 중 발생하는 BCP의 degradation을 감소시키고, 비등방성 식각 profile을 얻을 수 있으며 sidewall roughness(SWR)와 sidewall angle(SWA)가 향상되는 것을 알 수 있었다.

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최대추파 10 GHz GaN MESFET의 소자특성 (Device Characteristics of GaN MESFET with the maximum frequency of 10 GHz)

  • 이원상;정기웅;문동찬;신무환
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 1999년도 춘계학술대회 논문집
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    • pp.497-500
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    • 1999
  • This paper reports on the fabrication and characteristics of recessed gate GaN MESFETs fabricated using a photoelectrochemical wet etching method. The unique etching process utilizes photo-resistive mask and KOH based etchant. GaN MESFETs with successfully recessed gate structure was characterized in terms of dc and RF performance. The fabricated GaN MESFET exhibits a current saturation at $V_{DS}$ = 4 V and a pinch-off at $V_{GS}$ =-3V The peak drain current of the device is about 230mA/mm at 300 K and the value is remained almost same for 500K operation. The $f_{T}$ and $f_{max}$ from the device are 6.357Hz and 10.25 GHz, respectively.y.y.

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Super Juction MOSFET의 공정 설계 최적화에 관한 연구 (Optimal Process Design of Super Junction MOSFET)

  • 강이구
    • 한국전기전자재료학회논문지
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    • 제27권8호
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    • pp.501-504
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    • 2014
  • This paper was developed and described core-process to implement low on resistance which was the most important characteristics of SJ (super junction) MOSFET. Firstly, using process-simulation, SJ MOSFET optimal structure was set and developed its process flow chart by repeated simulation. Following process flow, gate level process was performed. And source and drain level process was similar to genral planar MOSFET, so the process was the same as the general planar MOSFET. And then to develop deep trench process which was main process of the whole process, after finishing photo mask process, we developed deep trench process. We expected that developed process was necessary to develop SJ MOSFET for automobile semiconductor.

PHOTOELECTRODEPOSITION OF COPPER ON BORON-DOPED DIAMOND FILMS: ITS APPLICATION TO CONDUCTIVE PATTERN FORMING ON DIAMOND AND DIAMOND PHOTOGRAPHIC PHENOMENON

  • Yoshihara, S.;Shinozaki, K.;Shirakashi, T.
    • 한국표면공학회지
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    • 제32권3호
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    • pp.244-248
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    • 1999
  • Photoelectrodeposition of copper on semiconductive B-doped diamond films was investigated. There are cleasr morphology differences between photodeposited copper and electrodeposited copper. Photoelecrodeposition proceeded as uniform 2-dimensional growth. On the other hand electrodeposition proceeded as scarce random deposition. By applying this effect we have succeeded in forming a conductive pattern on semiconductive B-doped diamond with the aid of a photo-mask. And it was suggested that the surface reforming caused by photoelectrochemical process could be easily detected by the following metal (copper) deosition method, which is demonstrated as 'Diamond photographic phenomenon'.

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Maskless Lithography system을 이용한 TSP 검사 용 micro bump 제작에 관한 연구. (A study of fabrication micro bump for TSP testing using maskless lithography system.)

  • 김기범;한봉석;양지경;한유진;강동성;이인철
    • 한국산학기술학회논문지
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    • 제18권5호
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    • pp.674-680
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    • 2017
  • 본 논문은 현재 개인 휴대기기 및 대형 디스플레이 장비의 제어에서 폭넓게 사용되고 있는 터치스크린 패널 (TSP; Touch Screen Panel)의 정상 작동 유무를 확인하기 위한 micro bump 제작 기술에 관한 연구이다. 터치스크린 패널은 감압식, 정전식 등의 여러 가지 방식이 있으나 지금은 편리성에 의하여 정전식 방식이 주도하고 있다. 정전식의 경우 해당하는 좌표의 접촉에 따라 전기적 신호가 변화하게 되고, 이를 통하여 접촉 위치를 확인할 수 있으며 따라서 접촉 위치에 따른 전기 특성 검사가 필수적이다. 검사공정에서 TSP의 모델이 변경됨에 따라 새로운 micro bump를 제작이 및 검사 프로그램의 수정이 필수적이다. 본 논문에서는 새로운 micro bump 제작 시 mask를 사용하지 않아 보다 경제적이며 변화에 대응이 유연한 maskless lithography 시스템을 이용하여 micro bump 제작 가능성에 대하여 확인하였다. 이를 위하여 제작되는 bump의 pitch에 따른 전기장 간섭 시뮬레이션을 진행하였으며, maskless lithogrphy 공정을 적용하기 위한 패턴 이미지를 생성하였다. 이후 MEMS 기술에 해당하는 PR(Photo Resist) 패터닝 공정에서 노광(Lithography) 공정 및 현상(Developing) 공정을 통하여 PR 마스크를 제작한 후 electro-plating 공정을 통하여 micro bump를 제작하였다.

Thin Film Battery Using Micro-Well Patterned Titanium Substrates Prepared by Wet Etching Method

  • Nam, Sang-Cheol;Park, Ho-Young;Lim, Young-Chang;Lee, Ki-Chang;Choi, Kyu-Gil;Park, Gi-Back
    • 전기화학회지
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    • 제11권2호
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    • pp.100-104
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    • 2008
  • Titanium sheet metal substrates used in thin film batteries were wet etched and their surface area was increased in order to increase the discharge capacity and power density of the batteries. To obtain a homogeneous etching pattern, we used a conventional photolithographic process. Homogeneous hemisphere-shaped wells with a diameter of approximately $40\;{\mu}m$ were formed on the surface of the Ti substrate using a photo-etching process with a $20\;{\mu}m{\times}20\;{\mu}m$ square patterned photo mask. All-solid-state thin film cells composed of a Li/Lithium phosphorous oxynitride (Lipon)/$LiCoO_2$ system were fabricated onto the wet etched substrate using a physical vapor deposition method and their performances were compared with those of the cells on a bare substrate. It was found that the discharge capacity of the cells fabricated on wet etched Ti substrate increased by ca. 25% compared to that of the cell fabricated on bare one. High discharge rate was also able to be obtained through the reduction in the internal resistance. However, the cells fabricated on the wet etched substrate exhibited a higher degradation rate with charge-discharge cycling due to the nonuniform step coverage of the thin films, while the cells on the bare substrate demonstrated a good cycling performance.

다채널 표면 플라즈몬 공명 영상장치를 이용한 자기조립 단분자막의 표면 분석

  • 표현봉;신용범;윤현철
    • 한국생물공학회:학술대회논문집
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    • 한국생물공학회 2003년도 생물공학의 동향(XII)
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    • pp.74-78
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    • 2003
  • 본 논문에서는 금속의 표면 플라즈몬 공명으로 인한 금속-유전체 경계면에서의 국소적 전자기장의 강화 효과를 이용하여 표면 플라즈몬을 유발하는 금 박막을 유리 기판위에 증착하고, 프리즘 커플러를 이용한 소산장의 공명 흡수현상을 이차원 영상 으로 얻었다. 특히 DNA/단백질 칩 등 향후 가능한 다채널 시스템에의 응용을 고려하여11-MUA, 11-MUOH 등 자기조립 단분자막(SAM)을 크롬 마스크와 리토그래피, 그리고 Shadow mask와 광 산화반응을 이용하여 금 표면 위에 패터닝 하였다. 텅스텐-할로겐 램프와 중심파장이 ${\lambda}_0=633$ nm의 대역통과 필터를 사용하여 이 평행광을 프리즘 커플러에 입사시켜 반사되어 나오는 반사광의 이차원 영상을 얻었다. 이와는 별도로 ${\lambda}_0=633$ nm의 레이저를 이용하여 단분자막이 코팅되어 있을 때와 없을 때의 공명각의 변화를 관찰하였다. 얻어진 이차원 영상의 위치에 따른 화소 값의 변화를 단분자 막의 두께의 변화에 따라 보정하고, 알려진 매질의 SPR 특성을 Fresnel 방정식에 따라 이론적으로 계산하면 다채널 표면 영상으로부터 항원-항체 등 단백질의 결합 정도를 정량적으로 측정할 수 있다.

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고전압 역도통 Gate Commutated Thyristor (RC-GCT) 소자의 공정 및 구조 설계 (Process and Structure Design for High Power Reverse-Conducting Gate Commutated Thyristors (RC- GCTs))

  • Kim, Sang-Cheol;Kim, Eun-Dong;Zhang, Chang-Li;Kim, Nam-Kyun;Baek, Do-Hyun
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2001년도 하계학술대회 논문집
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    • pp.1096-1099
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    • 2001
  • The basic design structure of RC-GCTs (Reserve-Conducting Gate-Commutated Thyristors) is firstly given in this paper. The bulk of wafer is punch-through (PT) type with high resistivity and narrow N-base width. The photo-mask was designed upon the turn-off characteristics of GCT and solution of separation between GCT and diode part. The center part of Si wafer is free-wheeling diode (FWD) and outer is GCT part which has 240 fingers totally. The switching performance of GCT was investigated by Dessis of ISE. The basic manufacture process of 2500V-4500V RC-GCTs was given in this work. Additionally, the local carrier lifetime control by 5Mev proton irradiation was adopted so as to not only to have the softness of reverse recovering for FWD but for reduction of turn-off losses of GCT as well.

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