• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.602-605
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• 2001

This paper focus on a method to use Ethernet Network for Industrial Communication Network. Ethernet use the CSMA/CD MAC(Medium Access Control) Protocol at the Data-Link Layer, Which isn't suit for Industrial Communication Network requiring Real-Time Communication, periodic data processing, critical data processing characteristics. In this paper we proposed the Virtual Polling Algorithm at the Application Layer will be solution of using the Ethernet Network for the Industrial Communication Network, Proposed Algorithm terminate the Collision in the network thus Delay Time is reduced and Real-Time Communication will be implemented.

• Proceedings of the Korean Society of Marine Engineers Conference
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• 2006.06a
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• pp.305-306
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• 2006

Developed in this study is a nonlinear Ekman pumping model to be used in simulating the rotating flows with quasi-three-dimensional Navier-Stokes equations. In this model, the Ekman pumping velocity is given from the solution of the Ekman boundary-layer equations for the region adjacent to the bottom wall of the flow domain; the boundary-layer equations are solved in the momentum-integral form. The developed model is then applied to rotating flows in a rectangular container receiving a time-periodic forcing. By comparing our results with the DNS and experimental data we have validated the developed model. We also compared our results with those given from the classical Ekman pumping model. It was found that our model can predict tile rotating flows more precisely than the classical linear model.

• Advances in aircraft and spacecraft science
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• v.6 no.6
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• pp.463-478
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• 2019

The present work investigates the effect on the flow-induced vibrations of the lay-up sequence of composite laminated axisymmetric structures, using an hybrid approach based on a wave finite element and a transfer matrix method. The structural vibrations, under deterministic distributed pressure loads, diffuse acoustic field and turbulent boundary layer excitations, are analysed and compared. A multi-scale approach is used for the dynamic analysis of finite structures, using an elementary periodic subsystem. Different flow regimes and shell curvatures are analysed and the computational efficiency is also discussed.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.30 no.6 s.249
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• pp.568-577
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• 2006

Developed in this study is a nonlinear Ekman pumping model to be used in simulating the rotating flows with quasi-three-dimensional Navier-Stokes equations. In this model, the Ekman pumping velocity is given from the solution of the Ekman boundary-layer equations for the region adjacent to the bottom wall of the flow domain; the boundary-layer equations are solved in the momentum-integral form. The developed model is then applied to rotating flows in a rectangular container receiving a time-periodic forcing. By comparing our results with the DNS and experimental data we have validated the developed model. We also compared our results with those given from the classical Ekman pumping model. It was found that our model can predict the rotating flows more precisely than the classical linear model.

• Proceedings of the KIEE Conference
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• 2002.11c
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• pp.426-429
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• 2002

The data link layer (DLL) of Foundation Fieldbus (FF) includes both token-passing and scheduling services. Periodic data are transmitted via the scheduling service, while time-critical and time-available data are transmitted via the token-passing service. This study developed a network interface board that implements the DLL of FF. Using the network interface board, this study experimentally evaluates the delay performance of the DLL of FF. This study measured the delay performance with respect to the change of the DLL parameters of FF, and investigated the relationship between the DLL parameters and network performance. The study also compared the experimental results with the results obtained from an analytical model.

• Journal of Institute of Control, Robotics and Systems
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• v.9 no.7
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• pp.569-576
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• 2003

The data link layer of Foundation Fieldbus provides both token-passing and scheduling services for periodic, time-critical and time-available data. This study developed an analytical model that evaluates the delay performance of urgent data when the data link layer of Foundation Fieldbus provides token-passing service. The validity of analytical model is verified using an experimental model that consists of network interface boards of Foundation Fieldbus. Comparison of analytical and experimental models shows that the analytical model can be utilized in the approximate analysis of the delay characteristics of time-critical data in the Foundation Fieldbus. The analytical model can also be used in the basic design stage of Foundation Fieldbus network system.

• Applied Microscopy
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• v.52
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• pp.8.1-8.7
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• 2022

The Korean trident goby, Tridentiger brevispinis, lives in adverse habitats that can easily become hypoxic due to low precipitation, regional dry periods, and high amounts of solar radiation. Histological and morphometric studies revealed the goby's specialized skin (35.4-150.0㎛ in thickness), consisting of an epidermis and dermis. The thicker epidermis comprises an outermost surface layer (having taste buds, stratified fattened cells, mucous cells, pigment cells, and stratified polygonal cells), middle layer (having stratified polygonal cells), and stratum germinativum (stratified columnar cells). In particular, the dermis has scales, well-developed vascularization, and a few blood capillaries just above the basement membrane, and a reduced diffusion distance was present in the lateral body. Consequently, adaptations such as thicker epidermis, well-developed vascularization, few blood capillaries, and a reduced diffusion distance may provide cutaneous respiration for survival in poorly oxygenated water during the periodic dry season.

• Korean Journal of Metals and Materials
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• v.50 no.12
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• pp.939-948
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• 2012

A 3-ply clad metal consisting of aluminum and copper was fabricated by roll bonding process and the microstructures and mechanical properties of the roll-bonded and post-roll-bonding heat treated Cu/Al/Cu clad metal were investigated. A brittle interfacial reaction layer formed at the Cu/Al interfaces at and above $400^{\circ}C$. The thickness of the reaction layer increased from $12{\mu}m$ at $400^{\circ}C$ to $28{\mu}m$ at $500^{\circ}C$. The stress-strain curves demonstrated that the strength decreased and the ductility increased with heat treatment up to $400^{\circ}C$. The clad metal heat treated at $300^{\circ}C$ with no indication of a reaction layer exhibited an excellent combination of the strength and ductility and no delamination of layers up to final fracture in the tensile testing. Above $400^{\circ}C$, the ductility decreased rasxpidly with little change of strength, reflecting the brittle nature of the intermetallic interlayers. In Cu/Al/Cu clad heat treated above $400^{\circ}C$, periodic parallel cracks perpendicular to the stress axis were observed at the interfacial reaction layer. In-situ optical microscopic observation revealed that cracks were formed in the Cu layer due to the strain concentration in the vicinity of horizontal cracks in the intermetallic layer, promoting the premature fracture of Cu layer. Vertical cracks parallel to the stress axis were also formed at 15% strain at $500^{\circ}C$, leading to the delamination of the Cu and Al layers.

• The Korean Journal of Ceramics
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• v.2 no.1
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• pp.19-24
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• 1996

The phase distribution and interface chemistry by the solid-state reaction between SiC and nickel were studied at temperatures between $550 \;and\; 1250^{\circ}C$ for 0.5-100 h. The reaction with the formation of silicides and carbon was first observed above $650^{\circ}C$. At $750^{\circ}C$, as the reaction proceeded, the initially, formed $Ni_3Si_2$ layer was converted to $Ni_2$Si. The thin nickel film reacted completely with SiC after annealing at $950^{\circ}C$ for 2 h. The thermodynamically stable $Ni_2$Si is the only obsrved silicide in the reaction zone up to $1050^{\circ}C$. The formation of $Ni_2$Si layers with carbon precipitates alternated periodically with the carbon free layers. At temperatures between $950^{\circ}C$ and $1050^{\circ}C$, the typical layer sequences in the reaction zone is determined by quantitative microanalysis to be $SiC/Ni_2$$Si+C/Ni_2$$Si/Ni_2$$Si+C/…Ni_2$Si/Ni(Si)/Ni. The mechanism of the periodic band structure formation with the carbon precipitation behaviour was discussed in terms of reaction kinetics and thermodynamic considerations. The reaction kinetics is proposed to estimate the effective reaction constant from the parabolic growth of the reaction zone.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.20 no.9
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• pp.2953-2964
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• 1996

Heat Transfer with periodic fluctuation of fluid temperature caused by oscillatory flow or compression expansion can be out of phase with balk fluid-wall temperature difference. Newton's law of convection is inadequate to describe this phenomenon. In order to solve this problem the concept of the complex Nusselt number has been introduced by severla researchers. The complex Nusselt number expresses out of phase excellently while the first harmonic is dominant in the variations of both fluid-wall temperature difference and heat flux. However, in the case of oscillatory flow with non-linear wall temperature distribution, the complex Nusselt number is not appropriate to predict the heat transfer phenomena since the higher order harmonic components appear in periodic temperature variation. Analytic solutions to the heat transfer with an sinusoidal well temperature distribution were obtained to investagate the effect of non-linear wall temperature distribution. A new formula considering the thermal boundary layer was suggested based on the solutions. A comparison was also made with the complex Nusselt number. It was verified that the new formula describes well the heat transfer of oscillating flow even if the first harmonic component is not dominant in the fluid-wall temperature difference.