• Current Photovoltaic Research
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• v.7 no.3
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• pp.65-70
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• 2019

As a demand of higher power photovoltaic modules, shingled, multi-busbar, half-cell, and bifacial techniques are developed. Multi-busbar module has advantage for large amount of light havesting. And, half-cell is high power module for reducing resistive losses and higher shade tolerance. Recently, researches on multi-busbar is focused on reliability according to adhesion and intermetallic compound between Sn-Pb solder and Ag electrode. And half-cell module is researched to comparing with full-sized cell module for structure difference. In this study, we investigated the factors affecting to efficiency and adhesion of multi-wires half-cell module according to wire thickness, solder thickness, and flux. The results of solar simulator and peel test was that peel strength and efficiency of soldered cell is not related. But samples with flux including high solid material showed high efficiency. The results of FE-SEM and EDX line scan on cross-section between wire and Ag electrode for different flux showed thickness of solder joint between wire and Ag electrode is increasing through solid material increasing. Flux including high solid material would affect to solder behavior on Ag electrode. Higher solid material occurred lower growth of IMC layer because solder permeate to sider of wire ribbon than Ag electrode. And it increased fill factor for high efficiency. In soldering process, amount of solid material in flux and solder thickness are the factor related with characteristic of soldered photovoltaic cell.

• Journal of Environmental Science International
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• v.31 no.8
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• pp.691-706
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• 2022

Magnetic activated carbon was prepared by adding a magnetic material to activated carbon that had been prepared from waste citrus peel in Jeju. The adsorption characteristics of an aqueous solution of the antibiotic trimethoprim (TMP) were investigated using the magnetic activated carbon, as an adsorbent, and response surface methodology (RSM). Batch experiments were carried out according to a four-factor Box-Behnken experimental design affecting TMP adsorption with their input parameters (TMP concentration: 50~150 mg/L; pH: 4~10; temperature: 293~323 K; adsorbent dose: 0.05~0.15 g). The significance of the independent variables and their interaction was assessed by ANOVA and t-test statistical techniques. Statistical results showed that TMP concentration was the most effective parameter, compared with others. The adsorption process can be well described by the pseudo-second-order kinetic model. The experimental isotherm data followed the Langmuir isotherm model. The maximum adsorption capacities of TMP, estimated with the Langmuir isotherm model were 115.9-130.5 mg/g at 293-323 K. Also, both the thermodynamic parameters, ΔH and ΔG, have both positive values, indicating that the adsorption of TMP by the magnetic activated carbon is an endothermic reaction and proceeds via an involuntary process.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.21 no.5
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• pp.9-15
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• 2022

Discarded bio-wastes, such as seeds and rinds, cause environmental problems. Multiple studies have recycled bio-wastes as eco-friendly energy sources to solve these problems. This study uses bio-waste to fabricate a mandarin peel powder based triboelectric nanogenerator (MPP-TENG). The MPP-TENG is based on the contact separation mode. It generates an open-circuit voltage and short-circuit current of 156V and 2µA, respectively. In addition, MPP-TENG shows stable operation over continuous 3000s without any deviation in output. Also, the device exhibits maximum power density of 5.3㎼/cm² when connected to a resistance of 100MΩ. In an energy storage capacity test for 1000s, the MPP-TENG stores an energy of 171.6µJ in a 4.7µF capacitor. The MPP-TENG can power 9 blue LEDs and 54 green lettering LEDs. These results confirm that the MPP-TENG can provide a new avenue for eco-friendly energy harvesting device fabrication.

• Composites Research
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• v.22 no.4
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• pp.13-19
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• 2009

Adhesive joints are widely used for structural joining applications in various fields and environmental conditions. Polyurethane adhesive is using for LNG carrier with cryogenic temperature condition. Even if similar polyurethane adhesive is used for different substrate, it shows different adhesion properties. Specially, variation of adhesion properties depending on the resin system or fiber is very important factor for selection of adhesive on industrial application. In present study, we got different peel strength according to the different test temperature when different polyurethane adhesive was used for same fiber reinforced composite. The main cause was investigated using by SEM and it was proven that the different adhesion property between glass fiber on composite surface and polyurethane adhesives at cryogenic temperature.

• Elastomers and Composites
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• v.42 no.2
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• pp.107-111
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• 2007

Adhesion of NR and BR composites with different initial states of precured or uncured conditions was studied. Adhesion between the NR and BR sheets as well as adhesion between the same rubber sheets was investigated. Adhesion forces of the uncured/uncured specimens were larger than those of the cured/uncured and cured/cured ones. The cured/cured samples and uncured NR/cured BR specimen were fully peeled out by the peel test. When one sheet was broken during the peel test, the sheet having the higher crosslink density was broken irrespective of the rubber types. Adhesion forces of the same rubber sheets were higher than those of the different ones and adhesion force of the cured NR/uncured BR sample was higher than that of the uncured NR/cured BR one. The experimental results were explained with the crosslink density and interdiffusion of rubber chains.

• Journal of Surface Science and Engineering
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• v.49 no.2
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• pp.141-146
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• 2016

In this study, electrophoretic paint (E-paint) was deposited on the knife-abraded surface of AZ31 magnesium alloy (AZ31), and its adhesion and corrosion resistance were examined by tape peel-test and salt spray test, respectively. E-paint started to deposit on AZ31 Mg alloy after an inductance time and pores were found in the E-paint layer which is ascribed to hydrogen bubbles generated on the surface during the painting process. The pores disappeared after curing for 15 min at $160^{\circ}C$. The E-paint on AZ31 exhibited good adhesion after immersion in deionized water for 500 h at $40^{\circ}C$. The E-paint sample without scratch showed no corrosion after 1500 h of salt spray test. However, on the scratched sample, blisters were visible adjacent to the scratched sites after 500 h of salt spray test.

• Korean Journal of Materials Research
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• v.19 no.11
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• pp.625-630
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• 2009

Embedding of active devices in a printed circuit board has increasingly been adopted as a future electronic technology due to its promotion of high density, high speed and high performance. One responsible technology is to embedded active device into a dielectric substrate with a build-up process, for example a chipin-substrate (CiS) structure. In this study, desmear treatment was performed before Cu metallization on an FR-4 surface in order to improve interfacial adhesion between electroless-plated Cu and FR-4 substrate in Cu via structures in CiS systems. Surface analyses using atomic force microscopy and x-ray photoemission spectroscopy were systematically performed to understand the fundamental adhesion mechanism; results were correlated with peel strength measured by a 90o peel test. Interfacial bonding mechanism between electrolessplated Cu and FR-4 substrate seems to be dominated by a chemical bonding effect resulting from the selective activation of chemical bonding between carbon and oxygen through a rearrangement of C-C bonding rather than from a mechanical interlocking effect. In fact, desmear wet treatment could result in extensive degradation of FR-4 cohesive strength when compared to dry surface-treated Cu/FR-4 structures.

• Journal of Welding and Joining
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• v.18 no.3
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• pp.89-96
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• 2000

As solder becomes small and fine, the reliability and solderability of solder joint are the critical issue in present electronic packaging industry. Besides the use of lead(Pb) containing solders for the interconnections of microelectronic subsystem assembly and packaging has enviromental problem. In this study, using Sn/Pb and Sn/Ag eutectic solder paste, in order to obtain decrease of solder joint strength with increasing aging time, initial solder joint strength and aging strength after 1000 hour aging at $100^{\circ}C$ were measured by peel test. And in order to obtain the growth of intermetallic compound(IMC) layer thickness, IMC layer thickness was measured by scanning electron microscope(SEM). As a result, solder joint strength was decreased with increasing aging time. The mean IMC layer thickness was increased linearly with the square root of aging time. The diffusion coefficient(D) of IMC layer was found to $1.29{\times}10^{-13}{\;}cm^2/s$ at using Sn/Pb solder paste, 7.56{\times}10^{-14}{\textrm}{cm}^2/s$ at using Sn/Ag solder paste.

• Food Science and Preservation
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• v.9 no.1
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• pp.97-101
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• 2002

Antimicrobial and antioxidative activities of various solvent extracts from different parts of the loquat were investigated to process it as the functional food. The extraction yield showed higher in butanol fraction of 4.95% in peel and 4.42% in seed than others, but water fraction showed high extraction yield of 3.89% in leafs 23.6% in the seedless fruit and 21.1% in fresh, In the antimicrobial activity test, ethyl acetate fraction that leaf and fruit excluded seed inhibited higher 19, 15 mm and 16, 15 m in clear zone far Staphylococcus aureus and Escherichia coli in each. Ethyl acetate fraction that extracted from a series of polar and nonpolar solvent fractionation of methanol extracts showed better results in the hydrogen donating activity of 82% in leaf, 74% in seedless fruit, 68% in seed, 52% in peel and 30% in fresh.

• Korean Journal of Materials Research
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• v.19 no.3
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• pp.119-124
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• 2009

In the microelectronics packaging industry, the adhesion strength between Cu and polyimide and the thermal stability are very important factors, as they influence the performance and reliability of the device. The three different buffer layers of Cr, 50%Cr-50%Ni, and Ni were adopted in a Cu/buffer layer/polyimide system and compared in terms of their adhesion strength and thermal stability at a temperature of $300^{\circ}C$ for 24hrs. A 90-degree peel test and XPS analysis revealed that both the peel strength and thermal stability decreased in the order of the Cr, 50%Cr-50%Ni and Ni buffer layer. The XPS analysis revealed that Cu can diffuse through the thin Ni buffer layer ($200{\AA}$), resulting in a decrease in the adhesion strength when the Cu/buffer layer/polyimide multilayer is heat-treated at a temperature of $300^{\circ}C$ for 24hrs. In contrast, Cu did not diffuse through the Cr buffer layer under the same heat-treatment conditions.