• 한국응용과학기술학회지
• /
• 제22권4호
• /
• pp.332-338
• /
• 2005

This study was conducted to prepare acrylic removable protective coatings by emulsion polymerization. Monomers used were n-butyl acrylate, acrylonitrile, butyl methacrylate. Emulsifiers used were sodium lauryl sulfate and polyoxyethylene lauryl ether, which are an anionic emulsifier and a nonionic emulsifier respectively. Potassium persulfate was used as an initiator and polyvinyl alcohol was used as a stabilizer. Emulsion polymerization was carried out in a semi-batch reactor at $70^{\circ}C$ and agitation speed was 200 rpm. Tensile strength, extension, peel strength, viscosity, and solid contents of the synthesized coatings were examined. The coatings prepared with BA:AN = 60:20 (in weight ratio) satisfied the standard for automobile in terms of extension and peel strength. When the concentration of BMA was in a range of $18{\sim}23$ wt%, the prepared coatings satisfied the standard for automobile in terms of peel strength and water resistance.

• 한국공작기계학회:학술대회논문집
• /
• 한국공작기계학회 2004년도 추계학술대회 논문집
• /
• pp.98-107
• /
• 2004

The objectives of this research are to establish the criteria of peel occurrence considering the shape of bond terminus and to compare the strength properties of some adhesive joints. The criteria of feel occurrence at the bond terminus was suggested. Peel loads of some adhesive joint(butt joint, T -shape specimen, single lap joint) were determined from tensile tests. Principal stress distributions of these joints were determined from finite element method analysis. Then, peel occurrence was estimated with intensity of stress singularity ' $K_{prin.}$' when the terminus shape was square, with average principal stress when the terminus shape was rounded. The conclusions are summarized as follows; (1) In the non-filleted model(e.g., butt joint, T-shape specimen), principal stress shows singularity at the bond terminus, intensity of stress(principal stress) singularity ' $K_{prin.}$&apso; can use as the criteria of peel occurrence at the bond terminus. (2) In the filleted model(e.g., single lap joint), principal stress doesn't show singularity at the bond terminus. Average principal stress can use as the criteria of peel occurrence at the bond terminus.'t show singularity at the bond terminus. Average principal stress can use as the criteria of peel occurrence at the bond terminus.

• 한국공작기계학회논문집
• /
• 제14권5호
• /
• pp.62-73
• /
• 2005

The objects of this research are to establish the criteria of peel occurrence considering the shape of bond terminus and to compare the strength properties of adhesive joint of different three type such as butt joint, T-shape, and single lap Joints. The criteria of peel occurrence at the bond terminus was suggested. Peel loads of three type adhesive joint (butt Joint, T-shape specimen, single lap joint) were determined from tensile tests. Principal stress distributions of these joints were determined from finite element method analysis. Then, peel occurrence was estimated with stress singularity factor$(K_{prin})$ when the terminus shape was square, with average principal stress when the terminus shape was rounded. The conclusions are summarized as follows; (1) In the non-filleted model(e.g., butt joint, T-shape specimen), principal stress shows singularity at the bond terminus, intensity of stress(principal stress) singularity $(K_{prin})$ can use as the criteria of peel occurrence at the bond terminus. (2) In the filleted model(e.g., single lap joint), principal stress has not affected singularity at the bond terminus. Average principal stress$(K_{av})$ can use as the criteria of peel occurrence at the bond terminus.

• 반도체디스플레이기술학회지
• /
• 제3권3호
• /
• pp.11-17
• /
• 2004

This research has been progressed for adhesive improvement of the Polyimide/Buffer layer/Cu at the COF(Chip On Film) which induced as the alternative plan about high concentration of a circuit or substrates according to demands of miniaturization and high efficiency of various electronic equipment. RF plasma equipment was applied to when plama pretreatment was performed for improvement of adhesive strength of PI and Cr as the buffer layer. Experimental fluents were a species of the buffer layer, depositied time and the ratio of $O_2$/Ar when performed to plasma pretreatment. The results are that Ni was superior to Cr at peel test according to a species of the buffer layer, peel strength and Cu THK were showed proportional relation to deposition structure of the same buffer layer and sample of the Cr depositied time(30 sec) and Cu depositied time(20 min) was showed good adhesion to peel test according to Cr's depositied time and Cu's depositied time. When perform PI's plasma pretreatment peel strength and $O_2$/Ar ratio were showed proportional relation. But $O_2$/Ar(2/5) was best condition since then decreased.

• 접착 및 계면
• /
• 제16권4호
• /
• pp.156-161
• /
• 2015

본 연구에서는 수분산 폴리우레탄 아크릴레이트의 접착력 및 물성을 향상시키기 위하여 polyester polyol, 4,4-dicyclohexylmethane diisocyanate ($H_{12}MDI$), dimethylol propionic acid (DMPA), acrylate monomer를 사용하여 수분산 폴리우레탄 아크릴레이트를 합성하였다. 또한 합성된 수분산 폴리우레탄 아크릴레이트의 물성은 FT-IR, 입도분석, UTM, 접착력 등을 평가하였다. 입도 분석에서 아크릴산의 함량이 증가함에 따라 입자의 크기가 증가하였고, 기계적 물성을 평가한 결과, 아크릴산의 함량이 증가함에 따라 인장강도는 증가하였고 신율은 감소하였다. 접착강도는 PU/acryl 비율 중 acryl의 함량이 증가, 아크릴산의 함량이 증가할수록 증가하였다. 아크릴산의 함량이 0.5 wt%일 때 가장 높은 접착강도를 나타내었다.

• 마이크로전자및패키징학회지
• /
• 제29권2호
• /
• pp.59-64
• /
• 2022

연성인쇄회로기판에 사용되는 스크린 프린팅(screen-printing, SP) Ag/폴리이미드(polyimide, PI) 구조의 필 테스트 시 필링 속도 및 박막 적층 구조가 필 강도에 미치는 영향을 분석하기 위해, PI/SP-Ag, PI/SP-Ag/전해도금 Cu, 전해도금 Cu/SP-Ag/PI의 3가지 적층 구조에 대해 필링 속도에 따른 90° 필 테스트를 수행하였다. PI 박막을 필링하는 2가지 구조에서는 필링 속도에 상관없이 필 강도가 거의 일정하게 유지된 반면, Cu/Ag 금속 박막 필링 구조에서는 필링 속도가 증가할수록 필 강도가 크게 증가하는 경향을 보였다. 이는 필링 속도에 따른 90° 굽힘 소재의 소성변형에너지 차이에 기인한 것으로 판단된다. 인장속도에 따른 인장 시험 결과, 변형 속도 증가에 따른 Cu/Ag 금속 박막의 유동응력 및 인성 증가가 Cu/Ag/PI 구조에서의 필링 속도에 따른 금속 박막의 90° 굽힘 소성변형에너지 및 필 강도 증가의 주 원인으로 판단된다. 반면, 점탄성 소재인 PI의 경우 변형 속도에 따른 기계적물성 차이가 금속에 비해 상대적으로 작아서, PI/Ag 및 PI/Ag/Cu 구조에서는 필링 속도에 따른 PI의 90° 굽힘 소성변형에너지 및 필 강도 변화가 상대적으로 적은 것으로 판단된다.

• 마이크로전자및패키징학회지
• /
• 제24권2호
• /
• pp.69-74
• /
• 2017

인쇄전자소자 금속 배선의 고온 신뢰성 평가를 위해 스크린 프린팅 기법으로 도포된 Ag 박막과 폴리이미드 기판 사이의 계면접착력을 $200^{\circ}C$ 후속 열처리 시간에 따라 $180^{\circ}$ 필 테스트를 통해 평가하였고, 박리 계면 미세구조를 분석하였다. 후속 열처리 전 필 강도는 약 16.7 gf/mm 이었고, 열처리 24 시간 후 필 강도는 29.4 gf/mm까지 증가하였는데, 이는 초기 열처리에 의해 접합계면에서 Ag-O-C 화학 결합의 증가와 바인더의 organic bridges 효과가 주 원인인 것으로 판단된다. 한편, 열처리 시간이 48, 100, 250, 500 시간으로 더욱 증가함에 따라 필 강도는 각각 22.3, 3.6, 0.6, 0.1 gf/mm으로 급격히 감소하는 거동을 보였다. 이는 $200^{\circ}C$의 고온에서 장시간 노출되었을 때 Cu/Ag 계면 산화막 형성이 주 원인인 것으로 판단된다.

• 마이크로전자및패키징학회지
• /
• 제29권2호
• /
• pp.43-48
• /
• 2022

인쇄전자소자의 금속배선 적용을 위해 스크린 프린팅 Ag/폴리이미드(polyimide, PI) 사이의 계면접착력을 85℃/85% 상대습도의 고온/고습 처리 시간에 따라 PI 필링을 통한 90° 필 테스트로 평가하였다. 고온/고습 처리 전 필 강도는 약 25.99±1.47 gf/mm이었고, 500시간 동안 고온/고습 처리 후 필 강도는 6.05±0.54 gf/mm까지 지속적으로 감소하였다. 박리 파면에 대해 X-선 광전자 분광법 분석 결과, 이는 Ag/PI 계면으로 수분이 지속적으로 침투하여 계면 근처 PI 일부가 가수분해되어 weak boundary layer를 형성하기 때문이고, 이로 인해 고온/고습 처리 전 Ag/PI 계면 박리모드가 고온/고습 처리 후 계면 근처 PI의 얕은 내부 박리 모드로 변경된 것으로 판단된다.

• 한국안전학회지
• /
• 제24권3호
• /
• pp.7-12
• /
• 2009

The tensile and fatigue experiments were conducted with tensile-peel specimens for investigating on strength of adhesively bonded and mechanical press joints of aluminum sheet used in the field of the automobile industry. The combining epoxy adhesive bonding and mechanical press joining exhibits an increase in joining force as a result of interaction between static forces of the two joining methods. The fatigue strength of pure adhesive joint was measured as 91% of that of the combination of adhesive bond and mechanical press joint, suggesting that the interaction between the bonding and mechanical joining was about 9%.

• 한국전기전자재료학회논문지
• /
• 제28권5호
• /
• pp.332-337
• /
• 2015

We have studied the effects of Ag on the characteristics of $Sn_{60}Pb_{40}Ag_x$ (wt%) solder for photovoltaic ribbon. Ag atoms in the solder formed an alloy phase of $Ag_3Sn$ after reacting with some part of Sn atoms, while they did not react with Pb atoms, but decreased the mean size of Pb solid phase. The enhancement of peel strength between solar cell and ribbon is an important part in the developments of long-lifespan solar module. The peel strength of the solder ribbon of $Sn_{60}Pb_{40}$ (wt%) was $169N/mm^2$, and it was largely enhanced by adding a small amount of Ag atoms. The maximum peel strength was $295N/mm^2$ in the solder ribbon of $Sn_{60}Pb_{40}Ag_2$ (wt%). This result is caused by the high binding energy of 162.9 kJ/mol between Ag atoms in the solder and Ag atoms in Ag sheet.