• Journal of the Microelectronics and Packaging Society
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• v.20 no.4
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• pp.13-16
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• 2013

A lot of various researches have been going on to use heat spreader for LED module. Nano porous aluminum anodic oxide (AAO) applied LED, which is produced from anodization, is easy and economically advantageous. Convensional LED module is consist of aluminum/adhesive/copper circuit. The polymer adhesive in this module is used as heat spreader. However the thermal emission of LED component is degraded because of low heat conductivity of polymer and also reliability of LED component is reduced. Therefore, AAO in this work was applied to heat spreader of LED module which has higher heat conductivity compare to polymer. Bonding strength between AAO and copper circuit was improved with Ti/Cu seed layer by copper sputtering process (DBC) before the bonding. And this copper circuit has been fabricated by electro plating method. Peel strength of AAO and copper circuit in this work showed range between 1.18~1.45 kgf/cm with anodizing process which is very suitable for high power LED application.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2002.05a
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• pp.29-32
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• 2002

The mechanical joining process of a sheet metal pair has been developed in order to replace the resistance spot welding process in case that joining of mechanically unweldable materials and coated sheet metals with different thickness are needed. Form-joining or clinching, a kind of mechanical joining process, is defined as joining process of a sheet metal pair by geometric constraint imposed by plastic deformation of workpieces without any additive part. It has been reported that the joining strength by commercial form-joining apparatus is 50∼70 percent of that by resistance spot welding. Therefore, a two-step form-joining process with a secondary punch is proposed. The device is designed to improve the joining strength by increasing the geometric constraint of the deformed shape by combining a primary punch, a secondary punch and a female die. In order to verify the improved joining strength by the designed process, the tensile-shear strength, the peel-tension strength and the asymmetric peel-tension strength are compared with those by the TOX process and resistance spot welding.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.1
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• pp.41-46
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• 2010

The interfacial adhesion strengths between screen-printed Ag film and epoxy resin-coated polyimide were evaluated by $180^{\circ}$ peel test method. Measured peel strength value was initially around $164.0{\pm}24.4J/m^2$, while the heat treatment during 24h at $120^{\circ}C$ increase peel strength up to $220.8{\pm}19.2J/m^2$. $85^{\circ}C/85%$ RH temperature/humidity treatment decrease peel strength to $84.1{\pm}50.8J/m^2$, which seems to be attributed to hydrolysis bonding reaction mechanism between metal and adhesive epoxy resin coating layer.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.2
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• pp.17-22
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• 2013

We investigated the optimum bonding conditions for thermo-compression bonding of electrodes between flexible printed circuit board(FPCB) and rigid printed circuit board(RPCB) with Sn-58Bi solder as interlayer. In order to figure out the optimum bonding conditions, peel test of FPCB/RPCB joint was conducted. The peel strength was affected by the bonding conditions, such as temperature and time. The fracture energies were calculated through F-x (Force-displacement) curve during peel test and the relationships between bonding conditions and fracture behaviors were investigated. The optimum condition for the thermo-compression bonding with Sn-58Bi solder was found to be temperature of $195^{\circ}C$ and time of 7 s.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.11a
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• pp.171-177
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• 2001

The adhesion enhancement from inserting a RF bias-sputtered Cr layer between Cu and polyimide (PI) has been studied. The RF bias power applied in this study was ranged from 0 to 400 W. Without the RF bias, the peel strength, which measures the adhesion strength, was nearly o g/mm. As the RF power was increased, the peel strength rose up to ~130 g/mm at 200 W, which remained constant with further increase of the RF bias power. Cross-sectional transmission electron microscopy(TEM) was used to investigate the interfacial reaction between the Cr film and PI substrate during the bias sputtering. The Cr/PI interface without the application of RF dais showed a clean, sharp interface while the RF raised Cr/PI interface had about 10~30 nm thick atomistically mixed interlayer between the metal film and PI substrate. This interlayer appeared to have resulted from the implantation of high energy adatoms during the RF bias sputtering of Cr film. This mixed layer serves as an interlocking layer, which enhances adhesion between the metal and PI layers.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2001.05a
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• pp.97-101
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• 2001

Composite materials have been applied widely in interior panels of buildings and transport vehicles. Recently good fire performance and weight reduction are key issues in the fields. In the present study we investigated effects of processing parameters on the performance of honeycomb sandwich panels, especially peel strength of the panel and fire performance. The processing parameters considered were types of matrix resin, resin contents, panel cure conditions, and surface painting process conditions. The results showed that the higher resin content provides the better peel strength. Controled cure steps are also needed to obtain good pee] strength. Paint processing parameters including base putty thickness and paint drying conditions and paint thickness are important to obtain good paint adhesion and good fire performance.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2000.11a
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• pp.71-74
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• 2000

In this study, the optimal condition of surface treatment for aluminum panel was determined by measuring the contact angle and T-peel strength. The contact angle was measured for various mixture ratios of acetylene gas and nitrogen gas. The mixture (acetylene gas to nitrogen gas) ratios used were 1:9, 3:7, 5:5, 7:3, and 9:1. The contact angle was also measured as a function of time of surface treatment. The results showed that the contact angle was a minimum for mixture ratio of 5:5. T-peel strength was a maximum for the treatment time of 30 second.

• Journal of Welding and Joining
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• v.18 no.3
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• pp.89-96
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• 2000

As solder becomes small and fine, the reliability and solderability of solder joint are the critical issue in present electronic packaging industry. Besides the use of lead(Pb) containing solders for the interconnections of microelectronic subsystem assembly and packaging has enviromental problem. In this study, using Sn/Pb and Sn/Ag eutectic solder paste, in order to obtain decrease of solder joint strength with increasing aging time, initial solder joint strength and aging strength after 1000 hour aging at $100^{\circ}C$ were measured by peel test. And in order to obtain the growth of intermetallic compound(IMC) layer thickness, IMC layer thickness was measured by scanning electron microscope(SEM). As a result, solder joint strength was decreased with increasing aging time. The mean IMC layer thickness was increased linearly with the square root of aging time. The diffusion coefficient(D) of IMC layer was found to $1.29{\times}10^{-13}{\;}cm^2/s$ at using Sn/Pb solder paste, 7.56{\times}10^{-14}{\textrm}{cm}^2/s$ at using Sn/Ag solder paste.

• Korean Journal of Materials Research
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• v.19 no.3
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• pp.119-124
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• 2009

In the microelectronics packaging industry, the adhesion strength between Cu and polyimide and the thermal stability are very important factors, as they influence the performance and reliability of the device. The three different buffer layers of Cr, 50%Cr-50%Ni, and Ni were adopted in a Cu/buffer layer/polyimide system and compared in terms of their adhesion strength and thermal stability at a temperature of $300^{\circ}C$ for 24hrs. A 90-degree peel test and XPS analysis revealed that both the peel strength and thermal stability decreased in the order of the Cr, 50%Cr-50%Ni and Ni buffer layer. The XPS analysis revealed that Cu can diffuse through the thin Ni buffer layer ($200{\AA}$), resulting in a decrease in the adhesion strength when the Cu/buffer layer/polyimide multilayer is heat-treated at a temperature of $300^{\circ}C$ for 24hrs. In contrast, Cu did not diffuse through the Cr buffer layer under the same heat-treatment conditions.

• Journal of Technologic Dentistry
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• v.21 no.1
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• pp.55-65
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• 1999

So far, I Conducted an examination with focus on the type, characteristic, and test methods of impact test. which is a type of mechanical that evaluate materials. As mentioned previously, in testing soldering strength of soldering is the load when the object under experiment is broken down with the result of flexibility test or peel test. In this method, a hevay load is necessary until alloy of parent metal is bended, if the alloy of the parent metal has a large mechanical quality(peel strength or resisting power). Once the alloy of the parent metal is bended, however, it tends to come into pieces abruply form the part where soldered. Therefore, a metal has a high breakdown value if the degree of strength of its parent metal is high even if the result of measurement indicates otherwise. Thus, the result of the test did not correspond to the clinical result. Therefore, this study concludes as the following from a test of strength of soldering by mean of conducting an impact test, which is a type of mechanical evaluation methods : 1. Among various impact tests, a charpy thpe is more appropriate than the izod type in testing strength of soldering. 2. As far as test piece is concerned, to use subsized impact test piece is appropriate in the impact test in that it does not have notch. 3. In the matter of analysis, it is appropriate to measure absorbing energy which results from rupture of test piece.