• Journal of the Korean Applied Science and Technology
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• v.22 no.4
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• pp.332-338
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• 2005

This study was conducted to prepare acrylic removable protective coatings by emulsion polymerization. Monomers used were n-butyl acrylate, acrylonitrile, butyl methacrylate. Emulsifiers used were sodium lauryl sulfate and polyoxyethylene lauryl ether, which are an anionic emulsifier and a nonionic emulsifier respectively. Potassium persulfate was used as an initiator and polyvinyl alcohol was used as a stabilizer. Emulsion polymerization was carried out in a semi-batch reactor at $70^{\circ}C$ and agitation speed was 200 rpm. Tensile strength, extension, peel strength, viscosity, and solid contents of the synthesized coatings were examined. The coatings prepared with BA:AN = 60:20 (in weight ratio) satisfied the standard for automobile in terms of extension and peel strength. When the concentration of BMA was in a range of $18{\sim}23$ wt%, the prepared coatings satisfied the standard for automobile in terms of peel strength and water resistance.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2004.10a
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• pp.98-107
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• 2004

The objectives of this research are to establish the criteria of peel occurrence considering the shape of bond terminus and to compare the strength properties of some adhesive joints. The criteria of feel occurrence at the bond terminus was suggested. Peel loads of some adhesive joint(butt joint, T -shape specimen, single lap joint) were determined from tensile tests. Principal stress distributions of these joints were determined from finite element method analysis. Then, peel occurrence was estimated with intensity of stress singularity ' $K_{prin.}$' when the terminus shape was square, with average principal stress when the terminus shape was rounded. The conclusions are summarized as follows; (1) In the non-filleted model(e.g., butt joint, T-shape specimen), principal stress shows singularity at the bond terminus, intensity of stress(principal stress) singularity ' $K_{prin.}$&apso; can use as the criteria of peel occurrence at the bond terminus. (2) In the filleted model(e.g., single lap joint), principal stress doesn't show singularity at the bond terminus. Average principal stress can use as the criteria of peel occurrence at the bond terminus.'t show singularity at the bond terminus. Average principal stress can use as the criteria of peel occurrence at the bond terminus.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.14 no.5
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• pp.62-73
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• 2005

The objects of this research are to establish the criteria of peel occurrence considering the shape of bond terminus and to compare the strength properties of adhesive joint of different three type such as butt joint, T-shape, and single lap Joints. The criteria of peel occurrence at the bond terminus was suggested. Peel loads of three type adhesive joint (butt Joint, T-shape specimen, single lap joint) were determined from tensile tests. Principal stress distributions of these joints were determined from finite element method analysis. Then, peel occurrence was estimated with stress singularity factor$(K_{prin})$ when the terminus shape was square, with average principal stress when the terminus shape was rounded. The conclusions are summarized as follows; (1) In the non-filleted model(e.g., butt joint, T-shape specimen), principal stress shows singularity at the bond terminus, intensity of stress(principal stress) singularity $(K_{prin})$ can use as the criteria of peel occurrence at the bond terminus. (2) In the filleted model(e.g., single lap joint), principal stress has not affected singularity at the bond terminus. Average principal stress$(K_{av})$ can use as the criteria of peel occurrence at the bond terminus.

• Journal of the Semiconductor & Display Technology
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• v.3 no.3
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• pp.11-17
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• 2004

This research has been progressed for adhesive improvement of the Polyimide/Buffer layer/Cu at the COF(Chip On Film) which induced as the alternative plan about high concentration of a circuit or substrates according to demands of miniaturization and high efficiency of various electronic equipment. RF plasma equipment was applied to when plama pretreatment was performed for improvement of adhesive strength of PI and Cr as the buffer layer. Experimental fluents were a species of the buffer layer, depositied time and the ratio of $O_2$/Ar when performed to plasma pretreatment. The results are that Ni was superior to Cr at peel test according to a species of the buffer layer, peel strength and Cu THK were showed proportional relation to deposition structure of the same buffer layer and sample of the Cr depositied time(30 sec) and Cu depositied time(20 min) was showed good adhesion to peel test according to Cr's depositied time and Cu's depositied time. When perform PI's plasma pretreatment peel strength and $O_2$/Ar ratio were showed proportional relation. But $O_2$/Ar(2/5) was best condition since then decreased.

• Journal of Adhesion and Interface
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• v.16 no.4
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• pp.156-161
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• 2015

In this study, waterborne polyurethane acrylate were synthesized with polyester polyol, 4,4-dicyclohexylmethane diisocyanate ($H_{12}MDI$), dimethylol propionic acid (DMPA), acrylate monomer to improve the properties and peel strength. In addition, the properties of the synthesized waterborne polyurethane acylate was evaluated through FT-IR, particle size analysis, UTM, peel strength. As the acrylic acid content increased, particle size increased. In the results of mechanical properties, when the acrylic acid contents increased, tensile strength was increased but elongation was decreased. All peel strength was improved as the acrylic acid contents of WPUA and acrylate ratio of PU/acrylate increased. Optimum peel strength obtained when acrylic acid was 0.5 wt%.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.59-64
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• 2022

Effects of film stack structure and peeling rate on the peel strength of screen-printed (SP) Ag/polyimide (PI) systems were investigated by a 90° peel test. When PI film was peeled at PI/SP-Ag and PI/SP-Ag/electroplated (EP) Cu structures, the peel strength was nearly constant regardless of the peeling rate. When EP Cu was peeled at EP Cu/SP-Ag/PI structure, the peel strength continuously increased as peeling rate increased. Considering uniaxial tensile test results of EP Cu/SP-Ag film with respect to loading rate, the increase of 90° plastic bending energy and peel strength was attributed to increased flow stress and toughness. On the other hand, viscoelastic PI film showed little variation of flow stress and toughness with respect to loading rate, which was assumed to result in nearly constant 90° plastic bending energy and peel strength.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.2
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• pp.69-74
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• 2017

Effect of post-annealing treatment times at $200^{\circ}C$ on the peel strength of screen-printed Ag film/polyimide substrate were systematically investigated by $180^{\circ}$ peel test for thermal reliability assessment of printed interconnect. Initial peel strength around 16.7 gf/mm increased up to 29.4 gf/mm after annealing for 24hours, and then sharply decreased to 22.3, 3.6, 0.6, and 0.1 gf/mm after 48, 100, 250, and 500 hours, respectively. Ag-O-C chemical bonding as well as binder organic bridges formations seemed to be responsible for interfacial adhesion improvement after the initial annealing treatment, while excessive Cu oxide formation at Cu/Ag interface seems to be closely related to sharp decrease in peel strength for longer annealing times.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.43-48
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• 2022

Effect of temperature/humidity (T/H) treatment conditions on the peel strength of screen-printed Ag/polyimide (PI) structures was evaluated by peeling PI films in 90° peel test. Initial peel strength was 25.99±1.47 gf/mm, and then decreased to 6.05±0.54 gf/mm after 500 h at 85℃/85% relative humidity T/H condition. And, the peeled locus was changed from Ag/PI interface to shallow cohesive inside PI near interface. X-ray photoelectron spectroscopy analysis on the peeled surfaces showed that the long-term moisture penetration into the Ag/PI interface during T/H treatment led to hydrolytic degradation of PI to form weak boundary layer inside PI near Ag/PI interface, which are responsible for large decrease in peel strength.

• Journal of the Korean Society of Safety
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• v.24 no.3
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• pp.7-12
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• 2009

The tensile and fatigue experiments were conducted with tensile-peel specimens for investigating on strength of adhesively bonded and mechanical press joints of aluminum sheet used in the field of the automobile industry. The combining epoxy adhesive bonding and mechanical press joining exhibits an increase in joining force as a result of interaction between static forces of the two joining methods. The fatigue strength of pure adhesive joint was measured as 91% of that of the combination of adhesive bond and mechanical press joint, suggesting that the interaction between the bonding and mechanical joining was about 9%.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.28 no.5
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• pp.332-337
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• 2015

We have studied the effects of Ag on the characteristics of $Sn_{60}Pb_{40}Ag_x$ (wt%) solder for photovoltaic ribbon. Ag atoms in the solder formed an alloy phase of $Ag_3Sn$ after reacting with some part of Sn atoms, while they did not react with Pb atoms, but decreased the mean size of Pb solid phase. The enhancement of peel strength between solar cell and ribbon is an important part in the developments of long-lifespan solar module. The peel strength of the solder ribbon of $Sn_{60}Pb_{40}$ (wt%) was $169N/mm^2$, and it was largely enhanced by adding a small amount of Ag atoms. The maximum peel strength was $295N/mm^2$ in the solder ribbon of $Sn_{60}Pb_{40}Ag_2$ (wt%). This result is caused by the high binding energy of 162.9 kJ/mol between Ag atoms in the solder and Ag atoms in Ag sheet.