• Title/Summary/Keyword: Peel Strength

검색결과 344건 처리시간 0.021초

플라즈마 처리에 의한 PDMS/기판에서의 접착력 측정 (Adhesive strength of PDMS/Substrate by Plasma Treatment)

  • 권오창;한준현;문명운;윤주일
    • 한국표면공학회:학술대회논문집
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    • 한국표면공학회 2015년도 추계학술대회 논문집
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    • pp.169-169
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    • 2015
  • Poly(dimethysiloxane, PDMS)은 그 다양한 사용분야 때문에 지속적으로 연구분야에서 연구주제가 되고 있었다. 본 논문에서는 산소 플라즈마 처리에 의한 PDMS/기판에서의 접착강도를 peel 테스트를 통하여 정량적으로 측정하였다.

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COF용 고밀도 2층 FCCL제작 (Fabrication of 2-layer flexible copper clad laminate (FCCL) with high peel strength for chip on flex (COF))

  • 최형욱;심광보;박동희;조정;최원국
    • 한국표면공학회:학술대회논문집
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    • 한국표면공학회 2007년도 춘계학술발표회 초록집
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    • pp.7-8
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    • 2007
  • Ti을 전극으로 한 RF plasma 를 사용한 표면 처리와 200 eV 이하의 저에너지 반응성 이온빔을 사용한 PI 표면 처리에 의해 초기 및 내열성이 우수한 COF 용 FCCL를 제작하였다. 임계 rf power 이상에서 새롭게 $TiO_2$층의 형성이 접착력 증대의 원인이었으며, Ni-Cr-Zn의 삼원계 접착층의 내열성 향상 특성 등을 연구하였다.

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블랭킹 공정을 이용한 STS/Al 클래드 판재의 계면 접합력 측정에 관한 연구 (Study About Measurement of Interfacial Bonding Strength of STS/Al Clad sheet by Blanking Process)

  • 김태호;이광석;김지훈;문영훈;이영선;윤은유
    • 소성∙가공
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    • 제27권5호
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    • pp.267-275
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    • 2018
  • The clad sheet material is produced by a roll-bonding process of one or more materials with different properties. Good formability of clad sheet material is an essential property in to deform a clad metal sheet into a part or component. Performance of the clad sheet material largely depends on interfacial bond strength between different materials. In this study, interfacial bond strength of STS/Al clad sheet was analyzed by varying experimental parameters using a blanking process. Experimental parameters are the punching speed, clearance, and stacking order of plate materials. In addition, blanking test results were compared with bond strengths measured by the T-peel test, that analyzes interface bonding strength of the standard clad sheet. The blanking process was analyzed by the finite element method under the sticking condition of interface of different materials, and experimental results and analysis results were compared.

프라이머 가공 방법이 열융착 필름 라미네이팅으로 제조한 고충격 대응 에어쿠션 소재의 물성에 미치는 영향 연구 (A Study on the Effect of Primer Processing Method on the Mechanical Properties of Impact Relief Air Cushion Materials Prepared through Thermal Film Laminating)

  • 김지연;김훈민;민문홍
    • 한국염색가공학회지
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    • 제34권3호
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    • pp.173-184
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    • 2022
  • In this study, the TPU film was laminated on an aramid fabric or circular knits in order to implement an air cushion material that can respond to high impact forces in case of a fall and is easy to expand. To increase the bonding strength between the fabric layer and the film layer, a primer layer was formed in two ways: one for thermally bonding and laminating PET film and two for coating and aging hot melt type PUR adhesive. The tensile strength of the aramid air cushion was 2.5 times higher than that of the circular knits, but the tensile elongation of the aramid air cushion was very low compared to that of the circular knits. The tear strength of the aramid air cushion was about twice or more superior to that of the circular knits, the primer treatment method was good at A, and the peel strength was excellent at method A. The aramid air cushion was the lightest in weight. Summarizing the above results, it was best to combine the air cushion material with aramid woven fabric and primer treatment method A to cope with the high impact force applied when falling.

프라이머 코팅과 열융착 필름 라미네이팅을 통해 제조한 충격 완화용 고강력 에어쿠션 직물에 관한 연구 (Study on the High-Strength Air-Cushion Fabrics for Impact-Relief Application Prepared through Primer Coating and Thermal Film Laminating)

  • 김지연;김훈민;민문홍
    • 한국염색가공학회지
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    • 제33권4호
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    • pp.269-279
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    • 2021
  • In this study, the laminating of TPU film after coating of primer adhesive on the fabrics was applied in order to secure the strength to withstand a fall from a higher altitude by increasing the adhesion between the fabric and the film layer. It seems that the fineness of the yarn and the weave construction have a greater effect than the type of the laminating films. The order of superiority of the laminated fabrics by film type and thickness was the same for 1000 denier and 210 denier fabrics, and the tendency was consistent with the order of superiority in the film properties and peel strength tests. The tear strength of laminating fabrics increased three to four times for 1000 denier fabrics compared to the fabric alone, but it decreased by 2 times for the 210 denier fabrics. Summarizing the above results, it is most appropriate to combine 1000d fabric with three types of laminating films(100~200㎛ thickness) of A(0.2T) or B(0.15T) or D(0.1T) considering the air pressure resistance, the impact resistance during the fall, and the durability against damage during use.

후속 열처리 조건에 따른 무전해 니켈 도금박막과 폴리이미드 사이의 계면접착력 평가 (Interfacial Adhesion between Electroless Plated Ni Film and Polyimide by Post-baking Treatment Conditions)

  • 민경진;박성철;이지정;이규환;이건환;박영배
    • 마이크로전자및패키징학회지
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    • 제14권4호
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    • pp.49-56
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    • 2007
  • 습식 개질전처리를 통해 무전해 도금 니켈/폴리이미드 박막을 형성하였으며, 이때 도금 후처리 공정인 후속 열처리 조건에 따른 무전해 니켈 도금 박막과 폴리이미드 사이의 필 강도를 $180^{\circ}C$인 경우 필 강도는 $38.6{\pm}1.1g/mm$에서 $180^{\circ}C$ 처리 시에 $26.8{\pm}2.2g/mm$로 감소하였다. 습식 개질전처리에 의해 폴리이미드 표면에 형성된 carboxyl 결합과 amide결합은 니켈과 폴리이미드 사이의 계면 접착기구와 밀접한 연관성이 있는 것으로 판단된다. 후속 열처리 온도에 상관없이 파괴경로는 모두 폴리이미드 내부였으며, 이때 후속 열처리 온도에 따른 무전해 니켈 도금 박막과 폴리이미드 사이의 박리 강도 거동은 파면 부근에 형성된 carbonyl oxygen결합의 감소와 밀접한 연관성이 있는 것으로 판단된다.

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응집 영역 요소를 이용한 고분자 접착 테이프의 박리거동 모사 (Numerical Simulation of the Delamination Behavior of Polymeric Adhesive Tapes Using Cohesive Zone Element)

  • 장진혁;성민창;유웅열
    • Composites Research
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    • 제29권4호
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    • pp.203-208
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    • 2016
  • 금속/고분자 샌드위치 복합재는 경량성과 제진, 방음 등의 다기능성의 측면에서 기존의 스틸 강판을 대체할 후보 중 하나로서 연구되고 있다. 금속/고분자 복합재의 활용하기 위해서는 접착력을 바탕으로 한 박리 거동 예측이 매우 중요한 요소이다. 본 연구에서는 응집요소를 사용하여 유한요소 해석을 통해 접착제를 사용한 고분자 테이프의 박리거동 해석을 수행하였다. 응집요소의 특성은 박리시험과 역학 관계로부터 도출한 파괴인성을 통해 정의하였고 이를 해석에 적용하였다. 스틸 강판에서 고분자 테이프를 박리하는 시험을 모사하였고, 해석결과와 시험결과를 비교하여 박리 거동 모사가 가능함을 확인하였다.

P2O5로 표면 개질한 폐감귤박 활성탄에 의한 Bisphenol A의 흡착 특성 (Adsorption Characteristics of Bisphenol A Using Activated Carbon Based on Waste Citrus Peel and Surface-Modified with P2O5)

  • 감상규;김명찬;이민규
    • 한국환경과학회지
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    • 제27권11호
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    • pp.1095-1104
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    • 2018
  • The adsorption characteristics of bisphenol A (BPA) were investigated using activated carbon based on waste citrus peel (which is abandoned in large quantities in Jeju Island), denoted as WCP-AC, and surface-modified with various $P_2O_5$ concentrations (WCP-SM-AC). Moreover, coconut-based activated carbon (which is marketed in large amounts) was surface-modified in an identical manner for comparison. The adsorption equilibrium of BPA using the activated carbons before and after surface modification was obtained at nearly 48 h. The adsorption process of BPA by activated carbons and surface-modified activated carbons was well-described by the pseudo second-order kinetic model. The experimental data in the adsorption isotherm followed the Langmuir isotherm model. With increasing $P_2O_5$ concentration (250-2,000 mg/L), the amounts of BPA adsorbed by WCP-SM-AC increased till 1,000 mg/L of $P_2O_5$; however, above 1,000 mg/L of $P_2O_5$, the same amounts adsorbed at 1,000 mg/L of $P_2O_5$ were obtained. With increasing reaction temperature, the reaction rate increased, but the adsorbed amounts decreased, especially for the activated carbon before surface modification. The amounts of BPA adsorbed by WCP-AC and WCP-SM-AC were similar in the pH range of 5-9, but significantly decreased at pH 11, and increased with increasing ionic strength due to screening and salting-out effects.

유기물과 유무기 혼합 폴리머 게이트 절연체를 사용한 유기 박막 트랜지스터의 특성 (Characteristics of Organic Thin Film Transistors with Organic and Organic-inorganic Hybrid Polymer Gate Dielectric)

  • 배인섭;임하영;조수헌;문송희;최원석
    • 한국전기전자재료학회논문지
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    • 제22권12호
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    • pp.1009-1013
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    • 2009
  • In this study, we have been synthesized the dielectric layer using pure organic and organic-inorganic hybrid precursor on flexible substrate for improving of the organic thin film transistors (OTFTs) and, design and fabrication of organic thin-film transistors (OTFTs) using small-molecule organic semiconductors with pentacene as the active layer with record device performance. In this work OTFT test structures fabricated on polymerized substrates were utilized to provide a convenient substrate, gate contact, and gate insulator for the processing and characterization of organic materials and their transistors. By an adhesion development between gate metal and PI substrate, a PI film was treated using $O_2$ and $N_2$ gas. The best peel strength of PI film is 109.07 gf/mm. Also, we have studied the electric characteristics of pentacene field-effect transistors with the polymer gate-dielectrics such as cyclohexane and hybrid (cyclohexane+TEOS). The transistors with cyclohexane gate-dielectric has higher field-effect mobility, $\mu_{FET}=0.84\;cm^2/v_s$, and smaller threshold voltage, $V_T=-6.8\;V$, compared with the transistor with hybrid gate-dielectric.

산소 플라즈마 처리에 의한 반도전-절연 실리콘 고무의 접착 특성 (Adhesion Characteristics of Semiconductive and Insulating Silicone Rubber by Oxygen Plasma Treatment)

  • 이기택;허창수
    • 한국전기전자재료학회논문지
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    • 제19권2호
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    • pp.153-157
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    • 2006
  • In this work, the effects of plasma treatment on surface properties of semiconductive silicone rubber were investigated in terms of X-ray photoelectron spectroscopy (XPS) and contact angles, The adhesion characteristics of semiconductive-insulating interface layer of silicone rubber were studied by measuring the T-peel strengths, The results of the chemical analysis showed that C-H bonds were broken due to plasma discharge and Silica-like bonds(SiOx, x=3${\~}$4) increased, It is thought that semiconductive silicone rubber surfaces treated with plasma discharge led to an increase in oxygen-containing functional groups, resulting in improving the degree of adhesion of the semiconductive-insulating interface layer of silicone rubber. However, the oxygen plama for 20 minute produces a damaged oxidized semiconductive silicone rubber layer, which acts as a weak layer producing a decrease in T-peel strength, These results are probably due to the modifications of surface functional groups or polar component of surface free energy of the semiconductive silicone rubber.