• 제목/요약/키워드: Peak-to-Valley

검색결과 141건 처리시간 0.021초

평면연삭반에서 난삭재의 ELID연삭 (ELID Grinding of Hard-To-Machine Materials on Surface Grinder)

  • 김경년
    • 한국정밀공학회지
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    • 제18권5호
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    • pp.157-164
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    • 2001
  • The grinding for hard-to-machine materials, such as ceramics, super alloys etc., has proven to be a very difficult and consuming process utilizing ordinary methods. In order to conduct high efficiency machining of such materials, grinding processes using metallic bond diamond wheels and applying electrolytic in-process dressing(ELID) have been attempted on a surface grinding machine. In this study, the effects of grinding parameters, and grit sizes have been evaluated in view of surface roughness, grinding force as well as step difference in simultaneous grinding of different materials. The study and experimental results are presented in this paper.

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High-order Reduced Radial Zernike Polynomials for Modal Reconstruction of Wavefront Aberrations in Radial Shearing Interferometers

  • Tien Dung Vu;Quang Huy Vu;Joohyung Lee
    • Current Optics and Photonics
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    • 제7권6호
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    • pp.692-700
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    • 2023
  • We present a method for improving the accuracy of the modal wavefront reconstruction in the radial shearing interferometers (RSIs). Our approach involves expanding the reduced radial terms of Zernike polynomials to high-order, which enables more precise reconstruction of the wavefront aberrations with high-spatial frequency. We expanded the reduced polynomials up to infinite order with symbolic variables of the radius, shearing amount, and transformation matrix elements. For the simulation of the modal wavefront reconstruction, we generated a target wavefront subsequently, magnified and measured wavefronts were generated. To validate the effectiveness of the high-order Zernike polynomials, we applied both low- and high-order polynomials to the wavefront reconstruction process. Consequently, the peak-to-valley (PV) and RMS errors notably decreased with values of 0.011λ and 0.001λ, respectively, as the order of the radial Zernike polynomial increased.

KrF 엑사이머 레이저 법을 이용한 다이아몬드 박막의 평탄화 (Planarization of Diamond Films Using KrF Excimer Laser Processing)

  • 이동구
    • 열처리공학회지
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    • 제13권5호
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    • pp.318-323
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    • 2000
  • The planarization of rough polycrystalline diamond films synthesized by DC arc discharge plasma jet CVD (chemical vapor deposition) was attempted using KrF excimer laser pulses. The effects of laser incidence angle and reaction gases (ozone and oxygen) on etching rate of diamond were studied. The temperature change of diamond and graphite with different laser fluences was calculated by computer simulation to explain the etching behavior of diamond films. The threshold energy density from the experiment for etching of pure crystalline diamond was about $1.7J/cm^2$ and fairly matched the simulation value. Preferential etching of a particular crystallographic plane was observed through scanning electron microscopy. The etching rate of diamond with ozone was lower than that with oxygen. When the angle of incidence was $80^{\circ}$ to the diamond surface normal, the peak-to-valley surface roughness was Significantly reduced from $20{\mu}m$ to $0.5{\mu}m$.

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공명투과다이오드를 이용한 논리회로의 응용 연구 (Study for Digital Logic Circuit Using Resonant Tunneling Diodes)

  • 추혜용;박평운;이창희;이일항
    • 전자공학회논문지A
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    • 제31A권2호
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    • pp.75-80
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    • 1994
  • AlAs/GaAs/AlAs RTDs(Resonant Tunneling Diodes) are fabricated and current-voltage properties of them are measured. At room temperature, peak to valley ratio is 2.4 NOT.AND.OR logic gates and Flip-Flop are fabricated using the bistable characteristics of RTDs. Although NOT.AND.OR logic gates need 5~8 transistors. only one RTD is sufficient to fabricate the logic gates. Since the switching time is very short(<10$^12$sec), it is possible to drive the semiconductor circuits fast and integrate them very large. And it is convinced the possibility of integrating RTDs to multilevel logic circuits by observing two peaks of similar current in the serial connection of two RTDs.

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웨이퍼 장착을 이용한 다이싱 척의 평탄도 평가 방법에 관한 연구 (A Study on the Flatness Evaluation Method of the Dicing Chuck using Chucked-wafer)

  • 육인수;이호철
    • 한국공작기계학회논문집
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    • 제17권3호
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    • pp.53-58
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    • 2008
  • This study was conducted to evaluate the flatness of the porous type of dicing chuck. Two measurement systems for a vacuum chuck with a porous type of ceramic plate were prepared using a digital indicator and a laser interferometer. 6 inch of silicon and glass wafer were also used. Vacuum pressure from 100mmHg to 700mmHg by 100mmHg was increased. From experiments, chucked-wafer flatness was converged to the dicing chuck flatness itself even though the repeatability of contact method using indicator was unstable. Finally, the chuck flatness was estimated below $2{\mu}m$ with peak-to valley value.

조건부 1차원 히스토그램을 이용한 Texture 영상 분할 (A Segmentation Technique of Textured Images Using Conditional 1-D Histograms)

  • 양형렬;이정환;김성대
    • 대한전자공학회논문지
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    • 제27권4호
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    • pp.580-589
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    • 1990
  • This paper describes an efficient method of texture image segmentation based on conditional 1-dimensional histograms. We consider the multi-dimensional histogram, and it is projected into each axis in order to obtain conditional 1-dimensional histograms. And we extract uniform regions by iteratively applying the peak-valley detection method to conditional 1-dimensional histograms. In view of the amount of memory and computation time, the proposed method is superior to the conventional method which uses the multi-dimensional histogram. By applying the proposed method to the artificial and natural texture images some desirable results are obtained.

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미세가공기술을 이용한 초소형 광픽업용 대면적 실리콘 미러 제작 (fabrication of the Large Area Silicon Mirror for Slim Optical Pickup Using Micromachining Technology)

  • 박성준;이성준;최석문;이상조
    • 한국정밀공학회지
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    • 제23권1호
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    • pp.89-96
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    • 2006
  • In this study, fabrication of the large area silicon mirror is accomplished by anisotropic wet etching using micromachining technology for implementation of integrated slim optical pickup and the process condition is also established for improving the mirror surface roughness. Until now, few results have been reported about the production of highly stepped $9.74^{\circ}$ off-axis-cut silicon wafers using wet etching. In addition rough surface of the mirror is achieved in case of tong etching time. Hence a novel method called magnetorheolocal finishing is applied to enhance the surface quality of the mirror plane. Finally, areal peak to valley surface roughness of mirror plane is reduced about 100nm in large area of $mm^2$ and it is applicable to optical pickup using infrared wavelength.

퍼지 이론을 이용한 한국어 및 영어 화자 인식에 관한 연구 (A Study on Korean and English Speaker Recognitions using the Fuzzy Theory)

  • 김연숙;김희주;김경재
    • 한국컴퓨터정보학회논문지
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    • 제7권3호
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    • pp.49-55
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    • 2002
  • 본 논문에서는 피치 파라미터와 퍼지를 포함한 화자 인식 알고리즘을 제안한다. 음의 시간적인 특징을 이용하여 시간 영역에서 분해력을 높이고 주파수 영역에서 잡음에 강인함을 갖는 국부 봉우리와 골에 의한 피치 검출법을 제안하여 피치를 검출한다. 또한 화자 인식에서 음성 신호의 애매성을 보완할 수 있는 퍼지의 소속함수를 이용하여 표준 패턴을 작성하고 퍼지 패턴 매칭을 이용하여 인식을 수행한다.

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퍼지 이론을 이용한 한국어 및 일어 화자 인식에 관한 연구 (A Study on Korean and Japanese Speaker Recognitions using the Fuzzy Theory)

  • 김연숙;김창완
    • 한국컴퓨터정보학회논문지
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    • 제5권3호
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    • pp.51-57
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    • 2000
  • 본 논문에서는 피치와 퍼지를 포함한 화자 인식 알고리즘을 제안한다. 음의 시간적인 특징을 이용하여 시간 영역에서 분해력을 높이고 주파수 영역에서 잡음에 강인함을 갖는 국부 봉우리와 골에 의한 피치 검출법을 제안하여 피치를 검출한다. 또한 화자 인식에서 음성 신호의 애매성을 보완할 수 있는 퍼지의 소속함수를 이용하여 표준 패턴을 작성하고 퍼지 패턴 매칭을 이용하여 인식을 수행한다.

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초정밀가공기를 이용한 Zerodur의 연삭 특성에 관한 연구 (A Study on the Characteristics of Zerodur Grinding using Ultra-Precision Machine)

  • 김주환;김건희;한정열;김석환;원종호
    • 한국공작기계학회:학술대회논문집
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    • 한국공작기계학회 2003년도 춘계학술대회 논문집
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    • pp.405-409
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    • 2003
  • We explored a new rough grinding technique on optics materials such as Zerodur. The facility used is a NANOFORM-600 diamond turning machine with a custom grinding module and range of diamond resin bond wheel. The grinding parameters such as workpiece rotation speed depth of cut and feed rate were altered while grinding the workpiece surfaces of 20m in diameter. Surface roughness is measured by Form Talysurf series2. Our target is to define grinding conditions producing the surface roughness better than 0.02${\mu}{\textrm}{m}$ Ra and the form accuracy of around 0.2${\mu}{\textrm}{m}$ PV.

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