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A Study on the Flatness Evaluation Method of the Dicing Chuck using Chucked-wafer  

Yook, In-Soo (한밭대학교 기계공학과 대학원)
Lee, Ho-Cheol (한밭대학교 기계공학부)
Publication Information
Transactions of the Korean Society of Machine Tool Engineers / v.17, no.3, 2008 , pp. 53-58 More about this Journal
Abstract
This study was conducted to evaluate the flatness of the porous type of dicing chuck. Two measurement systems for a vacuum chuck with a porous type of ceramic plate were prepared using a digital indicator and a laser interferometer. 6 inch of silicon and glass wafer were also used. Vacuum pressure from 100mmHg to 700mmHg by 100mmHg was increased. From experiments, chucked-wafer flatness was converged to the dicing chuck flatness itself even though the repeatability of contact method using indicator was unstable. Finally, the chuck flatness was estimated below $2{\mu}m$ with peak-to valley value.
Keywords
Dicing chuck; Wafer; Flatness; Chucked-wafer flatness;
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