• Korean Journal of Materials Research
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• v.19 no.6
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• pp.337-343
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• 2009

In this study, we optimized Pb-free Sn/Ni plating thickness and conditions were optimized to counteract the environmental regulations, such as RoHS and ELV(End-of Life Vehicles). The $B_{10}$ life verification method was also suggested to have been successful when used with the accelerated life test(ALT) for assessing Pb-free solder joint life of piezoelectric (PZT) ceramic resonator. In order to evaluate the solder joint life, a modified Norris-Landzberg equation and a Coffin-Manson equation were utilized. Test vehicles that were composed of 2520 PZT ceramic resonator on FR-4 PCB with Sn-3.0Ag-0.5Cu for ALT were manufactured as well. Thermal shock test was conducted with 1,500 cycles from $(-40{\pm}2)^{\circ}C$ to $(120{\pm}2)^{\circ}C$, and 30 minutes dwell time at each temperature, respectively. It was discovered that the thermal shock test is a very useful method in introducing the CTE mismatch caused by thermo-mechanical stress at the solder joints. The resonance frequency of test components was measured and observed the microsection views were also observed to confirm the crack generation of the solder joints.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.2
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• pp.47-53
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• 2015

The effects of electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) surface finishes on the in-situ intermetallics reaction and the electromigration (EM) reliability of Sn-3.0Ag-0.5Cu (SAC305) solder bump were systematically investigated. After as-bonded, $(Cu,Ni)_6Sn_5$ intermetallic compound (IMC) was formed at the interface of the ENIG surface finish at solder top side, while at the OSP surface finish at solder bottom side,$ Cu_6Sn_5$ and $Cu_3Sn$ IMCs were formed. Mean time to failure on SAC305 solder bump at $130^{\circ}C$ with a current density of $5.0{\times}10^3A/cm^2$ was 78.7 hrs. EM open failure was observed at bottom OSP surface finish by fast consumption of Cu atoms when electrons flow from bottom Cu substrate to solder. In-situ scanning electron microscope analysis showed that IMC growth rate of ENIG surface finish was much lower than that of the OSP surface finish. Therefore, EM reliability of ENIG surface finish was higher than that of OSP surface finish due to its superior barrier stability to IMC reaction.

• Analytical Science and Technology
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• v.15 no.5
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• pp.466-474
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• 2002

The analytical method of 14 kinds of coplanar - PCBs was established and applied the soil sample. The three kinds of extraction solvents (toluene, acetone: n-hexane, dichloromethane) were selected to apply the soil sample. The silica gel, florisil and alumina column cleanup also performed to compare the elution recovery. The average recovery of selected solvents in soil A, B and C was surveyed the 84.25%, 56.09% and 44.69% for toluene, 52.56%, 81.42% and 58.53% for acetone : n - hexane and 55.94%, 71.33% and 61.05% for dichloromethane. The average recovery is represented 49.99% for silica gel (n - hexane 100 mL), 69.65% for florisil (6% ether/n - hexane 100 mL), and 65.23% for alumina (2% DCM : n - hexane 100 mL, 50% DCM: n-hexane 150 mL). In silica gel (n - hexane) and florisil (6% ether : n - hexane) cleanup, the 14 kinds of coplanar PCBs eluted until 40 mL. In the silica gel and florisil columns cleanup, the amounts of elution solvent can be reduced from these results, but the researcher has to confirm the elution amounts before performing the experiments. In alumina cleanup process, the result was obtained to the 100 mL of elution solvents (2% DCM: n-hexane 100 mL and 50% DCM: n-hexane 40 mL), therefore the change of elution solvent is necessary to develop the simple procedure.

• Journal of the Korea Organic Resources Recycling Association
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• v.8 no.1
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• pp.109-120
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• 2000

In the analysis of the common categories, moisture contents and organic concentrations were not much different according to the types of industry or treatment facilities. When heavy metals contribution of the sludge from domestic and industrial wastewater treatment facilities was analyzed, As, Hg and Cr concentrations were relatively high among 42 standards of the fertilizer law. As concentration war higher in 28 of 42 facilities (67%) than limits of the fertilizer law. Hg concentration was not acceptable in the 21 of 42 facilities (50%). Cr concentration was not acceptable in 9 of 42 facilities (21%). From these results, It is found that As is the most frequently detectable component and contaminant than any other heavy metals in sludges. The data from this experiment was also compared with the guidelines of harmful organics and the rest of heavy metals that are regulated by some of the foreign countries. Be, Se and Mo concentrations were lower than the limits. Among the organics, the average concentration of PCB (10 samples) was 26.2 ppb. The highest concentration was 162.6 ppb in the sludge of the municipal wastewater treatment facilities and the lowest concentration was 2.14 ppb from the skin manufacturing industry. From the leaching analysis of re-manufacturing goods from the sludge, most of them was acceptable on the regulation law but Cr concentration was over the limit.

• Journal of the Korean Magnetics Society
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• v.23 no.2
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• pp.49-53
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• 2013

A current sensor is one of important component which is used for the electrical current measurement during charge and discharge of the battery, and monitoring system of the motor controller in the electric and hybrid vehicle. In this study, we have developed an open loop type current sensor using GaAs Hall sensor and magnetic core has an air gap. The Hall sensor detect magnetic field produced by the current to be measured. The 3 mm air gap core was made by HGO electrical steel sheets after slitting, winding, annealing, molding, and cutting. Developed current sensor shows 0.03 % linearity within DC current range from -400 A to +400 A. Operating temperature range was extended to the range of $-40{\sim}105^{\circ}C$ using temperature compensating electronic circuit. To Improve frequency bandwidth limit due to the air flux of PCB (Printed Circuit Board) and Hall sensor, We employed an air flux compensating loop near Hall sensor or on PCB. Frequency bandwidth of the sensor was 100 kHz when we applied sine wave current of $40A{\cdot}turn$ in the frequency range from 100 Hz to 100 kHz. For the dynamic response time measurement, 5 kHz square wave current of $40A{\cdot}turn$ was applied to the sensor. Response time was calculated time reach to 90 % of saturation value and smaller than $2{\mu}s$.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.1
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• pp.39-47
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• 2007

It is investigated how KOH and Rthylenediamine(EDA) treatment conditions on Polyimide film surface affect the interfacial fracture energy between electroless plated Ni and Polyimide film by $180^{\circ}$ peel test. Estimated values of interfacial fracture energy were 24.5 g/mm and 33.3 g/mm for the KOH treatment times under 1 and 5 minutes, respectively, while, those were 31.6 g/mm and 22.3 g/mm for EDA treatment times under 1 and 5 minutes, respectively. Interfacial bonding between electroless plated Ni and Polyimide seems to be dominated by chemical bonding effect rather than mechanical interlocking effect. It is found that chemical treatment produces carboxyl and mine functional groups which are closely related the interfacial bonding mechanism. Finally, it is speculated that interfacial fracture energy seems to be controlled by O=C-O bonding near cohesive failure region.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.20 no.6
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• pp.604-609
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• 2019

In this study, we fabricated a capacitive humidity sensor with interdigitated (IDT) electrodes using a thermosetting polyimide as a humidifying material. First, the number of electrodes, thickness, and spacing of the polyimide film were optimized, and a mask was designed and fabricated. The sensor was fabricated on a silicon substrate using semiconductor processing equipment. The area of the sensor was $1.56{\times}1.66mm^2$, and the width of the electrode and the gap between the electrodes were each $3{\mu}m$. The number of electrodes was 166, and the length of an electrode was 1.294 mm for the sensitivity of the sensor. The sensor was then packaged on a PCB for measurement. The sensor was inserted into a chamber environment with a temperature of $25^{\circ}C$ and connected to an LCR meter to measure the change in capacitance at relative humidity (RH) of 20% to 90%, 1 V, and 20 kHz. The results showed a sensitivity of 26fF/%RH, linearity of < ${\pm}2%RH$, and hysteresis of < ${\pm}2.5%RH$.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.149-154
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• 2018

This paper describes the fabrication and heat transfer property of 50 watts rated LED array module where multiple chips are mounted on chip-on-board type ceramic-metal hybrid substrate with high heat dissipation property for high power street and anti-explosive lighting system. The high heat transfer ceramic-metal hybrid substrate was fabricated by conformal coating of thick film glass-ceramic and silver pastes to form insulation and conductor layers, using thick film screen printing method on top of the high thermal conductivity aluminum alloy heat-spreading panel, then co-fired at $515^{\circ}C$. A comparative LED array module with the same configuration using epoxy resin based FR-4 PCB with thermalvia type was also fabricated, then the thermal properties were measured with multichannel temperature sensors and thermal resistance measuring system. As a result, the thermal resistance of the ceramic-metal hybrid substrate in the $4{\times}9$ type LEDs array module exhibited about one third to the value as that of FR-4 substrate, implying that at least triple performance of heat transfer property as that of FR-4 substrate was realized.

• Bulletin of the Korean Chemical Society
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• v.35 no.5
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• pp.1485-1490
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• 2014

We have designed and developed a new ladder type tetrafused ${\pi}$-conjugated building block such as dihydroindolo[3,2-b]indole (DINI) and investigated its role as an electron rich unit. The photovoltaic properties of a new semiconducting ${\pi}$-conjugated polymer, poly[[5,10-bisoctyl-5,10-dihydroindolo[3,2-b]indole-[5,6- bis(octyloxy)-4,7-di(thiophen-2-yl)benzo[c][1,2,5]thiadiazole]], represented by PDINI-OBTC8 are described. The new polymer PDINI-OBTC8 was synthesized in donor-acceptor (D-A) fashion, where fused ${\pi}$-conjugated tetracyclic DINI, and 5,6-bis(octyloxy)-4,7-di(thiophen-2-yl) benzo[c][1,2,5]thiadiazole (OBTC8) were employed as electron rich (donor) and electron deficient (acceptor) moieties, respectively. The conventional bulk heterojunction (BHJ) device structure ITO/PEDOT:PSS/PDINI-OBTC8:PCB71M/LiF/Al was utilized to fabricate polymer solar cells (PSCs), which comprises the blend of PDINI-OBTC8 and [6,6]-phenyl-$C_{71}$-butyric acid methyl ester ($PC_{71}BM$) in BHJ network. A BHJ PSC that contain PDINI-OBTC8 delivered power conversion efficiency (PCE) value of 1.68% with 1 vol% of 1,8-diidooctane (DIO) under the illumination of A.M 1.5G 100 $mW/cm^2$.

• Journal of Electrical Engineering and Technology
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• v.9 no.1
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• pp.301-306
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• 2014

We proposed a new PCB-type 'common-mode current($I_c$) and differential-mode current($I_d$) detector' working for fast detection of $I_c$ and $I_d$ from the differential-mode signaling, with miniaturization effect and possibility of cheaper fabrication. In order to realize this device, we suggest a branch-line-coupler balun having a composite right- and left-handed(CRLH) one-layer microstrip phase-shifting line as compact as roughly ${\lambda}_g/14$. The presented balun obviously is different from the conventional bent-&-folded delay lines or slits on the ground for coupling the lines on the top and bottom dielectrics. As we connect the suggested balun output ports of the differential-mode signal lines via the through-port named U and coupled-port named L, $I_c$ and $I_d$ will appear at port ${\Delta}$ and port ${\Sigma}$ of the present device, in order. The validity of the design scheme is verified by the circuit-and numerical electromagnetic analyses, and the dispersion curve proving the metamaterial characteristics of the geometry. Besides, the examples of the $I_c$ and $I_d$ indicator are observed as the even and odd modes in differential-mode signal feeding. Also, the proposed device is shown to be very compact, compared with the conventional structure.