• Title/Summary/Keyword: PcbC

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Effect of Temperature on Persistence of Recombinant Plasmid pCU103 in Different Waters

  • Kwak, Myong-Ja;Kim, Chi-Kyung;Kim, Young-Chang;Lim, Jai-Yun;Kim, Young-Soo;Lee, Ki-Sung;Min, Kyung-Hee
    • Journal of Microbiology
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    • v.33 no.3
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    • pp.178-183
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    • 1995
  • The recombinant plasmid of pCU103 constructed by cloning pcbCD genes in pBluescript SK(+) was studied for the effect of temperature on its persistence in different waters by the methods of electrophoresis, Southern hybridization, quantification, and transformation. The plasmid was very rapidly degraded out in non-sterile FW water without regards to water temperature, probably due to the effect of biochemical factor such as nucleases. The pCU103 was most persistent at 4$^{\circ}C$ in any water environments, moderately persistant at 15$^{\circ}C$ but least stable at 3$0^{\circ}C$ such results could be explained by the facts that hydrogen bonds in double-stranded plasmid DNAs become unstable and that nucleases are activated by increasing temperature. The intact structure of pCU1-3 was generally observed by gel electrophoresis under the conditions which the plasmid should be 2.0 ng/$\mu\textrm{l}$ or higher in concentration and that about 10$^2$ CFU/ml or more transformant cells should be recovered.

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A Study on Development of Alternative Non-aqueous Cleaning Agents to Ozone Depletion Substances and its Field Application (오존파괴물질 대체 비수계세정제 개발 및 현장 적용 연구)

  • Park, Yong-Bae;Bae, Jae-Heum;Lee, Min-Jae;Lee, Jong-Gi;Lee, Ho-Yeoul;Bae, Soo-Jung;Lee, Dong-Kee
    • Clean Technology
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    • v.17 no.4
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    • pp.306-313
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    • 2011
  • Flux or solder is used in soldering process for manufacturing electronic parts such as printed circuit boards (PCB). After soldering process, residual flux and solder paste on the parts should be removed since their residuals could cause performance degradation or failure of parts due to their corrosion and electric leakage. Ozone depletion substances such as 1,1,1- trichloroethane (TCE) and HCFC-141b have widely been using for removal of residual flux and solder paste after soldering process In manufacturing of electronic parts until now. In this study, non-aqueous cleaning agents without flash point were developed and applied to industrial field for replacement of cleaning agents with ozone depletion. In order to develop non-aqueous cleaning agents without ethers, esters, fluoride- type solvents. And their physical properties and cleaning abilities were evaluated, and they were applied to industrial fields for cleaning of flux and solder on the PCB. And vacuum distillation apparatus were operated to determine their operating conditions and recycling yields for recycling of used cleaning agents formulated in this study. As a result of physical properties measurement of our formulated cleaning agents, they were expected to have good wetting and penetrating power since their surface tensions were relatively low as 18.0~20.4 dyne/$cm^2$ and their wetting indices are relatively large. And some cleaning agents holding fluoride-type solvents as their components did not have any flash point and they seemed to be safe in their handling and storage. The cleaning experimental results showed that some cleaning agents were better in their cleaning of flux and solder paste than 1,1,1-TCE and HCFC-141b. And industrial application results of the formulated cleaning agents for cleaning PCB indicated that they can be applicable to industry due to their good cleaning capability in comparison with HCFC-141b. The recycling experiments of the used formulated cleaning agents through a vacuum distillation apparatus also showed that their 91.9~97.5% could be recycled with its proper operating conditions.

Dechlorination of Individual Congeners in Aroclor 1248 as Enhanced by Chlorobenzoates, Chlorophenols, and Chlorobenzenes

  • Kim, Jong-Seol;Cho, Young-Cheol;Frohnhoefer, Robert C.;Rhee, G-Yull
    • Journal of Microbiology and Biotechnology
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    • v.18 no.10
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    • pp.1701-1708
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    • 2008
  • Previous investigations showed that three classes of haloaromatic compounds (HACs; chlorobenzoates, chlorophenols, and chlorobenzenes) enhanced the reductive dechlorination of Aroclor 1248, judging from the overall extent of reduction in CI atoms on the biphenyl. In the present study, we further investigated the kind of polychlorinated biphenyl (PCB) congeners involved in the enhanced dechlorination by four isomers belonging to each class (2,3-, 2,5-, 2,3,5-, and 2,4,6-chlorobenzoates; 2,3-, 3,4-, 2,5-, and 2,3,6-chlorophenols; and 1,2-, 1,2,3-, 1,2,4-, and penta-chlorobenzenes). Although the PCB congeners involved in the enhanced dechlorination varied with the HACs, the enhancement primarily involved para-dechlorination of the same congeners (2,3,4'-, 2,3,4,2'-plus 2,3,6,4'-, 2,5,3',4'- plus 2,4,5,2',6'-, and 2,3,6,2',4'-chlorobiphenyls), regardless of the HACs. These congeners are known to have low threshold concentrations for dechlorination. To a lesser extent, the enhancement also involved meta dechlorination of certain congeners with high threshold concentrations. There was no or less accumulation of 2,4,4'- and 2,5,4'-chlorobiphenyls as final products under HAC amendment. Although the dechlorination products varied, the accumulation of ortho-substituted congeners, 2-, 2,2'-, and 2,6-chlorobiphenyls, was significantly higher with the HACs, indicating a more complete dechlorination of the highly chlorinated congeners. Therefore, the present results suggest that the enhanced dechlorination under HAC enrichment is carried out through multiple pathways, some of which may be universal, regardless of the kind of HACs, whereas others may be HAC-specific.

Reliability assessment of RPCB and FPCB Joints bonded using Thermo-compression (열 압착으로 접합된 RPCB와 FPCB 접합부의 신뢰성 평가)

  • Jang, Jin-Kyu;Lee, Jong-Gun;Lee, Jong-Bum;Ha, Sang-Su;Jung, Seung-Boo
    • Proceedings of the KWS Conference
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    • 2009.11a
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    • pp.81-81
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    • 2009
  • 최근 휴대폰, 노트북 등과 같은 소형 멀티미디어 기기의 사용이 증가함에 따라 전자 패키징 산업은 경박단소화를 요구하고 있습니다. 더불어 전기적 신호의 손실을 줄이기 위해 전기, 전자산업체에서는 가볍고 굴곡성이 우수한 연성인쇄회로기판(Flexible Printed Circuit Board, FPCB)과 가격이 싸고 신뢰성이 입증된 경성인쇄회로기판(Rigid Printed Circuit Board, RPCB)의 전극간 접합에 많은 관심을 보이고 있습니다. 기존에 연성인쇄회로기판과 경성인쇄회로기판을 접합하는 방식으로는 connector를 이용한 체결법이 사용되고 있지만 완성품의 부피가 커지고 자동화 공정이 힘들며 I/O 개수가 제한적이어서 신호전달에 취약한 단점이 있습니다. 또한, 최근 FPCB를 RPCB에 접합하는데 interconnection으로 이방성 도전 필름(Anisotropic conductive film, ACF) 또는 비전도성 필름(Non-conductive film)이 널리 사용되고 있습니다. 하지만 필름의 가격이 비싸고, 낮은 전기 전도도를 보이며, 신뢰성 특성이 낮다는 단점을 가지고 있습니다. 본 실험에서는 기존의 connector 방식과 접착 필름을 이용한 방식을 대체하기 위하여 솔더를 interlayer로 이용하여 열과 압력으로 접합하는 방법에 대하여 연구하였습니다. 실험에 사용된 솔더의 조성은 Sn-3.0Ag-0.5Cu (in wt%)이고, RPCB와 FPCB의 표면처리는 ENIG로 하였습니다. 접합 온도와 접합 시간에 따라 최적의 접합 조건을 도출하고자 하였고, 접합된 시편을 가지고 신뢰성 테스트를 진행하였습니다. $85^{\circ}C$/85% 고온고습 시험과 고온 방치 시험을 통하여 접합부의 신뢰성을 테스트 하였고, 90도 Peel test로 기계적 접합 강도를 측정하였고, 파괴 단면을 Scanning Electron Microscopy (SEM), Energy-dispersive spectroscopy (EDS), X-ray photoelectron spectroscopy (XPS)로 분석하였습니다.

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The Concentrations of PCBs in the Serum and Theri Predictors of Exposure n Korean Women (일부 한국 성인 여성들의 혈중 PCBs 농도 및 그 노출요인의 연구)

  • 민선영;정문호;이강숙;노영만;구정환
    • Journal of Environmental Health Sciences
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    • v.26 no.2
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    • pp.97-107
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    • 2000
  • PCBs [Polychlorinated biphenyls] are halogenated aromatic compounds with the empirical formula C12H10-nCln(n=1~10), and are a mixture of possible 209 different chlorinated congeners. PCBs were widely used as dielectric fluids for capacitors, transformers, plasticizers, lubricant inks, and paint additives. once released into the environment, PCBs persist for years because they are so resistant to degradation. In addition to their high degree of lipophilicity. In 1970s, the worldwide production of PCBs seem to be still in use. The environmental load of PCBs was prohibited since 1983 in Korea. In spite of these actions, many PCBs seem to be still in use. The environmental load of PCBs will continue to be recycled through air, land, water, and the biosphere for decades to come. This study was conducted to measure the concentrations of PCBs I the serum samples of 112 women by GC/MSD(Hewlett Packard 5897 Gas Chromatography-Mass Chromatography Detector) and CG/ECD(Hewlett Packard 5890 series-II gas chromatography-Electron capture detector, U.S.A). The main results of this study were as follows; The mean and standard deviation of serum PCBs were 3.613, 0.759 ppb, respectively and median of it was 3.828 ppb. The correlation coefficients of the concentrations of 13 PCB congeners ranged from 0.7913 to 0..9985 and were significantly correlated between each items(p=0.0001). The PCB concentrations were positively associated with age(simple linear regression; R2=0.86, =0.08023, p<0.001) and with total lipids in serums(simple linear regression; R=0.7058, =0.00486, p<0.001). The age adjusted model (Y=$\beta$0+$\beta$1age+$\beta$2X) was applied for possible predictors of PCBs levels in serum. For BMI(Body Mass Index), major residential area, and fish, meat, and dairy consumption, there was no association with PCBs levels, Also there was negative association for the number of pregnancy and lactation period with PCBs levels.

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Effect of Shearing Speed on High Speed Shear Properties of Sn1.0Ag0.5Cu Solder Bump on Various UBM's (다양한 UBM층상의 Sn0Ag0.5Cu 솔더 범프의 고속 전단특성에 미치는 전단속도의 영향)

  • Lee, Wang-Gu;Jung, Jae Pil
    • Korean Journal of Metals and Materials
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    • v.49 no.3
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    • pp.237-242
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    • 2011
  • The effect of shearing speed on the shear force and energy of Sn-0Ag-0.5Cu solder ball was investigated. Various UBM (under bump metallurgy)'s on Cu pads were used such as ENEPIG (Electroless Nickel, Electroless Palladium, Immersion Gold; Ni/Pd/Au), ENIG (Electroless Nickel, Immersion Gold; Ni/Au), OSP (Organic Solderability Preservative). To fabricate a shear test specimen, a solder ball, $300{\mu}m$ in diameter, was soldered on a pad of FR4 PCB (printed circuit board) by a reflow soldering machine at $245^{\circ}C$. The solder bump on the PCB was shear tested by changing the shearing speed from 0.01 m/s to 3.0 m/s. As experimental results, the shear force increased with a shearing speed of up to 0.6 m/s for the ENIG and the OSP pads, and up to 0 m/s for the ENEPIG pad. The shear energy increased with a shearing speed up to 0.3 m/s for the ENIG and the OSP pads, and up to 0.6 m/s for the ENEPIG pad. With a high shear speed of over 0 m/s, the ENEPIG showed a higher shear force and energy than those of the ENIG and OSP. The fracture surfaces of the shear tested specimens were analyzed, and the fracture modes were found to have closer relationship with the shear energy than the shear force.

A NARX Dynamic Neural Network Platform for Small-Sat PDM (동적신경망 NARX 기반의 SAR 전력모듈 안전성 연구)

  • Lee, Hae-Jun
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.24 no.6
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    • pp.809-817
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    • 2020
  • In the design and development process of Small-Sat power distribution and transmission module, the stability of dynamic resources was evaluated by a deep learning algorithm. The requirements for the stability evaluation consisted of the power distribution function of the power distribution module and demand module to the SAR radar in Small-Sat. To verify the performance of the switching power components constituting the power module PDM, the reliability was verified using a dynamic neural network. The adoption material of deep learning for reliability verification is the power distribution function of the payload to the power supplied from the small satellite main body. Modeling targets for verifying the performance of this function are output voltage (slew rate control), voltage error, and load power characteristics. First, to this end, the Coefficient Structure area was defined by modeling, and PCB modules were fabricated to compare stability and reliability. Second, Levenberg-Marquare based Two-Way NARX neural network Sigmoid Transfer was used as a deep learning algorithm.

A Study on the Preparation of SiC Nano powder from the Si Waste of Solar Cell Industry (태양전지 산업(産業)에서 배출(排出)되는 Si waste로부터 SiC 분말 제조에 관한 연구(硏究))

  • Jang, Eun-Jin;Kim, Young-Hee;Lee, Yoon-Joo;Kim, Soo-Ryong;Kwon, Woo-Teck
    • Resources Recycling
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    • v.19 no.5
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    • pp.44-49
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    • 2010
  • SiC powders have been recovered from silicon-containing waste slurry by carbothermal reduction method with carbon black. Large amount of silicon-containing waste slurry is generated from Solar Cell industry. In an environmental and economic point of view, retrieve of the valuable natural resource from the silicon waste is important. In this study, SiC powder recovered by the reaction ball-milled silicon powder from waste and carbon black at $1350^{\circ}C$ for 3h under vacuum condition. Physical properties of samples have been characterized using SEM, XRD, Particle size analyzer and FT-IR spectroscopy.

Built-in CPVS(Concurrent Processing Vision System) of the marking and quality inspection (마킹과 품질검사의 동시 처리 비젼 시스템의 개발)

  • 박화규;채규열;구한서;이윤석;정창성
    • Proceedings of the Korean Information Science Society Conference
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    • 2001.10b
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    • pp.397-399
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    • 2001
  • 레이저를 이용한 마킹(marking) 시스템은 미러(mirror)를 움직이는 XY Scanner안 모터의 Thermal drift로 인한 오차와 laser 오류에 의해 마킹의 불량을 초래하게 된다. 따라서, 이 마킹 불량을 검사하기 위해 마킹 시스템에는 비젼(Vision)을 이용한 검사 장비가 탑재된다. 현재 웨이퍼 마킹기나 다른 마킹기의 비젼시스템은 후검사(post vision) 시스템을 도입하고 있다. 하지만, 후검사 시스템의 경우 마킹이 잘못되었을 때, 바로 마킹을 중지하지 못하고 적어도 한 단위 마킹(tray, 웨이퍼, Strip, PCB 등등)을 망치게 되고, 만일 마킹 대상물이 고가인 경우 상당한 금액의 손실을 가져오는 단점을 가지고 있다. 이러한 단절을 보완하기 위해 본 논문에서는 CPVS(Concurrent Processing Vision System)라는 시스템을 구현하였다. 이 시스템은 마킹과 마킹 품질검사를 동시에 병행함으로써 마킹이 잘못되었을 때 마킹을 중단하게 되어 더 이상의 손실이 나지 않게 하고 후처리 검사 시스템으로의 이송과정을 생략함으로써 processing time을 줄이고, 생산성을 높인다는 장점을 가지게 된다. 이 시스템의 구현은 Visual C++의 MFC 라이브러리를 사용한 MDI구조로 구현하였다.

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Chip Pin Parasitic Extraction by Using TDR and NA (TDR 및 NA를 이용한 Chip Pin Parasitic 추출)

  • 이현배;박홍준
    • Proceedings of the IEEK Conference
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    • 2003.07b
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    • pp.899-902
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    • 2003
  • Chip Pin Parasitic은 실제 Chip Pad에서부터 Bonding Wire를 통한 Package Lead Frame까지를 의미한다. 여기서, Lead Frame 및 Bonding Wire에서 Inductance 및 작은 저항이 보이고, Chip Pad에서의 Capacitance, 그리고 Pad 부터 Ground까지의 Return Path에서 발생하는 저항이 보인다. 이들을 모두 합하면 L, R, C의 Series로 나타낼 수 있다. 본 논문에서는 이런 Chip Pin Parasitic을 추출 하기 위해서 TDR(Time Domain Reflectometer)과 NA(Network Analyzer)를 사용하였는데, TDR의 경우 PCB를 제작하여 Chip을 Board위에 붙인 후 Time Domain에서 측정 하였고 NA의 경우 Pico Probe를 이용하여 Chip pin에 직접 Probing해서 Smith Chart를 통하여 Extraction 값을 추출했다. 이 경우, NA를 이용한 측정이 좀 더 정확한 Parasitic 값을 추출할 수 있으리라 예상되겠지만, 실제로 Chip이 구동하기 위해서는 Board위에 있을 때의 상황도 고려해야 하기 때문에 TDR 추출 값과 NA 추출 값을 모두 비교하였다.

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