• 제어로봇시스템학회:학술대회논문집
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• 2001.10a
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• pp.109.2-109
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• 2001

In the PCB assembly lines, as components become more complex and smaller, the conventional inspection method using traditional ICT and function test show their limitations in application. The automatic optical inspection(AOI) gradually becomes the alternative in the PCB assembly line. In Particular, the PCB inspection machines need more reliable and flexible object recognition algorithms for high inspection accuracy. The conventional AOI machines use the algorithmic approaches such as template matching, Fourier analysis, edge analysis, geometric feature recognition or optical character recognition (OCR), which mostly require much of teaching time and expertise of human operators. To solve this problem, in this paper, a statistical learning based part recognition method is proposed. The performance of the ...

• Microbiology and Biotechnology Letters
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• v.22 no.1
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• pp.37-44
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• 1994

The homology among the genes coding for degradation of bipheny(BP) and 4-chlorobiphenyl(4CB) was comparatively analyzed by Southern hybridization in several BP/4CB degrading bacterial strains. As the hybridization results of their genomic DNAs with pcbABCD as the DNA probe, the group of Pseudomonas sp. DJ-12. P08 and P27 strain was separated by the group of P20 and P1242 strains. The P. pseudoalcaligenes KF707 showed the hybidization signal which was homologous to the group of DJ-12, but they had different restriction endonuclease sites. The pcbAB genes in pCUl recombinant plasmid from Pseudomonas sp. DJ-12 appeared to be homologous to pchAB genes in pKTF20 cloned from P. pseudoalcaligenes KF707, but the C genes in both strains were not homologous. The bphABC in pKTF20 showed the signals homologous to the cbp ACB in pAW6194 cloned from P. putida OU83, but homologous signal was not found botween the pcbABCD genes in pCUl and the cbpADCB genes in pAW6194 recombbinant plasmid.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.12
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• pp.1-6
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• 2004

In this study, heat and discharge treatments are arbitrary simulated for finding out the initiations and processes of surface degradation on the surface of polymer for using as a PCB substrate. Thermal-treatment changed the surface to the hydrophobic one with the increase of contact angle and surface potential decay, respectively. The XPS spectrum showed that the increased hydrophobicity in thermal treatment was originated from the continuous decrease of side-chains caused by secessions of oxygen groups and the increase of unsaturated double bond in carbon chains. Also, thermal-treatment caused the discoloration on the point of treated surface. These phenomena were attributed to the generation of ether group. In the chemical change by discharge treatment, a lot of side-chains occurred on the treated surface, and so the hydrophilicity increased as time elapsed.

• Proceedings of the IEEK Conference
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• 2001.10a
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• pp.193-197
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• 2001

This study was carried out to recover gold, silver and other valuable metals from the printed circuit boards (PCB) of waste computers. PCB samples were crushed to under 1mm by a shredder and initially separated into 30% conducting and 70% non-conducting materials by an electrostatic separator. The conducting materials, which contained the valuable metals, were then used as the feed material for magnetic separation where it was found that 42% was magnetic and 58% non- magnetic. The non-magnetic materials contained 0.227mg/g Au and 0.697mg/g Ag. Further leaching of the non-magnetic component using 2.0M sulfuric acid and 0.2M hydrogen peroxide at 85$^{\circ}C$ extracted more than 95% copper, iron, zinc, nickel and aluminium. Au and Ag were not extracted in this solution, however, more than 95% of Au and 100% of Ag were selectively leached with a mixed solvent (0.2M ammonium thiosulfate, 0.02M copper sulfate, 0.4M ammonium hydroxide). Finally, the residues were reacted with a NaCl solution to leach out Pb while sulfuric acid was used to leach out Sn. Recoveries reached 95% and 98% in solution, respectively.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.176-176
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• 2010

전자기술이 발전함에 따라 전자부품 소자는 소형화, 다기능화, 고집적화, 대용량화 되고 있다. 그에 따른 부품들의 고밀도화는 높은 열을 발생시켜 각종 전자부품을 기판으로부터 단락 시키거나 기능을 상실하게 하는 문제점이 발생된다. 이와 같은 문제점을 해결하기 위해서는 발생된 열을 가능한 빠르게 방열 시켜주는 것이 대단히 중요하고 높은 방열 특성을 가지는 금속 PCB기판의 중요성이 높아지고 있다. 하지만 금속을 PCB에 적용하기 위해서는 금속기판과 회로전극사이에 절연층이 반드시 필요하다. 본 실험에서는 RF-Magnetron Sputtering 방법을 이용하여 AlN(질화알루미늄)을 절연물질로 사용, Aluminum기판위에 후막을 제작하여 열적 전기적 구조적 특성을 분석 하였다. 스퍼터링시 아르곤과 질소 분압비에 따른 특성과 후막의 두께에 따른 열적, 전기적, 구조적 특성을 측정 분석하였고, 후열처리를 통하여 AlN 후막의 특성 측정 결과 $200^{\circ}C$로 후열처리 했을 경우 절연파괴전압이 후열처리 전 0.56kV보다 1.125kV로 높아지고 SEM 이미지 상의 AlN 입자 밀도가 더욱 조밀해지는 것으로 확인 하였다. 결론적으로 AlN를 RF-Magnetron Sputtering 방법으로 증착 금속 PCB의 절연물질로 적용하기 위해서는 적정한 가스분압비와 후열처리가 필요하며 이를 통하여 금속 PCB의 절연층으로 응용 가능성이 높을 것으로 사료된다. 본 연구는 한국 산업기술 진흥원의 사업화 연계 연구개발(R&BD)사업의 연구비 지원에 의한 것입니다.

• The Transactions of the Korea Information Processing Society
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• v.2 no.4
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• pp.592-602
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• 1995

Non-grid and grid method are used for modeling the routing region of the automatic routing system. In this study, we develop the automatic routing system by mixing the methods of non-grid and grid to improve the speed of routing. Grid method has a demerit which decreases the automatic routing speed because it is required a lot of memory by the limitation of the size of board and grid, although the electrical and physical elements are insufficient on the PCB, But non-grid is spent gurite less memory than grid method by using a shape-based patterns. Therefore, we used the methods of non-grid and grid altogether in this paper, In the former method, it is attributed to the improvement of speed, the latter one is applied only the connection of the failed routing in the former one, and it performs the complete automatic routing. This system was developed with C＋＋language under the Windows NT environment of IBM 486DX2-66 Computer.

• Resources Recycling
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• v.26 no.5
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• pp.85-96
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• 2017

In this study, we tried to select a slag system capable of pyro-metallurgical process through analysis of sludge generated from PCB plating and etching process solution. Based on this, the possibility of extracting valuable metals in the sludge was studied by experimental and thermodynamic approaches. The sludge was dried at $100{\sim}500^{\circ}C$ and the morphology, chemical composition and phase of the sludge were analyzed. The possibility of pyro-metallurgical process of sludge was investigated through thermodynamic approach using FactSage software.

• Korean Journal of Microbiology
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• v.34 no.1_2
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• pp.20-25
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• 1998

To obtain higher yield of 2,3-dihydroxybiphenyl(2,3-DHBP) dioxygenase by recombinant E. coli CK1092 carrying pcbC gene of Pseudomonas sp. P20, the environmental and physiological factors were investigated and the cultural conditions using jar fermentor were studied. E. coli CKl092 was grown in LB medium supplemented with 2% sucrose, as a basal medium. The effect of various metal ions on the enzyme production was investigated. In particular, the enzyme production increased in the presence of $Fe^{3+}$ and $Fe^{2+}$, and showed the maxium at the concentration of $10^{-5}M$. The enzyme production was increased by 55% in the medium containing $Fe^{3+}$ ($10^{-5}M$) ion. The optimal temperature and initial pH for cell growth were $37^{\circ}C$ and 7.0, respectively. In the culture using a fermentor at $37^{\circ}C$, the optimal conditions for the enzyme production were obtained at the initial pH 7.0, 1 v/v/m of aeration rate, 200 rpm of agitation speed. It was found that enzyme activity was higher when cultivated without pH control than with pH control.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.3
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• pp.81-88
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• 2019

In this study, the effects of graphene oxide (GO) addition on electromigration (EM) lifetime of Sn-3.0Ag-0.5Cu Pb-free solder joint between a ball grid array (BGA) package and printed circuit board (PCB) were investigated. After as-bonded, $(Cu,Ni)_6Sn_5$ intermetallic compound (IMC) was formed at the interface of package side finished with electroplated Ni/Au, while $Cu_6Sn_5$ IMC was formed at the interface of OSP-treated PCB side. Mean time to failure of solder joint without GO solder joint under $130^{\circ}C$ with a current density of $1.0{\times}10^3A/cm^2$ was 189.9 hrs and that with GO was 367.1 hrs. EM open failure was occurred at the interface of PCB side with smaller pad diameter than that of package side due to Cu consumption by electrons flow. Meanwhile, we observed that the added GO was distributed at the interface between $Cu_6Sn_5$ IMC and solder. Therefore, we assumed that EM reliability of solder joint with GO was superior to that of without GO by suppressing the Cu diffusion at current crowding regions.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.1
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• pp.43-49
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• 2015

By the trends of electronic package to be smaller, thinner and more integrative, organic printed circuit board is required to be finer Cu trace pitch. This paper reports on a study of failure mechanism for PCB with fine Cu trace pitch using biased HAST. In weibull analysis of the biased HAST lifetime, it is found that the acceleration factor (AF) of between $135^{\circ}C/90%RH/3.3V$ and $130^{\circ}C/85%RH/3.3V$ is 2.079. A focused ion beam (FIB) was used to polish the cross sections to reveal details of the microstructure of the failure mode. It is found that $Cu_xO/Cu(OH)_2$ colloids and Cu dendrites were formed at anode (+) and at cathode (-), respectively. Thus, this gives the evidence that Cu dendrites formed at cathode by $Cu^{2+}$ ion migration lead to a short failure between a pair of Cu nets.