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Degradation characteristics of the FRP material for using as a PCB substrate  

Park Jong Kwan (Dept. of Information & Communication, Yuhan College)
Publication Information
Journal of the Institute of Electronics Engineers of Korea SD / v.41, no.12, 2004 , pp. 1-6 More about this Journal
Abstract
In this study, heat and discharge treatments are arbitrary simulated for finding out the initiations and processes of surface degradation on the surface of polymer for using as a PCB substrate. Thermal-treatment changed the surface to the hydrophobic one with the increase of contact angle and surface potential decay, respectively. The XPS spectrum showed that the increased hydrophobicity in thermal treatment was originated from the continuous decrease of side-chains caused by secessions of oxygen groups and the increase of unsaturated double bond in carbon chains. Also, thermal-treatment caused the discoloration on the point of treated surface. These phenomena were attributed to the generation of ether group. In the chemical change by discharge treatment, a lot of side-chains occurred on the treated surface, and so the hydrophilicity increased as time elapsed.
Keywords
surface degradation; hydrophobicity; hydrophilicity; surface potential decay; FRP;
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