• Korean Journal of Computational Design and Engineering
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• v.15 no.6
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• pp.418-424
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• 2010

For an engineering analysis to predict a bending of PCB by heat, geometry information from CAM data should be transferred to CAE system. But because this work is done by people, not computer, in PCB manufacturing company, it takes too much time, makes many errors and a result is unreliable. To solve these problems, we analyze a working process of company, then develop a CAM to CAE interface to translate a CAM data into a data to be input into a CAE system automatically.

• Journal of Korean Society of Industrial and Systems Engineering
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• v.16 no.28
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• pp.1-8
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• 1993

Electrical or electronic products have been becoming smaller and high integrated recently, with printed circuit boards(PCB's) being the key components for these products. The introduction of new technology of surface mounted devices(SMD) opens new ways towards high integration on the PCB. Many plants in eletronical industry which produce high variety of PCB's to meet the demands of customer orders require flexibility in PCB's production lines. This survey paper describes the related optimization problems and solution methods to the automated surface mount technology(SMT) assembly lines, and provides with the research direction for improving flexibility.

• Journal of the Semiconductor & Display Technology
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• v.10 no.1
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• pp.113-118
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• 2011

This paper proposes computer visual inspection algorithms for PCB defects which are found in a manufacturing process. The proposed method can detect open circuit and short circuit on bare PCB without using any reference images. It performs adaptive threshold processing for the ROI (Region of Interest) of a target image, median filtering to remove noises, and then analyzes connected components of the binary image. In this paper, the connected components of circuit pattern are defined as 6 types. The proposed method classifies the connected components of the target image into 6 types, and determines an unclassified component as a defect of the circuit. The analysis of the original target image detects open circuits, while the analysis of the complement image finds short circuits. The machine vision inspection system is implemented using C language in an embedded Linux system for a high-speed real-time image processing. Experiment results show that the proposed algorithms are quite successful.

• Proceedings of the IEEK Conference
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• 2007.07a
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• pp.79-80
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• 2007

In this paper, it tried to observe the relationship of radiation pattern and the polarization of the PCB. First, through the PCB trace structure analysis which is various it leads, it analyzes the feature of the DM/CM and provides the interrelation of far-field radiation pattern and the D/V polarization. Also, like this interrelation it leads, it proposes the PCB pattern plan for a decreasing of EMI.

• Journal of the Semiconductor & Display Technology
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• v.19 no.2
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• pp.11-15
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• 2020

In a typical initial setup of a PCB component inspection system, operators should manually input various information such as category, position, and inspection area for each component to be inspected, thus causing much inconvenience and longer setup time. Although there are many deep learning based object detectors, RetinaNet is regarded as one of best object detectors currently available. In this paper, a method using an extended RetinaNet is proposed that automatically detects its component category and position for each component mounted on PCBs from a high-resolution color input image. We extended the basic RetinaNet feature pyramid network by adding a feature pyramid layer having higher spatial resolution to the basic feature pyramid. It was demonstrated by experiments that the extended RetinaNet can detect successfully very small components that could be missed by the basic RetinaNet. Using the proposed method could enable automatic generation of inspection areas, thus considerably reducing the setup time of PCB component inspection systems.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.12 no.1
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• pp.136-142
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• 2001

In this paper, a method of canceling and suppressing differential mode crosstalk noise signals caused by non-uniform coupling between two transmission lines in UTP (unshielded twisted pair) modular jacks is discussed. Differential mode crosstalk noise signals in balanced transmission lines with UTP modular jacks were suppressed, by applying field cancellation techniques to this modular jack. To verify an effectiveness of the field cancellation techniques, 8 pin modular jacks were made, and the NEXT (Near End Crosstalk) losses were measured to prove its applicability by the network analyzer(HP8720C) at 100 Mb/s.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2011.05a
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• pp.54-54
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• 2011

금속의 원자재 가격 상승으로 인하여 도금산업에서는 도금두께 균일도에 대한 정밀도를 더욱 요구하게 되었다. 특히, PCB(Printed Circuit Board) 산업에서는 초소형, 고밀집 제품이 주를 이루고 있기 때문에 도금두께를 정밀하게 제어하기에는 어려움이 따른다. 이에 PCB panel 제품에 대한 도금두께를 정밀하게 제어하기 위해 시뮬레이션을 이용하여 차폐판을 최적 설계하였다. 시뮬레이션의 정확도를 향상시키기 위하여 RDE(Rotaing Disk Electrode) 시스템을 사용하여 도금용액에 대한 전기화학 분석을 진행하였다. 27인치 PCB 제품에 대하여 차폐판을 적용한 결과, 기존에 비해 전류밀도분포 균일도가 약 20% 정도 향상되었다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.548-549
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• 2007

과거 PCB 제조의 주된 화제는 다양한 산업분야의 발전을 위해 한정된 시간 안에 좀 더 많은 PCB를 양산하는 기술 개발에 집중되어 있었지만, 현재는 비정상적인 공정 상태를 파악함으로써 제조 공정 환경에서의 오류를 줄여 전체 수률을 높이는 방법에 시선을 돌리고 있다. PCB 에칭의 경우 에칭 용액의 상태를 실시간으로 모니터링 하는 것이 중요하다. 본 논문에서는 기존 애칭용액의 상태를 판단할 때 사용되는 ORP 센서 대신, RGB 센서를 이용하여 실시간으로 용액의 상태를 모니터링 할 수 있는 시스템을 개발 하였다. 개발된 시스템을 이용하여 기존 ORP 시스템과의 비교 분석을 및 RGB 센서률 이용한 모니터링 방법이 ORP 센서를 이용한 방법 보다 좀 더 쉽고 정확하게 에칭 액의 상태를 모니터링할 수 있다는 것을 확인 하였다.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2012.05a
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• pp.134-134
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• 2012

패키징용 PCB를 비롯한 대부분의 PCB는 동박을 소재로 사용하게 된다. 패키징용 PCB를 중심으로 한 PCB의 협피치화에 대응하기 위해서 전해동박의 저조도화, 박형화에 대한 필요성이 증대되고 있다. 동박의 제조공정은 드럼상에 Cu를 도금하는 공정(EM 공정), 표면에 조도를 부여하고 내열, 방청성 등을 부여하는 공정(TM공정), 절단하는 공정(SM공정)으로 이루어진다. 동박의 저조도화를 위해서는 EM 및 TM공정의 첨가제 개발 및 저조도 도금 공정 개발이 필요하다. 박형화를 위해서는 얇은 두께에서도 핸들링이 가능하도록 동박의 강도를 높이거나 제조공정을 개선하는 연구가 필요하다. 본 발표에서는 이러한 전해동박의 제조공정을 소개하고 협피치화 대응을 비롯한 전해동박의 개발 방향에 대해서 소개하고자 한다.

• Journal of Korea Multimedia Society
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• v.24 no.7
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• pp.868-879
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• 2021

PCB (Printed Circuit Board) inspection using a deep learning model requires a large amount of data and storage. When the amount of stored data increases, problems such as learning time and insufficient storage space occur. In this study, the existing object detection model is changed to a continual learning model to enable the recognition and classification of PCB components that are constantly increasing. By changing the structure of the object detection model to a knowledge distillation model, we propose a method that allows knowledge distillation of information on existing classified parts while simultaneously learning information on new components. In classification scenario, the transfer learning model result is 75.9%, and the continual learning model proposed in this study shows 90.7%.