• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.524-525
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• 2005

The principal problems in development of dielectric paste materials for PDP(plasma display panel)are PbO free paste and low melting temperature. We prepared PbO free paste from glasses in the system $ZnO-B_2O_3-Bi_2O_3-SiO_2$, DTA, and XRD were used to characterize $ZnO-B_2O_3-Bi_2O_3-SiO$ glasses. In this present study, PbO free paste had thermal expansion of $74\times10^{-7}/^{\circ}C$, DTA transformation point of $470^{\circ}C$, and firing condition of $540^{\circ}C$, 20min.

• Journal of Korean Society of Environmental Engineers
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• v.30 no.4
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• pp.446-452
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• 2008

This study was conducted to research the biosorption characteristics using algae, Spirulina platensis, for the removal of Pb and Cu ions in wastewater. Both of free algal cell and immobilized algae by Ca-alginate were used as bioadsorbent, and experiment was proceed in batch reactor for Pb and Cu ions removal, respectively. In the biosorption of Pb and Cu ions by free Spirulina platensis cell, the adsorption equilibrium reached within 20 minute. The higher adsorbed amount of Pb and Cu was shown as increasing of initial concentration of Pb and Cu, and pH of solution, respectively, and the optimum pH was 4.5$\sim$5.0. Under the conditions of initial concentration of Pb or Cu are 200 mg/L, the maximum amounts of Pb and Cu adsorbed to the unit weight of Spirulina platensis were 86.43 and 57.02 mg/g, respectively, and these values were 1.94 and 1.48 times higher than those of activated carbon under same conditions, respectively. The biosorption kinetics of Pb and Cu ions by free Spirulina platensis cell fitted very well to the Freundlich and Langmuir isotherm. The maximum amount of Pb or Cu adsorbed to the unit mass of adsorbent by the Langmuir isotherm($q_{max}$) represented as 95.24 and 62.50 mg/g, respectively. The FT-IR results of free Spirulina platensis biomass showed that biomass has different functional groups and these functional groups are able to react with metal ions in aqueous solution. In the biosorption of Pb and Cu ions by Ca-alginate immobilized algae Spirulina platensis, the adsorption equilibrium reached within 40 min. and observed a little diffusion limitation differed from the free algal cell adsorption.

• Journal of the Korean institute of surface engineering
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• v.35 no.4
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• pp.218-231
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• 2002

As the environmental regulation worldwide emerges, most notably in Europe and Japan, the elimination of Pb usage in electronic assemblies has been an important issue for microelectronics assembly due to the inherent toxicity of Pb. This has provided an impetus towards the development of Pb-free solders. A major factor affecting alloy selection is the melting point, since this will have a major impact on the other polymeric materials used in microelectronic assembly and encapsulation. Other important manufacturing issues are cost, availability, and wetting characteristics. Reliability related properties include mechanical strength, fatigue resistance, coefficient of thermal expansion and reactivity with substrate. In this article, Pb-free solder alloys have been proposed so far have been reviewed and are summarized.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.2
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• pp.25-30
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• 2018

Sn-Pb solder has been used in automotive electronics for decades. However, recently, due to the environmental and health concerns, some international environmental organizations such as the end-of-life vehicle (ELV) enacted legislation banning of the Pb usage in automotive electronics. For this reason, many studies to develop and promote Pb-free soldering have been significantly reported. Meanwhile, because of flexibility and lightweight, flexible printed circuit boards (FPCBs) have been increasingly used in automotive electronics for lightweight to improve fuel efficiency and space utilization. Although the properties of lead-free solders for automotive electronics have been widely studied, there is a lack of research on the reliability performance of the lead-free solder joint on FPCB under user conditions. This study reported the properties of solder joints between Pb-free solders such as Sn3.0Ag0.5Cu, Sn0.7Cu and Sn0.5Cu0.01Al (Si), and various FPCBs finished with organic solderability preservative (OSP) and electroless nickel immersion gold (ENIG). To evaluate on joint properties and reliabilities with different solder compositions and surface-finishing materials, pull strength test, thermal shock test, and bending cycle test were performed and analyzed. After the bending cycle test of solder joint on OSP-finishing, the fractures were occurred in solder and the lifetime of Sn3.0Ag0.5Cu solder joint was the longest.

• Proceedings of the KWS Conference
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• 1999.10a
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• pp.251-254
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• 1999

• Proceedings of the KWS Conference
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• 1999.05a
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• pp.61-62
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• 1999

• Journal of Welding and Joining
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• v.20 no.3
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• pp.31-36
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• 2002

• Transactions of the Korean Society of Mechanical Engineers A
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• v.40 no.3
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• pp.259-265
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• 2016

Recently, life prediction models for Pb-based and Pb-free solders used in chip resistor assemblies under thermal cycling have been introduced. The models suggest that the field lifetimes of Pb-free solders would be better than those of Pb-based solders when used for chip resistors under thermal cycling conditions, while the lifetime of the chip assemblies under accelerated test conditions show a reverse relationship. In this study, the prediction models were verified by applying the model to another research case. Finite element models were built, thermal cycling conditions were applied, and the energy densities were calculated. Finally, life prediction analysis was conducted for the cases where Pb-based and Pb-free solders were used. The prediction results were then compared with the test data of the case. It was verified that the predictions of the developed life cycle models are on the practical scale.

• Transactions of the Korean Society of Automotive Engineers
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• v.21 no.1
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• pp.145-153
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• 2013

In this study, shear punch-creep (SP-Creep) at Sn-4Ag/Cu pad the joint was tested by using environment-friendly Pb-free solder alloy Sn-4Ag of electronic components. Pb eutectic alloy (Sn-37Pb) joints limited to environmental issues with reflow time (10sec, 30sec, 100sec, 300sec) according to two types of solder alloy joints are compared and evaluated by creep strain rate, rupture time and IMC (Intermetallic Compound) behavior. As the results, reflow time increases with increasing thickness of IMC can be seen at overall 100sec later in case of two solder joints on the IMC thickness of Sn-4Ag solder joints thicker than Sn-37Pb solder joints. In addition, when considering creep evaluation factors, lead-free solder alloy Sn-4Ag has excellent creep resistance more than Pb eutectic alloy. For this reason, the two solder joints, such as in the IMC (Cu6Sn5) was formed. However, the creep resistance of Sn-4Ag solder joints was largely increased in the precipitation strengthening effect of dispersed Ag3Sn with interface more than Sn-37Pb solder joints.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.39 no.5
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• pp.467-471
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• 2015

Thus far, solders used in electronics remain lead-based. Pb-free solutions in electronic components and systems are receiving increased attention in the semiconductor and electronics industries. Pb-free materials currently in used are Sn-37Pb, Sn-4Ag and Sn-4Ag-0.5Cu/Ni plate joints. In this study, solder alloys were used at high temperatures for artificial aging processing that was performed at $150^{\circ}C$ for 0hr, 100hr, 200hr, 400hr, 600hr and 1000hr. The SP test was conducted at $30^{\circ}C$ and $50^{\circ}C$. As a result, the maximum shear strength of all the specimens decreased with the increase in artificial aging time and temperature of the SP test. In addition, Pb-free solders showed higher total fracture energy compared with Sn-37Pb at high temperatures. The mechanical properties of Sn-4Ag-0.5Cu solder/Ni plate joints remained in excellent conditions in electronic parking systems at high temperatures.