• 마이크로전자및패키징학회지
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• 제12권1호
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• pp.47-52
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• 2005

전세계 전자패키지 산업에서 납(Pb) 사용에 대한 환경규제 움직임이 본격화되고 있어 새로운 무연솔더의 개발이 활발히 이루어지고 있다. 게다가 무연솔더의 신뢰성에 대한정보가 아직까지 많이 부족한 실정이다 무연솔더의 신뢰성에 영향을 줄수 있는 것 중의 하나가 Sn pest라고 알려진 동소체 변태이다. Sn pest가 형성될 때 동반되는 부피의 증가는 솔더 조인트의 신뢰성을 저하시킨다. 이미 보고된 바에 따르면, Sn 고용도가 있는 원소(Pb, Bi, Sb)들을 첨가시킬 경우 Sn pest가 효과적으로 억제된다. 그러나 Sn pest를 억제하는 합금에 대한 기계적인 특성에 연구가 거의 이루어지지 않았다. 본 연구에서는 Sn과 Sn-0.7Cu를 기반으로 하여 Bi, Sb을 첨가한 솔더 합금을 사용하여 lap shear크리프 실험을 하였다. 본 연구에서 사용한 합금들의 변형율은 전체적으로 Sn-3.5Ag를 기반으로 하는 합금들보다 높았다. 파괴까지 이르는 변형량은 Sn-0.5Bi가 가장 크고 Sn-0.7Cu-0.5Sb 합금이 가장 작았는데 이러한 경향은 Sn-0.5Bi 합금의 파단면에 Sn globules이 길게 늘어나 있고 Sn-0.7Cu-0.5Sb 합금에서는 더 짧은 Sn globules 이 관찰되는 결과와 일치하였다.

• 한국초전도ㆍ저온공학회논문지
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• 제16권4호
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• pp.36-39
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• 2014

We report on the superconducting and structural characteristics of Pb-based alloy ($Pb_{0.9}In_{0.1}$, $Pb_{0.8}In_{0.2}$ and $Pb_{0.85}Bi_{0.15}$) thin films, depending on the film deposition rate. The maximum critical magnetic field strength of $Pb_{0.85}Bi_{0.15}$ is almost six times larger than that of $Pb_{0.9}In_{0.1}$, and more rapid growth of the film enhances the critical magnetic field strength even for the same alloy material. Scanning electron microscopy inspection indicates that lower deposition rate condition is vulnerable to the formation of void structure in the film. Topographic images using atomic force microscopy are useful to optimize the deposition condition for the growth of smooth superconducting film. Our work can be utilized for future studies on hybrid superconducting devices using low-dimensional nanostructures.

• Applied Science and Convergence Technology
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• 제23권6호
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• pp.345-350
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• 2014

The surface oxidation mechanism of lead-free solder alloys has been investigated with multiple reflow using X-ray photoelectron spectroscopy. It was found that the solder surface of Sn-Ag-Cu-In solder alloy is surrounded by a thin $InO_x$ layer after reflow process; this coating protects the metallic surface from thermal oxidation. Based on this result, we have performed a wetting balance test at various temperatures. The Sn-Ag-Cu-In solder alloy shows characteristics of both thermal oxidation and wetting balance better than those of Sn-Ag-Cu solder alloy. Therefore, Sn-Ag-Cu-In solder alloy is a good candidate to solve the two problems of easy oxidation and low wettability, which are the most critical problems of Pb-free solders.

• 한국주조공학회지
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• 제22권6호
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• pp.304-308
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• 2002

The new Cu-Zr-Ti-Ni-Pd amorphous alloy system has been introduced and manufactured using melt-spinning and Cu-mold die casting methods. Amorphous formability, the supercooled liquid region before crystallization and mechanical properties of the alloys were examined. The reduced glass transition temperature(Trg = Tg/Tm) and the supercooled liquid region(${\Delta}$Tx = Tx-Tg) of $Cu_{49}Zr_{30}Ti_{10}Ni_5Pb_6$ alloy were 0.620 and 57 K respectively. $Cu_{49}Zr_{30}Ti_{10}Ni_5Pb_6$ amorphous alloy was produced in the rod shape with 2mm diameter using the Cu-mold die casting. The hardness value of the amorphous bulk alloy was 432 DPN.

• 한국주조공학회지
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• 제24권1호
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• pp.40-44
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• 2004

The influence of Pd and Ag additions on the thermal stability, the glass forming ability (GFA) and mechanical property of $Zr_{55}Al_{10}Cu_{20}Ni_{10}Pb_{(5-x)}Ag_x$ (x = $0{\sim}5at%$) alloys obtained by melt spun and injection casting method have been investigated by using of X-ray diffraction, thermal analysis (DTA, DSC) and micro-Vickers hardness(Hv) testing. The thermal properties of melt-spun $Zr_{55}Al_{10}Cu_{20}Ni_{10}Pb_{(5-x)}Ag_x$ (x = $0{\sim}5at%$) alloys exhibit a supercooled liquid region(${\Delta}T_x$) exceeding 91 K before crystallization. The largest ${\Delta}T_x$ reaches as large as 126 K for the $Zr_{55}Al_{10}Cu_{20}Ni_{10}Pb_5$ alloy. The reduced glass transition temperature, $T_{rg}$ increased with increasing Ag content. The largest $T_{rg}$ is obtained for the $Zr_{55}Al_{10}Cu_{10}Ni_{10}Ag_5$ alloy. The $Zr_{55}Al_{10}Cu_{10}Ni_{10}Ag_5$ bulk amorphous alloy rod with 3 mm in diameter was fabricated by injection casting. Hv increased with increasing Ag content and the largest value was obtained for the $Zr_{55}Al_{10}Cu_{10}Ni_{10}Ag_5$ bulk amorphous alloy.

• 한국전기전자재료학회논문지
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• 제24권7호
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• pp.599-604
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• 2011

A highly strained nanostructure comprising crystallographically aligned HgTe nanoinclusions and a surrounding PbTe matrix has been synthesized using a precipitation process of supersaturated HgTe-PbTe alloys. From the early precipitation stage, HgTe nanoinclusions take disk shape, which is transformed from initial HgTe nuclei, although there is no lattice constant difference of the two end components at standard state. As a primary reason for the morphological transformation of the initial spherical HgTe nuclei to HgTe nanodisks, the induced lattice mismatch is suggested. On the condition that the HgTe nanodisks maintain perfect coherent nature with PbTe matrix, the stress-free lattice constant of constrained HgTe nanodisks has been calculated based on the defined concept of the strain-induced tetragonality, the linear elasticity and the actual measurement in HRTEM images.

• 한국재료학회지
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• 제5권2호
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• pp.251-258
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• 1995

$Bi_{2}Te_{3}$와 PbTe의 혼합물에서 $Bi_{2}Te_{3}-PbBi_{4}Te_{7}$의 공정조직이 형성됨을 이용, 제2상의 미세조직 제어로 열전도도의 감소에 따른 성능지수 향상을 목적하여 여러 조건에서 제조된 n-type(Bi, Pb)-Te계 공정조성 일방향 응고재의 열전특성을 조사하였다. 일방향응고시 공정상 PbBi_{4}Te_{7}$이 $Bi_{2}Te_{3}$의 벽개면(0001)을 따라 lamellar 형태로 성장하였으며, 성장속도가 1.4 \times 10^{-4}$cm/sec에서 $8.3 \times 10^{-4}$cm/sec로 증가됨에 따라 4PbBi_[4]Te_{7}$의 상간격은 10.4 $\mu \textrm{m}$에서 3.2$\mu \textrm{m}$로 감소되었다. Seeback계수는 성장방향 및 성장속도와 온도구배에는 관계없이 약 $\mid$$\alpha$$\mid$=29 $\mu$ V/K일정하였다. 전기전도도는 성장속도에 따라 약간 감소하는 경향을 보였고 성장방향에 평행한 경우가 수직한 경우보다 약 3배 정도 컸다. 성능지수는 성장방향과 성장속도 및 온도구배에 따라 약간씩 변화를 보였다. 수직한 경우가 평행한 경우에 비해 상대적으로 증가하는 경향을 나타내었는데 이는 lamellar 간격이 줄어듦에 따른 열전도도의 감속에서 비롯된 것으로 분석되었다.

• 한국전기전자재료학회논문지
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• 제30권7호
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• pp.454-458
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• 2017

$Bi_2Te_3$-based alloys have been intensively investigated as active materials for thermoelectric power generation devices from low-temperature (< $250^{\circ}C$) waste heat. In the present study, we fabricated Pb-doped, p-type $Bi_{0.48}Sb_{1.52}Te_3$ polycrystalline bulks by using meltsolidification and spark plasma sintering techniques, and evaluated their thermoelectric transport properties in an effort to develop optimized composition for low-temperature power generation applications. The electronic and thermal transport properties of $Bi_{0.48}Sb_{1.52}Te_3$ could be manipulated by Pb doping. As a result, the temperature for a peak thermoelectric performance (zT) gradually shifted toward higher temperatures with Pb content, suggesting that thermoelectric power generation efficiency can be enhanced by controlled Pb doping.

• Journal of Welding and Joining
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• 제32권3호
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• pp.74-80
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• 2014

Due to environmental regulations (RoHS, WEEE and ELV) of the European Union, electronics and automotive electronics have to eliminate toxic substance from their devices and system. Especially, reliability issue of lead-free solder joint is increasing in car electronics due to ELV (End-of-Life Vehicle) banning from 2016. We have prepared engine control unit (ECU) modules soldered with Sn-40Pb and Sn-3.0Ag-0.5Cu (SAC305) solders, respectively. Degradation characteristics of solder joint strength were compared with various conditions of automobile environment such as cabin and engine room. Thermal cycle test (TC, $-40^{\circ}C$ ~ ($85^{\circ}C$ and $125^{\circ}C$), 1500 cycles) were conducted with automotive company standard. To compare shear strength degradation rate with eutectic and Pb-free solder alloy, we measured shear strength of chip components and its size from cabin and engine ECU modules. Based on the TC test results, finally, we have known the difference of degradation level with solder alloys and use environmental conditions. Solder joints degradation rate of engine room ECU is superior to cabin ECU due to large CTE (coefficient of thermal expansion) mismatch in field condition. Degradation rate of engine room ECU is 50~60% larger than cabin room electronics.

• 대한기계학회논문집A
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• 제39권5호
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• pp.467-471
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• 2015

최근까지, 전자제품에 사용되는 솔더는 납성분이 남아 있으며, 전자부품 및 시스템의 무연 (Pb-free) 솔더에 대한 관심은 반도체 및 전자산업에서 증가하고 있다. 본 논문에서 사용된 솔더접합부는 Sn-37Pb, Sn-4Ag 및 Sn-4Ag-0.5Cu/Ni 기판 이다. 인공시효처리는 $150^{\circ}C$에서 각각 0hr, 100hr, 200hr, 400hr, 600hr 그리고 1000hr 동안 수행되었으며, SP 시험을 이용해 $30^{\circ}C$와 $50^{\circ}C$에서 접합강도를 평가했다. 전단강도는 인공시효시간과 온도가 증가함에 따라 전반적으로 감소하였다. 무연솔더는 Sn-37Pb 보다 총파괴 에너지가 높았으며, Sn-4Ag-0.5Cu/Ni 접합부는 고온에서 기계적 물성치가 가장 우수하였다.