• Title/Summary/Keyword: Pattern-chip

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The Development of Hot Carrier Immunity Device in NMOSFET's (NMOSFET에서 핫-캐리어 내성의 소자 개발)

  • ;;;;Fadul Ahmed Mohammed
    • Proceedings of the IEEK Conference
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    • 2002.06b
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    • pp.365-368
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    • 2002
  • WSW(Wrap Side Wall) is proposed to decrease junction electric field in this paper. WSW process is fabricated after first gate etch, followed NMI ion implantation and deposition & etch nitride layer New WSW structure has buffer layer to decrease electric field. Also we compared the hot carrier characteristics of WSW and conventional. Also, we design a test pattern including pulse generator, level shifter and frequency divider, so that we can evaluate AC hot carrier degradation on-chip.

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다층퍼셉트론을 이용한 절삭칩 형상과 채터검출에 관한 연구

  • 박동삼
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1992.10a
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    • pp.293-297
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    • 1992
  • For the computerized monitoring and diagnosis of the undesirable chip chatter which are major obstacles to FMS, a pattern recognition system based on multi-layer perception neural network is developed and the performance of the system is experimentally evaluated. Experimental results show that recognition of the two class state of normal or abnormal cutting gives satisfactory results with success rate of 81`91%. Therefore, the proposed system has possibility for use in monitoring and diagnosis of automatic manufacturing system

Analysis on Signal Transmission Specific property using Low Voltage Differential Signaling Interface Logic (LVDS(Low Voltage Differential Signaling) Interface Logic을 이용한 신호전달 특성 분석)

  • 김석환;최익서;허창우
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2002.11a
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    • pp.473-476
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    • 2002
  • 고도로 발달된 정보화 시대에서 우리가 원하는 정보를 짧은 시간, 적은 비용으로 서로 주고받기 위해서는 이것에 맞는 시스템이 요구된다. 반도체 chip의 대용량과 고속화됨으로써 TTL, LVTTL 등이 data 100Mbps 정도를 안전하게 전달 할 수 있는 능력이 있으므로 그 이상을 전달할 수 있는 새로운 Logic level이 필요하게 되었다. 이에 맞추어 신호 level의 여러 가지 중 본 논문에서는 Virtex II XC2V 1000 FF896을 이용하여 Differential I/O LVDS(Low Voltage Differential Signaling) level 특성을 clock, Data와의 전송 관계를 Eye_Pattern을 통해 살펴보았다.

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The Study on the Embedded Active Device for Ka-Band using the Component Embedding Process (부품 내장 공정을 이용한 5G용 내장형 능동소자에 관한 연구)

  • Jung, Jae-Woong;Park, Se-Hoon;Ryu, Jong-In
    • Journal of the Microelectronics and Packaging Society
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    • v.28 no.3
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    • pp.1-7
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    • 2021
  • In this paper, by embedding a bare-die chip-type drive amplifier into the PCB composed of ABF and FR-4, it implements an embedded active device that can be applied in 28 GHz band modules. The ABF has a dielectric constant of 3.2 and a dielectric loss of 0.016. The FR-4 where the drive amplifier is embedded has a dielectric constant of 3.5 and a dielectric loss of 0.02. The proposed embedded module is processed into two structures, and S-parameter properties are confirmed with measurements. The two process structures are an embedding structure of face-up and an embedding structure of face-down. The fabricated module is measured on a designed test board using Taconic's TLY-5A(dielectric constant : 2.17, dielectric loss : 0.0002). The PCB which embedded into the face-down expected better gain performance due to shorter interconnection-line from the RF pad of the Bear-die chip to the pattern of formed layer. But it is verified that the ground at the bottom of the bear-die chip is grounded Through via, resulting in an oscillation. On the other hand, the face-up structure has a stable gain characteristic of more than 10 dB from 25 GHz to 30 GHz, with a gain of 12.32 dB at the center frequency of 28 GHz. The output characteristics of module embedded into the face-up structure are measured using signal generator and spectrum analyzer. When the input power (Pin) of the signal generator was applied from -10 dBm to 20 dBm, the gain compression point (P1dB) of the embedded module was 20.38 dB. Ultimately, the bare-die chip used in this paper was verified through measurement that the oscillation is improved according to the grounding methods when embedding in a PCB. Thus, the module embedded into the face-up structure will be able to be properly used for communication modules in millimeter wave bands.

Clustering Red Wines Using a Miniature Spectrometer of Filter-Array with a Cypress RGB Light Source

  • Choi, Kyung-Mee
    • The Korean Journal of Applied Statistics
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    • v.23 no.1
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    • pp.179-187
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    • 2010
  • Miniature spectrometers can be applied for various purposes in wide areas. This paper shows how a wellmade spectrometer on-a-chip of a low performance and low-cost filter-array can be used for recognizing types of red wine. Light spectra are processed through a filter-array of a spectrometer after they have passed through the wine in the cuvettes. Without recovering the original target spectrum, pattern recognition methods are introduced to detect the types of wine. A wavelength cross-correlation turns out to be a good distance metric among spectra because it captures their simultaneous movements and it is affine invariant. Consequently, a well-designed spectrometer is reliability in terms of its repeatability.

Design of Deadbeat DSP Controlled PWM Inverter With Two-Level Switching Pattern

  • Choi Seong-Kwan;Park Hae-Won;Kim Soon-Young;Seok Won-Yeob;Jeon Hee-Jong
    • Proceedings of the KIPE Conference
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    • 2001.10a
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    • pp.151-154
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    • 2001
  • In this paper, a two-level switching algorithm of the deadbeat to control PWM inverter is proposed. A modified algorithm of the deadbeat is suitable for the UPS system. Two levels in the pulse pattern are used. This scheme allows the use of higher switching frequency for a given computation time delay, which results in lower total harmonic distortion at the output. The proposed control scheme is implemented using TMS320F240 DSP chip for controlling on inverter.

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Non-Destructive Evaluation of Semiconductor Package by Electronic Speckle Pattern Interferometry

  • Kim, Koung-Suk;Kang, Ki-Soo;Jung, Seung-Tack
    • Journal of Mechanical Science and Technology
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    • v.19 no.3
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    • pp.820-825
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    • 2005
  • This paper proposes non-destructive ESPI technique to evaluate inside defects of semiconductor package quantitatively. Inspection system consists of ESPI system, thermal loading system and adiabatic chamber. The technique has high feasibility in non-destructive testing of semiconductor and gives solutions to the drawbacks in previous technique, time-consuming and the difficulty of quantitative evaluation. In result, most of defects are classified in delamination, from which it is inferred to the insufficiency of adhesive strength between layers and nonhomogeneous heat spread. The $90\%$ of tested samples have a delamination defect started at the around of the chip which may be related to heat spread design.

3D Holographic Image Recognition by Using Graphic Processing Unit

  • Lee, Jeong-A;Moon, In-Kyu;Liu, Hailing;Yi, Faliu
    • Journal of the Optical Society of Korea
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    • v.15 no.3
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    • pp.264-271
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    • 2011
  • In this paper we examine and compare the computational speeds of three-dimensional (3D) object recognition by use of digital holography based on central unit processing (CPU) and graphic processing unit (GPU) computing. The holographic fringe pattern of a 3D object is obtained using an in-line interferometry setup. The Fourier matched filters are applied to the complex image reconstructed from the holographic fringe pattern using a GPU chip for real-time 3D object recognition. It is shown that the computational speed of the 3D object recognition using GPU computing is significantly faster than that of the CPU computing. To the best of our knowledge, this is the first report on comparisons of the calculation time of the 3D object recognition based on the digital holography with CPU vs GPU computing.

APPLICATION OF TIN ION-PLATING TO THE ORTHODONTIC APPLIANCE (교정용 장치물에 대한 TiN Ion Plating의 응용)

  • Kwon, Oh-Won;Kim, Kyo-Han
    • The korean journal of orthodontics
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    • v.21 no.1 s.33
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    • pp.7-16
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    • 1991
  • To estimate the possibility of the application of TiN ion-plating to the orthodontic appliance, colorimetric properties, and characteristics of ion-plated film as well as adhesive strength of TiN film to the substrate and mechanical properties of ion-plated orthodontic appliance were investigated. The obtained results were as follows: 1) TiN ion-plated film had the colorimetric properties which were the hue of about 2.5 Y, the brightness of about 6, and the chroma of about 4 by the standard color chip of JIS. 2) TiN ion-plated film was $2{\mu}m$ in thickness and its deposition pattern was rather irregular. 3) TiN phase was confirmed on the X-ray diffraction pattern. 4) Critical load for delamination of ion-plated film from stainless steel band was 10N. 5) Tensile and yield strength of ion-plated specimen was increased about 10Kg $f/mm^2$, while elongation was decreased $1\%$ compairing to the values of the non ion-plated specimen.

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A Study on the Selectivity of Gas Sensors by Sensing Pattern Recognition (감지 패턴 인식에 의한 가스센서의 선택성 연구)

  • Lee, Sung-Pil
    • Journal of Sensor Science and Technology
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    • v.20 no.6
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    • pp.428-433
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    • 2011
  • We report on the building of a micro sensor array based on typical semiconductor fabrication processes aimed at monitoring selectively a specific gas in ambient of other gases. Chemical sensors can be applied for an electronic nose and/or robots using this technique. Microsensor array was fabricated on the same chip using 0.6${\mu}m$ CMOS technology, and unique gas sensing patterns were obtained by principal component analysis from the array. $SnO_2$/Pt sensor for CO gas showed a high selectivity to buthane gas and humidity. $SnO_2$ sensor for hydrogen gas, however, showed a low selectivity to CO and buthane gas. We can obtain more distinguishable patterns that provide the small sensing deviation(the high seletivity) toward a given analyte in the response space than in the chemical space through the specific parameterization of raw data for chemical image formation.