• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2003년도 하계종합학술대회 논문집 Ⅳ
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• pp.2335-2338
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• 2003

This paper presents a real-time PCB (Printed Circuit Board) vision inspection system. This system can detect the OPEN and SHORT of the PCB which of the line width is 150$\mu\textrm{m}$. Our PCB inspection system is based on the referential method. Since the size of the captured PCB image is very large, the image is divided into 512${\times}$512 images to apply the accurate alignment efficiently. To correct the misalignment between the reference image and the inspection image, pattern matching is performed. In order to implement the proposed algorithm in real-time, we use the SIMD instruction and the double buffering structures. Our experiential results show the effectiveness of the developed inspection algorithm.

• 한국정밀공학회지
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• 제20권2호
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• pp.146-153
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• 2003

Ultrasonic inspection of defects has been focused on the existence of defect in structural material and need has much time and expenses in inspecting all the coordinates (x, y) on material surface. Neural networks can have an application to coordinates (x, y) of defects by multi-point inspection method. Ultrasonic inspection modeling is optimized by neural networks Neural networks has trained training example of absolute and relative coordinate of defects, and defect pattern. This method can predict coordinates (x, y) of defects within engineering estimated mean error $\psi$.

• 반도체디스플레이기술학회지
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• 제19권3호
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• pp.55-60
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• 2020

The hard mask photo-resist strip inspection system for the semiconductor wafer manufacturing process inspects the position of the circuit pattern formed on the wafer by measuring the distance from the edge of the wafer to the strip processing area. After that, it is an inspection system that enables you to check the process status in real time. Process defects can be significantly reduced by applying a tester that has not been applied to the existing wafer strip process, edge etching process, and wafer ashing process. In addition, it is a technology for localizing semiconductor process inspection equipment that can analyze the outer diameter of the wafer and the state of pattern formation, which can secure process stability and improve wafer edge yield.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2003년도 하계종합학술대회 논문집 Ⅳ
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• pp.1763-1766
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• 2003

This paper proposes a non-contact color inspection system for plasma display panel (PDP). The red, green, and blue test pattern images are acquired by using the area color CCD camera at the various distance from the PDP. The RGB values are obtained from the region of interest (ROI) which are extracted by applying the image processing to the test pattern image. Finally, the CIE xy and u'v' chromaticity coordinates of the test pattern images according to the distance are acquired from the RGB color coordinates.

• 한국멀티미디어학회논문지
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• 제22권2호
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• pp.117-127
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• 2019

Simultaneous pattern measurement system is new research subject for OLED panel inspection. It is defect inspection of OLED panel after deposition. This research suggests the system that calculates the size and center point of each patterns after obtaining standard and deposition pattern as one image. This system could be applied to OLED manufacturing process. The research result shows that the size and center point of each patterns could be obtained by displaying the standard pattern and deposition pattern in one image.

• 한국산업융합학회 논문집
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• 제18권4호
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• pp.241-249
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• 2015

The purpose of this research is to develop the pattern recognition algorithm based on smart camera for inspection automation, and including external surface state of molding parts or optical parts. By performance verification, this development can be applied to establish for existing reflex data because inputting surface badness degree of scratch's standard specification condition directly. And it is pdssible to distinguish from schedule error of badness product and normalcy product within schedule extent after calculating the error comparing actuality measurement reflex data and standard reflex data mutually. The proposed technology cab be applied to test for masearing of the smallest 10 pixel unit. It is illustrated the relibility pf proposed technology by an experiment.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2005년도 ICCAS
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• pp.963-968
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• 2005

For worm robots applied to pipe inspection and colonoscopy, earthworm-like robots that have a locomotion pattern in backward wave or green caterpillar-like robots that have a locomotion pattern in forward wave have been studied widely. Note however that a method using a single and fixed locomotion pattern is not desirable in the sense of mobility cost, if there are various changes in pipe diameter. In this paper, locomotion patterns are considered for a semi-looper-like robot, which adopts a locomotion pattern of green caterpillars as the basic motion and sometimes can realize a locomotion pattern of looper, whose motion approximately consists of two rhythms or relatively low rhythm.

• International Journal of Precision Engineering and Manufacturing
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• 제1권1호
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• pp.56-61
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• 2000

We present a fast inspection method of machine vision for in-line quality assurance of liquid crystal displays(LCD) and plasma display panels(PDP). The method incorporates an optical spatial filter in the Fourier plane of the imaging optics to block the normal periodic pattern, extracting only defects real time without relying on intensive software image process. Special emphasis is on designing a collimated white light source to provide high degree of spatial coherence for effective real time Fourier transform. At the same time, a low level of temporal coherence is attained to improve defect detection capabilities by avoiding undesirable coherent noises. Experimental results show that the proposed inspection method offers a detection accuracy of 15% tolerance, which is sufficient for industrial applications.

• 한국광학회:학술대회논문집
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• 한국광학회 2006년도 하계학술발표회 논문집
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• pp.469-471
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• 2006

This paper describes a efficient insepction method of PCB PADs for AFVI. The methods for PCB inspection have been tried to detect the defects in PCB PADs, but their low detection rate results from pattern variations that are originating from etching, printing and handling processes. The adaptive inspection method has been newly proposed to extract minute defects based on dynamic segments and filters. The vertexes are extracted from CAM master images of PCB and then a lot of segments are constructed in master data. The proposed method moves these segments to optimal directions of a PAD contour and so adaptively matches segments to PAD contours of inspected images, irrespectively of various pattern variations. It makes a fast, accurate and reliable inspection of PCB patterns. Experimental results show that proposed methods are found to be effective for flexible defects detection.

• 대한한의학회지
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• 제20권2호
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• pp.187-197
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• 1999

To assess the usefulness of tongue inspection for evaluating the Pattern identification in oriental medicine, we observed stroke patient's tongue and tongue coat and compared it with Pattern identification. The test group was composed of 85 acute stroke stage patients(within 72 hours of onset). Subjects were randomly selected from stroke patients admitted in the KyungHee University, Hospital of Oriental Medicine from December 1 1998 to June 30 1999. We took pictures of patient's tongue and tongue coat within 72hours from onset and checked Pattern identification at the same time. Tongues colored pale rose or red greatly outnumbered other colors. Tongue shape tended to be prickly or fissured, and tongue condition tended to be unflexible or deviated. Regarding tongue coat color, there were great amounts of yellow or clark yellow tongue coats, which were moist, thick or greasy in substance. The red tongue was significantly related to Fire-heat and deficiency of Yin syndrome, while faint white tongue to Damp syndrome(P=0.006). In terms of tongue coat, thin coat was related to Wind and Fire-heat syndromes, thick coat to Damp and Blood stasis syndrome, respectively (P=0.002). In conclusion, we thought that tongue inspection could be a useful Oriental medicine diagnosis in stroke.