• 디지털산업정보학회논문지
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• 제15권4호
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• pp.63-70
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• 2019

The subject of the simultaneous measuring system of base pattern and deposition pattern is a new research topic on a defect inspection of OLED. In this paper, we propose a new OLED inspection method that simultaneously measures standard and deposition pattern images. This method reduces unnecessary processes and tac time during OLED inspection. For an additional reduction of the tac time during pattern measurement, the ROI was configured to measure only in the designated ROI area instead of measuring the entire area of an image. During the ROI set-up, the value of effective deposition pattern area is included so that if the deposition pattern is out of the ROI zone, it would be treated as a defect before measuring the size and center point of the pattern. As a result, the tac time and inspection process could be shortened. The proposed method also could be applied to the OLED manufacturing process. Production of OLED could be increased by reducing tac time and inspection process.

• 제어로봇시스템학회논문지
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• 제10권1호
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• pp.54-59
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• 2004

We suggest a 3D vision inspection algorithm which is based on the external shape feature. Because many electronic parts have the regular shape, if we have the database of pattern and can recognize the object using the database of the object s pattern, we can inspect many types of electronic parts. Our proposed algorithm uses the geometrical pattern matching method and 3D database on the electronic parts. We applied our suggested algorithm fer inspecting several objects including typical IC and capacitor. Through the experiments, we could find that our suggested algorithm is more effective and more robust to the inspection environment(rotation angle, light source, etc.) than conventional 2D inspection methods. We also compared our suggested algorithm with the feature space trajectory method.

• 한국정밀공학회지
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• 제23권3호
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• pp.102-109
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• 2006

Several methods for PCB pattern inspection have been tried to detect fine detects in pad contours, but their low detection accuracy results from pattern variations originating from etching, printing and handling processes. The adaptive inspection algorithm has been newly proposed to extract minute defects based on movable segments. With gerber master images of PCB, vertex extractions of a pad boundary are made and then a lot of segments are constructed in master data. The pad boundary is composed of segment units. The proposed method moves these segments to optimal directions of a pad boundary and so adaptively matches segments to pad contours of inspected images, irrespectively of various pattern variations. It makes a fast, accurate and reliable inspection of PCB patterns. Its performances are also evaluated with several images.

• 제어로봇시스템학회논문지
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• 제14권5호
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• pp.444-452
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• 2008

This paper presents an overall image processing approach of defect inspection of patterned TFT-LCD panels for the real manufacturing process. A prototype of AOI(Automatic Optical Inspection) system which is composed of air floating stage and multi line scan cameras is developed. Adjacent pattern comparison algorithm is enhanced and used for pattern elimination to extract defects in the patterned image of TFT-LCD panels. New region merging algorithm which is based on border expansion is proposed to identify defects from the pattern eliminated defect image. Experimental results show that a developed AOI system has acceptable performance and the proposed algorithm reduces environmental effects and processing time effectively for applying to the real manufacturing process.

• 한국생산제조학회지
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• 제20권5호
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• pp.666-672
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• 2011

In this paper, we describes the development of automatic inspection system for detecting the defects on photovoltaic wafer by using machine vision. Until now, The defect inspection process was manually performed by operators. So these processes caused the produce of poorly-made articles and inaccuracy results. To improve the inspection accuracy, the inspection system is not only configured, but the image processing algorithm is also developed. The inspection system includes dimensional verification and pattern matching which compares a 2-D image of an object to a pattern image the method proves to be computationally efficient and accurate for real time application and we confirmed the applicability of the proposed method though the experience in a complex environment.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2003년도 하계종합학술대회 논문집 V
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• pp.2533-2536
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• 2003

In this paper, we suggest the 3D Vision Inspection Algorithm which is based on the external shape feature, and is able to recognize the object. Because many objects made by human have the regular shape, if we posses the database of pattern and we recognize the object using the database of the object's pattern, we could inspect the objects of many fields. Thus, this paper suggest the 3D Vision inspection Algorithm using the Geometrical Pattern Matching by making the 3D database.

• 산업기술연구
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• 제21권B호
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• pp.67-74
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• 2001

According as the patterns of PCB (Printed Circuit Board) become denser and complicated, quality and accuracy of PCB influence the performance of final product. It's attempted to obtain trust of 100% about all of parts. Because human inspection in mass-production manufacturing facilities are both time-consuming and very expensive, the automation of visual inspection has been attempted for many years. Thus, automatic visual inspection of PCB is required. In this paper, we used an algorithm which compares the reference PCB patterns and the input PCB patterns are separated an object and a scene by filtering and edge detection. And than compare two image using pattern matching algorithm. We suggest an defect inspection algorithm in PCB pattern, to be satisfied low cost, high speed, high performance and flexibility on the basis of $640{\times}480$ binary pattern.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2004년도 ICCAS
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• pp.126-131
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• 2004

The popularity of flat-panel display(FPD), including plasma display panel(PDP) and liquid-crystal display(LCD), has given rise to the need to streamline their production. In these days, PDP is one of the most popular display devices because of its expansion of manufacturing process and simplicity. Bus electrodes, sustain electrodes, barrier ribs and RGB phosphors are patterned on PDP panel to display an image. Since a minute damage on the pattern can cause a serious defect to display, it is important to inspect the pattern precisely. In this paper, an automatic inspection system of repeated pattern in PDP panel has been introduced to find the defect, such as open, short, dirt, island, and so on. And the inspection system has been operated in the mass production line of PDP.

• 한국산학기술학회논문지
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• 제21권6호
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• pp.640-645
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• 2020

전자기 유도 방식의 투명 전자 패턴을 이용한 입력장치의 안정적 생산을 위해서는 생산 공정에서 미리 패턴 검사가 필요한 실정이다. 손터치용 정전용량 패턴의 검사 방법은 다양하게 제시 되어왔으나, 투명 전자기 유도 방식의 패턴 검사방법은 관련 기술 자료를 찾기 힘든 실정이다. 본 연구에서는 메탈 메쉬형 패턴으로 제작된 융합형 전자기유도 센서의 검사방법을 개발하기 위하여, 측정 센서에서 노출된 FPCB 커넥터 부분만의 측정으로 센서 내부의 안테나 임피던스를 측정하기 위한 새로운 측정알고리즘과 측정 방법을 제안하였다. 제안된 검사방법은 자체 개발된 윈도우 운영프로그램으로 제어되는 컴퓨터의 명령에 따라 미리 설정된 특정 채널 간의 루프를 형성하는 마이크로프로세서로 구성된 제어 보드, 특정 채널 간의 임피던스를 고정밀도로 측정하는 LCR 메터 그리고 측정결과를 컴퓨터로 전송하는 통신 시스템으로 구성하였다. 제안된 시스템을 설계 제작하여 자동으로 설정된 채널 간의 측정을 수행하였으며, 9개의 시편에 대하여 임피던스를 실제 측정한 결과와 제안된 시스템으로 측정한 결과, 실제 제품에 사용되는 센서의 기능 불량을 검출할 수 있는 성능을 보임을 알 수 있었다.

• 반도체디스플레이기술학회지
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• 제2권4호
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• pp.1-7
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• 2003

In this paper, we design the pattern generator circuits using PLDs(Programmable Logic Devices). The pattern generator is the circuit which generates the test pattern signal for the inspection of logical defects of semiconductor products. The proposed circuits are designed by the PLD design tool(MAX+ II of ALTERA). Also the designed circuits are simulated for the verification of the designed ones. The simulation results have a good performance.