• 제목/요약/키워드: Passives devices

검색결과 15건 처리시간 0.02초

3차원 매립형 수동소자의 특성 예측 및 분석에 대한 연구 (Characteristic Prediction and Analysis of 3-D Embedded Passive Devices)

  • 신동욱;오창훈;이규복;김종규;윤일구
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.2
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    • pp.607-610
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    • 2003
  • The characteristic prediction and analysis of 3-dimensional (3-D) solenoid-type embedded inductors is investigated. The four different structures of 3-D inductor are fabricated by using low-temperature cofired ceramic (LTCC) process. The circuit model parameters of the each building block are optimized and extracted using the partial element equivalent circuit method and HSPICE circuit simulator. Based on the model parameters, predictive modeling is applied for the structures composed of the combination of the modeled building blocks. And the characteristics of test structures, such as self-resonant frequency, inductance and Q-factor, are analyzed. This approach can provide the characteristic conception of 3-D solenoid embedded inductors for structural variations.

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세라믹 적층형 스위치 모듈 설계에 관한 연구 (A study on the design of switch module for devices)

  • 김인성;송재성;민복기
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2004년도 추계학술대회 논문집 Vol.17
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    • pp.431-434
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    • 2004
  • The design, simulation, modeling and measurement of a RF switch module for GSM applications were presented in this paper. switch module were simulated by ADS and constructed using a LTCC multi-layer switching circuit and integrated low pass filter, designed to operate in the GSM band. Insertion and return losses at 900 MHz of the low pass filters were designed to lower than 0.3 dB and higher than 12.7 dB respectively. The switch module constructed, contained 10 embedded passives and 3 surface mounted components integrated on $4.6{\times}4.8{\times}1.2$ m volume, 6-layer integrated circuit. The insertion loss of switch module at m MHz were around 11 dB.

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Semi-lumped Balun Transformer using Coupled LC Resonators

  • Park, Jongcheol;Yoon, Minkyu;Park, Jae Yeong
    • Journal of Electrical Engineering and Technology
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    • 제10권3호
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    • pp.1154-1161
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    • 2015
  • This paper presents a semi-lumped balun transformer using conventional PCB process and its design theory and geometry for the maximally flat response and wide bandwidth using magnetically coupled LC resonators. The proposed balun is comprised of two pairs of coupled resonators which share one among three LC resonators. It provides an identical magnitude and phase difference of 180° between two balanced ports with DC isolation and an impedance transformation characteristic. Theoretical design and analysis were performed to optimize the inductance and capacitance values of proposed balun device for obtaining the wide bandwidth and maximally flat response in its pass-band. Three balun transformers with a center frequency of 500 MHz were demonstrated for proving the concept of design proposed. They were fabricated by using lumped chip capacitors and planar inductors embedded into a conventional 4-layered PCB substrate. They exhibited a maximum magnitude difference of 0.8 dB and phase difference within 2.4 degrees.

Circuit Modeling of Interdigitated Capacitors Fabricated by High-K LTCC Sheets

  • Kim, Kil-Han;Ahn, Min-Su;Kang, Jung-Han;Yun, Il-Gu
    • ETRI Journal
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    • 제28권2호
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    • pp.182-190
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    • 2006
  • The circuit modeling of interdigitated capacitors fabricated by high-k low-temperature co-fired ceramic (LTCC) sheets was investigated. The s-parameters of each test structure were measured from 50 MHz to 10 GHz, and the modeling was performed using these measured sparameters up to the first resonant frequency. Each test structure was divided into appropriate building blocks. The equivalent circuit of each building block was composed based on the partial element equivalent circuit (PEEC) method. Modeling was executed to optimize the parameters in the equivalent circuit of each building block. The validity of the extracted parameters was verified by the predictive modeling for the test structures with different geometry. After that, Monte Carlo analysis and sensitivity analysis were performed based on the extracted parameters. The modeling methodology can allow a device designer to improve the yield and to save time and cost for the design and manufacturing of devices.

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Chip-in-Board 패키지의 열전달 해석 (Numerical Simulation of Heat Transfer in Chip-in-Board Package)

  • 박준형;심희수;김선경
    • 대한기계학회논문집B
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    • 제37권1호
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    • pp.75-79
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    • 2013
  • 반도체 수요의 폭발적인 증가와 기술의 진보로 단위면적당 소자수가 늘어나고 있다. 그에 따라 단위면적당 발열량이 더욱 높아져서 반도체의 수명과 신뢰성 보장을 위한 냉각문제의 해결이 점점 중요해지고 있다. 특히, 집적도를 높이기 위해 소자를 기판에 매립하는 chip-in-board (CIB) 패키지에서는 방열이 더욱 심각한 문제가 된다. 본 논문에서는 각기 다른 재질의 층으로 구성된 열 전달모형을 설정하고, 3 차원 열 전달 해석으로 적절한 경계 조건에 맞추어 계산하였다. 이를 토대로 발열량을 정량적으로 예측하여 실제모델에 적용 될 수 있는 설계자료로 이용하고자 한다.