• Title/Summary/Keyword: Passive devices

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Functionally upgraded passive devices for seismic response reduction

  • Chen, Genda;Lu, Lyan-Ywan
    • Smart Structures and Systems
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    • v.4 no.6
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    • pp.741-757
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    • 2008
  • The research field of structural control has evolved from the development of passive devices since 1970s, through the intensive investigation on active systems in 1980s, to the recent studies of semi-active control systems in 1990s. Currently semi-active control is considered most promising in civil engineering applications. However, actual implementation of semi-active devices is still limited due mainly to their system maintenance and associated long-term reliability as a result of power requirement. In this paper, the concept of functionally upgraded passive devices is introduced to streamline some of the state-of-the-art researches and guide the development of new passive devices that can mimic the function of their corresponding semi-active control devices for various applications. The general characteristics of this special group of passive devices are discussed and representative examples are summarized. Their superior performances are illustrated with cyclic and shake table tests of two example devices: mass-variable tuned liquid damper and friction-pendulum bearing with a variable sliding surface curvature.

A Study on the Design and Characteristics of thin-film L-C Band Pass Filter

  • Kim In-Sung;Song Jae-Sung;Min Bok-Ki;Lee Won-Jae;Muller Alexandru
    • KIEE International Transactions on Electrophysics and Applications
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    • v.5C no.4
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    • pp.176-179
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    • 2005
  • The increasing demand for high density packaging technologies and the evolution to mixed digital and analogue devices has been the con-set of increasing research in thin film multi-layer technologies such as the passive components integration technology. In this paper, Cu and TaO thin film with RF sputtering was deposited for spiral inductor and MOM capacitor on the $SiO_2$/Si(100) substrate. MOM capacitor and spiral inductor were fabricated for L-C band pass filter by sputtering and lift-off. We are analyzed and designed thin films L-C passive components for band pass filter at 900 MHz and 1.8 GHz, important devices for mobile communication system. Based on the high-Q values of passive components, MOM capacitor and spiral inductors for L-C band pass filter, a low insertion loss of L-C passive components can be realized with a minimized chip area. The insertion loss was 3 dB for a 1.8 GHz filter, and 5 dB for a 900 MHz filter. This paper also discusses a analysis and practical design to thin-film L-C band pass filter.

Nonlinear semi-active/passive retrofit design evaluation using incremental dynamic analysis

  • Rodgers, Geoffrey W.;Chase, J. Geoffrey;Roland, Thomas;Macrae, Gregory A.;Zhou, Cong
    • Earthquakes and Structures
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    • v.22 no.2
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    • pp.109-120
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    • 2022
  • Older or damaged structures can require significant retrofit to ensure they perform well in subsequent earthquakes. Supplemental damping devices are used to achieve this goal, but increase base shear forces, foundation demand, and cost. Displacement reduction without increasing base shear is possible using novel semi-active and recently-created passive devices, which offer energy dissipation in selected quadrants of the force-displacement response. Combining these devices with large, strictly passive energy dissipation devices can offer greater, yet customized response reductions. Supplemental damping to reduce response without increasing base shear enables a net-zero base shear approach. This study evaluates this concept using two incremental dynamic analyses (IDAs) to show displacement reductions up to 40% without increasing base shear, more than would be achieved for either device alone, significantly reducing the risk of response exceeding the unaltered structural case. IDA results lead to direct calculation of reductions in risk and annualized economic cost for adding these devices using this net-zero concept, thus quantifying the trade-off. The overall device assessment and risk analysis method presented provides a generalizable proof-of-concept approach, and provides a framework for assessing the impact and economic cost-benefit of using modern supplemental energy dissipation devices.

A Study of Passive Intermodulation Distortion on RF Connectors (RF 커넥터의 Passive IMD에 관한 연구)

  • 조인귀;이재화;안승호;최상국;정명영;최태구
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.11 no.2
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    • pp.268-277
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    • 2000
  • Nowadays, the interference between neighbor basestations is getting higher as mobile communication services expand, then the increase of the interference causes IMD(Intermolulation Distortion) problems for not only active devices but also passive devices. In this paper, we have designed and assembled several adapters having variable plating thickness and materials to analyze PIMD(Passive Intermodulation Distortion) mechanisms for coaxial cables which is one of the representative passive RF devices. The measurement results of the assembled adapters show that IM level depends on conductivity of plating materials, plating thickness, device structure, aging effect and so on. Furthermore, we have obtained PIMD mechanisms and some control methods of PIMD from the results.

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Various Dielectric Thick Films for Co-Integration of Passive and Active Devices by Aerosol Deposition Method (Aerosol Deposition Method에 의한 수동소자와 능동소자의 동시 직접화를 위한 다양한 유전체 후막)

  • Nam, Song-Min
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.06a
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    • pp.348-348
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    • 2008
  • In recent, the concept of system-on-package (SOP) for highly integrated multifunctional systems has been paid attention to for the miniaturization and high frequency of electronic devices. In order to realize SOP, co-integration of passive devices, such as capacitors, resistors and inductors, and active devices should be achieved. If ceramic thick films can be grown at room temperature, we expect to be able to overcome many problems in conventional fabrication processes. So, we focused on the aerosol deposition method (ADM) as room temperature fabrication technology. ADM is a novel ceramic coating method based on the Room Temperature Impact Consolidation (RTIC) phenomena. This method has a wide range potential for fabrication of co-integration of passive and active devices. In this paper, I will present the future potential of ADM introducing various ceramic dielectric thick films for the integration of electronic ceramics.

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A Study on the Limited Rate Power Capacity for Applications for Precision Passive Devices Based on Carbon Nanotube Materials (탄소나노튜브 소재의 정밀 수동소자 적용을 위한 한계 정격전력 용량에 관한 연구)

  • Lee, Sunwoo
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.35 no.3
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    • pp.269-274
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    • 2022
  • We prepared carbon nanotube (CNT) paper by a vacuum filtration method for the use of a chip-typed resistor as a precision passive device with a constant resistance. Hybrid resistor composed of the CNT resistor with a negative temperature coefficient of resistance (T.C.R) and a metal alloy resistor with a positive T.C.R could lead to a constant resistance, because the resistance increase owing to the temperature increase at the metal alloy and decrease at the CNT could counterbalance each other. The constant resistance for the precision passive devices should be maintained even when a heat was generated by a current flow resulting in resistance change. Performance reliabilities of the CNT resistor for the precision passive device applications such as electrical load limit, environmental load limit, and life limit specified in IEC 60115-1 must be ensured. In this study, therefore, the rated power determination and T.C.R tests of the CNT paper were conducted. -900~-700 ppm/℃ of TCR, 0.1~0.2 A of the carrying current capacity, and 0.0625~0.125 W of the rated power limit were obtained from the CNT paper. Consequently, we confirmed that the application of CNT materials for the precision hybrid passive devices with a metal alloy could result in a better performance reliability with a zero tolerance.

Embedded Passives (내장형 수동소자)

  • 이호영
    • Journal of the Microelectronics and Packaging Society
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    • v.9 no.2
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    • pp.55-60
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    • 2002
  • The recent trend in electronic devices has been towards light weight, low cost, high performance and improved reliability. Passive components are very important parts of microelectronic devices. The number of passive components used in hand held devices and computers continue to increase. To achieve improvements in costs, component density, performance, and reliability, embedding of these passive components into the printed circuit boards (PCBs) is required. This paper introduces the embedding of passive components, and discusses the remained challenges in the commercialization of this technique.

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Passive Transient Voltage Suppression Devices for 42-Volt Automotive Electrical Systems

  • Shen, Z.John
    • Journal of Power Electronics
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    • v.2 no.3
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    • pp.171-180
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    • 2002
  • New 42-volt automotive electrical systems can provide significant improvements in vehicle performance and fuel economy. It is crucial to provide protection against load dump and other overvoltage transients in 42-volt systems. While advanced active control techniques are generally considered capable of providing such protection, the use of passive transient voltage suppression (TVS) devices as a secondary or supplementary protection means can significantly improve design flexibility and reduce system costs. This paper examines the needs and options for passive TVS devices for 42-volt applications. The limitations of the commonly available automotive TVS devices, such as Zener diodes and metal oxide varistors (MOV), are analyzed and reviewed. A new TVS device concept, based on power MOSFET and thin-film polycrystalline silicon back-to-back diode technology, is proposed to provide a better control on the clamp voltage and meet the new 42-volt specification. Both experimental and modeling results are presented. Issues related to the temperature dependence and energy absorbing capability of the new TVS device are discussed in detail. It is concluded that the proposed TVS device provides a cost-effective solution for load dump protection in 42-volt systems.

Optimal Design of Hybrid Control System through Inter-Building Connection (빌딩간 연결을 통한 복합제어시스템의 최적설계)

  • Park, Kwan-Soon;Ok, Seung-Yong
    • Journal of the Korean Society of Safety
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    • v.32 no.6
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    • pp.81-88
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    • 2017
  • This study deals with the optimal design of a hybrid control system composed of a combination of active control system and passive control system for effective seismic performance improvement of two adjacent structures. The proposed hybrid control system adopts a configuration of installing an active control device in one building and connecting two adjacent structures with a passive control device so that the one-side active control force can be bi-directionally applied to both buildings through the passive connecting devices. In order to derive the optimal performance of the proposed system, the design parameters of the passive and active control systems were searched using the genetic algorithm. Numerical simulations of 10-story and 8-story buildings have been performed to verify the effectiveness of the proposed technique. For the purpose of comparison, the conventional independent control system with two identical active control systems being installed separately for each structure was also optimally designed and its seismic response has been evaluated as well. From the comparative results of the two control systems, it is demonstrated that the proposed hybrid control system requires larger control force for its one-side active control device than the conventional independent control system does for each of both-side active devices, but quite less than the total control force required for both-side devices of the independent control system, while maintaining similar seismic performance. Therefore, the proposed system is more economical and reliable than the conventional independent control system with two identical active devices.

Nonlinear analyses of structures with added passive devices

  • Tsai, C.S.;Chen, Kuei-Chi
    • Structural Engineering and Mechanics
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    • v.18 no.4
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    • pp.517-539
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    • 2004
  • Many types of passive control devices have been recognized as effective tools for improving the seismic resistance of structures. A lot of past research has been carried out to study the response of structures equipped with energy-absorbing devices by assuming that the behavior of the beam-column systems are linearly elastic. However, linear theory may not be adequate for beams and columns during severe earthquakes. This paper presents the results of research on the nonlinear responses of structures with and without added passive devices under earthquakes. A new material model based on the plasticity theory and the two-surface model for beams and columns under six components of forces is proposed to predict the nonlinear behavior of beam-column systems. And a new nonlinear beam element in consideration of shear deformation is developed to analyze the beams and columns of a structure. Numerical results reveal that linear assumption may not be appropriate for beams and columns under seismic loadings, especially for unexpectedly large earthquakes. Also, it may be necessary to adopt nonlinear beam elements in the analysis and design process to assure the safety of structures with or without the control of devices.