• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.12S
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• pp.1187-1194
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• 2003

A BCl$_3$/Ne plasma chemistry was used to etch Ga-based (GaAs, AIGaAs, GaSb) and In-based (InGaP, InP, InAs and InGaAsP) compound semiconductors in a Planar Inductively Coupled Plasma (ICP) reactor. The addition of the Ne instead of Ar can minimize electrical and optical damage during dry etching of III-V semiconductors due to its light mass compared to that of Ar All of the materials exhibited a maximum etch rate at BCl$_3$ to Ne ratios of 0.25-0.5. Under all conditions, the Ga-based materials etched at significantly higher rates than the In-based materials, due to relatively high volatilities of their trichloride etch products (boiling point CaCl$_3$ : 201 $^{\circ}C$, AsCl$_3$ : 130 $^{\circ}C$, PCl$_3$: 76 $^{\circ}C$) compared to InCl$_3$ (boiling point : 600 $^{\circ}C$). We obtained low root-mean-square(RMS) roughness of the etched sulfate of both AIGaAs and GaAs, which is quite comparable to the unetched control samples. Excellent etch anisotropy ( > 85$^{\circ}$) of the GaAs and AIGaAs in our PICP BCl$_3$/Ne etching relies on some degree of sidewall passivation by redeposition of etch products and photoresist from the mask. However, the surfaces of In-based materials are somewhat degraded during the BCl$_3$/Ne etching due to the low volatility of InCl$_{x}$./.

• Proceedings of the KIEE Conference
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• 1994.07b
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• pp.1280-1282
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• 1994

The method of passivation for protecting the $Hg_{l-x}Cd_xTe$ surface is important device fabrication process, because the surface components are highly reactive leading to its chemical and electrical instability. Especially, the material of which composition is x=0.2 or 0.3, is narrow bandgap semiconductor and used as detector of infrared radiation. The device performance of narrow bandgap semiconductors are largely governed by the properties of the semiconductor surface. The electro-chemical processing of $Hg_{l-x}Cd_xTe$ allows rigorous control of the surface chemistry and provides an in-situ monitor of surface reaction. So electro-chemical reduction at specific potential can selectively eliminate the undesirable species on the surface and manipulated to reproducibly attain the desired stoichiometry. This method shows to assess the quality or chemically treated $Hg_{l-x}Cd_xTe$ good surface.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.117-117
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• 2008

In MIM capacitor, poly-Si bottom electrode is replaced with metal bottom electrode. Noble metals can be used as bottom electrodes of capacitors because they have high work function and remain conductive in highly oxidizing conditions. In addition, they are chemically very stable. Among novel metals, Ru (ruthenium) has been suggested as an alternative bottom electrode due to its excellent electrical performance, including a low leakage of current and compatibility to high dielectric constant materials. Chemical mechanical planarization (CMP) process has been suggested to planarize and isolate the bottom electrode. Even though there is a great need for development of Ru CMP slurry, few studies have been carried out due to noble properties of Ru against chemicals. In the organic chemistry literature, periodate ion ($IO_4^-$) is a well-known oxidant. It has been reported that sodium periodate ($NaIO_4$) can form $RuO_4$ from hydrated ruthenic oxide ($RuO_2{\cdot}nH_2O$). $NaIO_4$ exist as various species in an aqueous solution as a function of pH. Also, the removal mechanism of Ru depends on solution of pH. In this research, the static etch rate, passivation film thickness and wettability were measured as a function of slurry pH. The electrochemical analysis was investigated as a function of pH. To evaluate the effect of pH on polishing behavior, removal rate was investigated as a function of pH by using patterned and unpatterned wafers.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.05c
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• pp.33-36
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• 2003

Tungsten is widely used as a plug for the multi-level interconnection structures. However, due to the poor adhesive properties of tungsten (W) on $SiO_2$ layer, the Ti/TiN barrier layer is usually deposited onto $SiO_2$ for increasing adhesion ability with W film. Generally, for the W-CMP (chemical mechanical polishing) process, the passivation layer on the tungsten surface during CMP plays an important role. In this paper, the effect of oxidants controlling the polishing selectivity of W/Ti/TiN layer were investigated. The alumina $(Al_2O_3)$ abrasive containing slurry with 5 % $H_2O_2$ as the oxidizer, was studied. As our preliminary experimental results, very low removal rates were observed for the case of no-oxidant slurry. This low removal rate is only due to the mechanical abrasive force. However, for Ti and TiN with 5 % $H_2O_2$ oxidizer, different removal rate was observed. The removal mechanism of Ti during CMP is mainly due to mechanical abrasive, whereas for TiN, it is due to the formation of metastable soluble peroxide complex.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.28 no.10
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• pp.665-669
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• 2015

We investigated and compared two methods of in-situ oxidation and chemical etching treatment (CET) to remove the boron rich layer (BRL). The BRL is generally formed during boron doping process. It has to be controlled in order not to degrade carrier lifetime and reduce electrical properties. A boron emitter is formed using $BBr_3$ liquid source at $930^{\circ}C$. After that, in-situ oxidation was followed by injecting oxygen of 1,000 sccm into the furnace during ramp down step and compared with CET using a mixture of acid solution for a short time. Then, we analyzed passivation effect by depositing $Al_2O_3$. The results gave a carrier lifetime of $110.9{\mu}s$, an open-circuit voltage ($V_{oc}$) of 635 mV at in-situ oxidation and a carrier lifetime of $188.5{\mu}s$, an $V_{oc}$ of 650 mV at CET. As a result, CET shows better properties than in-situ oxidation because of removing BRL uniformly.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.85-85
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• 2007

최근 귀금속중의 하나인 Ruthenium(Ru)은 높은 일함수, 누설전류에 대한 높은 저항성등의 톡성으로 인해 캐패시터의 하부전극으로 각광받고 있다. 하부전극으로 증착된 Ru은 일반적으로 각 캐패시터의 분리와 평탄화를 위해 건식식각이 이루어진다. 하지만, 건식식각 공정중 유독한 $RUO_4$ 가스가 발생할 수 있으며, 불균일한 캐패시터 표면을 유발할 수 있다. 이러한 문제점들을 해결하기 위해 CMP 공정이 필요하게 되었다. 하지만, Ru은 화학적으로 매우 안정하기 때문에 Ru CMP 슬러리에 대한 연구가 필요하게 되었으며, 이에 대한 연구가 활발히 진행되고 있다. 본 연구에서는 Ru CMP 공정에서 Chemical A가 에칭제 및 산화제로 사용된 슬러리의 pH 변화와 pH 적정제에 따른 영향을 살펴보았다. Ru wafer를 이용하여 static etch rate, passivation film thickness와 wettability를 pH와 pH 적정제에 따라 비교해 보았다. 또한, pH 적정제로 $NH_4OH$와 TMAH를 이용하여 pH별 슬러리를 제작하고 CMP 공정을 실시하여 Ru의 removal rate을 측정하였다. $NH_4OH$와 TMAH의 경우 각각 130. 100 nm/min의 연마율이 측정된 pH 6에서 가장 높은 연마률을 보였으며, TMAH의 경우가 pH 전 구간에서 $NH_4OH$에 비해 낮은 연마율이 측정되었다. TEOS 에 대한 Ru의 선택비를 측정해 본 결과, $NH_4OH$의 경우 pH 8~9. TMAH의 경우 pH 6~7에서 높은 selectivity를 얻을 수 있었다.

• Transactions of the Korean Society of Mechanical Engineers
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• v.16 no.3
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• pp.598-607
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• 1992

The environment degradation of structural steel under high temperature is one of the key phenomena governing the availability and life of plant. This degradation resulted from the microstructural changes due to the long exposure at high temperature affect the mechanical properties such as creep strength and toughness. For instance, boiler tube materials usually tend to degrade, after long term operation, by precipitates, spherodizing, coarsening, and change in chemical composition of carbides. In this study, the material degradation under high temperature exposure was investigated by evaluating the carbide precipitation. The electrochemical polarization method was facilitated to investigate the precipitation and coarsening of carbides. It was shown by the modified electrochemical potentiokinetic reactivation (EPR) tests that the passivation of Mo-rich carbides did not occur even in the anodic peak current (Ip) which indicates the precipitation of Mo$_{6}$C was also observed. And it was assured that special electrolytic cell assembled in this research can be used for the detection of Mo$_{6}$C precipitation in the field.eld.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.11a
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• pp.494-497
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• 2004

본 연구는 방사선 영상센서 적용을 위한 $HgI_2$ 필름의 특성 평가에 관한 것으로서 X-선 조사조건별 인가전압에 따른 검출신호 특성을 조사하였다. 기존의 $HgI_2$ 검출기의 경우 신호량이 크다는 장점이 있으나 노이즈의 양이 크다. 이에 대한 해결책으로 보호층을 삽입하나 이 경우 X-선 조사에 따른 시간 응답 특성이 있어서 전하트랩현상(tailing effect)에 의한 영향이 크게 존재하였다. 따라서 본 논문에서는 이러한 문제점을 해결하고자 보호층으로써 a-Se 을 삽입하여 기존의 $HgI_2$ 검출기에서 사용되어지는 parlyene이 삽입된 검출기와 전기적 특성을 측정, 비교해보고자 한다. 제작방식으로는 대면적 제작이 용이한 스크린 프린팅 방식을 이용하여 두께 $140\;{\mu}m$와 $3\;cm\;{\times}\;2\;cm$ 면적으로 제조하였다. 측정결과, a-Se을 보호층으로 사용한 $HgI_2$ 필름이 민감도는 거의 비슷하나 누설전류가 안정화 되는데 걸리는 감소시간(decay time)이 parlyene을 사용한 구조에 비해 훨씬 낮았다. 또한 X선에 대한 민감도는 기존의 a-Se에 비해 월등히 높아 적은 방사선 조사량(radiation dose)에서도 신호검출이 가능하여 저선량이 요구되는 방사선 투시촬영(digital fluoroscopy) 적용에 유용할 것으로 기대된다.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.21 no.2
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• pp.619-626
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• 2020

The development of new antifreeze mixtures containing non-amine-type corrosion inhibitors, which considers environmental protection, has become a major issue. In this study, four non-amine-type corrosion inhibitors were synthesized and used to produce five kinds of new antifreeze for automobiles to evaluate the rate of copper corrosion. The effects were evaluated by the weight change, surface observation, roughness measurement, and measurement of copper elution in the solution. The amount of copper eluted measured by ICP from Sample 4 was small, and the elution rate was prolonged. Sample 4 showed the best anti-corrosion performance owing to a corrosion suppression effect by passivating copper because the metal surface was smooth after the test, and the corrosion product layer was formed evenly on the surface as small local corrosion was observed. The major corrosion inhibitor added to Sample 4 was 1-aminomethyl(N',N'-di(2-hydroxyethyl)benzotrazole, which contained a certain amount in Sample 5 to show relatively high local corrosion but passivation in progress. Therefore, among the four corrosion inhibitors, 1-aminomethyl(N',N'-di(2-hydroxyethyl)benzotrazole had the highest corrosion inhibitory effect. This corrosion inhibitor prevents corrosion by promoting the passivation of copper on the antifreeze.

• Applied Chemistry for Engineering
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• v.22 no.1
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• pp.67-71
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• 2011

The cathodic active material of $Li/SO_2Cl_2$ battery is $SO_2Cl_2$, which is the solvent of an electrolyte. It is referred to as a catholyte, a compound word of cathode and electrolyte. As the battery discharges, the catholyte burns out. And thus, the characteristics of the $SO_2Cl_2$ in the battery determine the capacity. In addition, the transition minimum voltage (TMV) and the voltage delay deviation of $Li/SO_2Cl_2$ battery are due to the passivation film formed by the reaction between an electrolyte and Li. Impurities in the electrolyte, such as moisture or heavy metal ions, will accelerate the growth of the passivation film. Therefore, a technology must be established to purify an electrolyte and to ensure the effectiveness of the purification method. In this research, $LiAlCl_4/SO_2Cl_2$ was manufactured using $AlCl_3$ and LiCl. Its concentration, the amount of moisture, and the metal amount were evaluated using an ionic conductivity meter, a colorimeter, and FT-IR.