• Food Science and Biotechnology
• /
• v.16 no.6
• /
• pp.999-1005
• /
• 2007

An oil-in-water (O/W) emulsion [20 wt% com oil, 0.5-6.0 wt% fish gelatin (FG), pH 3.0] was produced by high pressure homogenization, and the influence of pH, protein concentration, and homogenization condition on the formation of FG-stabilized emulsions was assessed by measuring particle size distribution, electrical charge, creaming stability, microstructure, and free FG concentration in the emulsions. Optical microscopy indicated that there were some large droplets ($d>10\;{\mu}m$) in all FG-emulsions, nevertheless, the amount of large droplets tended to decrease with increasing FG concentration. More than 90% of FG was present free in the continuous phase of the emulsions. To facilitate droplet disruption and prevent droplet coalescence within the homogenizer, homogenization time was adjusted in O/W emulsions stabilized by 2.0 or 4.0 wt% FG. However, the increase in the number of pass rather promoted droplet coalescence. This study has shown that the FG may have some limited use as a protein emulsifier in O/W emulsions.

• Proceedings of the KIEE Conference
• /
• 1998.07e
• /
• pp.1711-1713
• /
• 1998

This paper describes the insulation characteristics of GIS by the free conducting particles under alternating voltage. The particles of the GIS can cause decrease in breakdown voltages. Various materials and sizes of free conducting particles were used to study the lift-off and fall-down characteristics. The measured lift-off voltage for copper particle agreed with the calculated one.

• Proceedings of the Korean Society of Marine Engineers Conference
• /
• 2001.05a
• /
• pp.135-139
• /
• 2001

This experimental study investigates the wake flow behind a pair of cylinders displaced normal to a free stream. In this experiment, the principal aim is to investigate the transition mechanism of the large vortex generating process in the wake having unique vortex shedding pattern. associated with the gap difference between the cylinders. The detailed visualization is carried out using the PIV measurement. The transition mechanism of the large generating vortex is clarified by showing the streak lines. the vorticity and the statistical fluctuating velocity distributions.

• 한국가시화정보학회:학술대회논문집
• /
• 2006.12a
• /
• pp.73-77
• /
• 2006

Flow rate measurement is one of the difficult problems in the industrial applications. Especially, flow rate in a partially filled pipeline is affected by many parameters such as water level, channel slop, etc. In the present study, prior to the development of a flowmeter, the flow characteristics has been investigated by particle image velocimetry (PIV) measurements. Three-dimensional velocity distributions were obtained from sectional measurements of velocity profiles according to the water level. As a result, it is found that there is no similarity in the velocity profile when the lateral position is changed. In addition, the maximum velocity does not always occur on the free surface. It depends on the water level. In the aspect of flow rate measurement, the previous calculus based upon point measurement techniques is proved to be inaccurate because of the lack of whole flow information.

• International Journal of Naval Architecture and Ocean Engineering
• /
• v.1 no.1
• /
• pp.20-28
• /
• 2009

In thus paper we validate a numerical model for wave-structure interaction by comparing numerical results with laboratory data. The numerical model is based on the Navier-Stokes (N-S) equations for an incompressible fluid. The N-S equations are solved by a two-step projection finite volume scheme and the free surface displacements are tracked by the volume of fluid (VOF) method The numerical model is used to simulate solitary waves and their interaction with a group of slender vertical piles. Numerical results are compared with the laboratory data and very good agreement is observed for the time history of free surface displacement, fluid particle velocity and wave force. The agreement for dynamic pressure on the cylinder is less satisfactory, which is primarily caused by instrument errors.

• Proceedings of the Korean Society of Plant Biotechnology Conference
• /
• 2005.04a
• /
• pp.40-40
• /
• 2005

• Journal of the Korean Ceramic Society
• /
• v.29 no.9
• /
• pp.695-704
• /
• 1992

In (Pb, La)(Zr, Ti)O3 ceramic system, the functionally gradient material (FGM) was developed, and its processing and properties were investigated. The FGMs were successfully prepared through doctor blade method with acrylic binder system as well as mold stacking press method. The ultrasonic treatment was very effective for particle dispersion in slurry, and it lead to form clack-free green films. The strain-voltage characteristics of the FGM system was significantly improved which fabricated between a high piezoelectric-low dielectric and a low piezoelectric-high dielectric composition layer.

• Proceedings of the Korea Air Pollution Research Association Conference
• /
• 2001.11a
• /
• pp.395-396
• /
• 2001

고온의 산업공정에서 발생하는 에어로졸 입자들은 많은 기본입자(primary particle)들로 이루어진 불규칙한 사슬구조를 가진다 (Matsoukas and Friedlander, 1991). 이러한 비구형 프랙탈 입자들의 거동은 구형 입자들과 비교할 때 큰 차이를 보인다. 프랙탈 입자들의 부피는 충돌반경의 거듭제곱으로 나타낼 수 있으며, 프랙탈 차원이라 불리는 그 지수는 1에서 3 사이의 값을 가진다. 자유분자영역에서의 브라운 응집에 대한 해석해는 Lee et al.(1990)에 의해 제시된 바 있으나, 이는 구형입자를 가정한 결과였고, 비구형 프랙탈 입자의 거동을 해석하려 할 때는 이로 인한 오차가 발생하게 된다. (중략)

• Proceedings of the Korea Society for Simulation Conference
• /
• 2003.06a
• /
• pp.161-166
• /
• 2003

Semiconductor Manufacturing has emerged as one of the most Important world industries. Even with the highly automated and precisely monitored facilities used to process the complex manufacturing steps in a near particle free environment, processing variations in wafer fabrication still exist. The causes of these variations may arise from equipment malfunctions, delicate and difficult processing steps, or human mistakes. In this paper, we could specify the cause stage and the cause equipment and take countermeasures at a speed by the conventional method, without depending on the experience and skills of the engineer

• Journal of the Korea Society for Simulation
• /
• v.12 no.3
• /
• pp.13-20
• /
• 2003

Semiconductor Manufacturing has emerged as one of the most important world industries. Even with the highly automated and precisely monitored facilities used to process the complex manufacturing steps in a near particle free environment, processing variations in wafer fabrication still exist. The causes of these variations may arise from equipment malfunctions, delicate and difficult processing steps, or human mistakes. In this paper, we could specify the cause stage and the cause equipment and take countermeasures at a speed by the conventional method, without depending on the experience and skills of the engineer