• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1991년도 추계학술대회 논문집
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• pp.83-89
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• 1991

The partial discharge properties of interface layer in Mica-Epoxy composite, which has been mainly used for the coil insulating material of high voltage machinery, are different from those of resins due to the abnormal interface layer to be presented between inorganic material and resin. Accordingly, the study on discharge of interface in composite insulting system is strongly requsted for not only an increasing of insulating strength, but also the basical information of diagnosis system for high voltage equipment. As a result, it has been confirmed that the interface is an abnormal resin layer and the contact states at interface is depended upon the density of silane aqueous solution. Pulse frequency at abnormal interface shows a linear increasing with enlargement of discharge quantity. Whereas, in case of normal interface, pulse frequency property represents exponential increasing at the point of saturating. A life model can be diagramed from results of time dependance of skewness, and a survival life time can be quantified from the life model suggested.

• 한국전기전자재료학회논문지
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• 제14권7호
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• pp.578-583
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• 2001

The bushing for high voltage and large and power should endure weight of itself and force of pushing from contact with circuit breaker. Like this, epoxy mold bushing has to be strong without fault. However, the external circumstances and internal factors was caused by partial discharge, flashover and dielectric breakdown. Therefore, to remove external factor of defect and to prevent the internal cracks and cavity generated from the contraction on interface of Cu-Epoxy, we should form semi-conductive layer on Cu bar by carbon. Then, the PD properties and the insulation qualities of epoxy mold type bushing was able to improved by roles of cushions for the direction of diameter and by effects fo natural sliding like as separated from conductor for the direction of length. So, in this work, we could prove the method of semi-conductive layer in making the long conductor.

• 한국콘크리트학회:학술대회논문집
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• 한국콘크리트학회 2000년도 봄 학술발표회 논문집
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• pp.605-610
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• 2000

The concrete slab on the foundation may have curling and warping deformations due to temperature gradient of its section. These deformations may change the support conditions of concrete slabs, and cause higher level of stresses tan expected. In this study, partial support conditions de to several temperature gradients are evaluated using FE analysis. Expecially, 3D FE model is adopted to evaluate the partial contact between the slab and the base which is hard to be simulated in 2D FE models. The discrepancies of analysis results increase at high temperature gradients. And it is concluded that 3D FE model can be used to simulate real support and temperature conditions.

• 대한토목학회논문집
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• 제29권4A호
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• pp.281-290
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• 2009

혼합구조체의 강-콘크리트 경계면은 하중이 증가함에 따라 합성작용 저하, 미세균열, 슬립 및 분리 등으로 비선형 거동을 나타내어 부분합성에 적합한 해석기법이 필요하다. 스터드의 상세해석을 통하여 이를 실현할 수 있으나 이는 해석 결과의 실효성에 비해 시간과 비용이 많이 투입되기 때문에 본 연구에서는 접합부의 경계비선형과 강-콘크리트의 재료비선형을 고려하여 더욱 정확한 강 콘크리트 혼합구조 해석기법을 제안하였다. 접합부의 경계면의 비선형성은 인터페이스 요소를 이용하여 모델링한다. 이를 위해 먼저 경계면의 비선형 거동 물성치를 산정하여야 한다. 경계면의 물성은 push-out test 등을 통하여 얻을 수 있는데 이는 기존에 연구되었던 실험결과를 이용하였다. 강과 콘크리트의 재료비선형을 고려하기 위해 콘크리트의 압축부는 Drucker-Prager 모델을 이용하고, 강재는 von-Mises 모델과 2개의 직선으로 이상화한 응력-변형률 관계를 적용하였다. 해석의 검증을 위해 프리스트레스트 콘크리트-강 혼합구조를 갖는 혼합거더의 정적 휨 거동에 관해 해석하여 기존의 실험결과와 비교하였다. 제안된 혼합구조 해석 기법을 이용하여 경계면의 비선형 모델을 변화시켜가면서 해석을 수행하여 강-콘크리트 혼합구조체의 거동을 분석하였다. 이후 경계면의 선형 해석방법과 완전부착을 가정하는 해석방법의 결과와 비교 분석하여 제안한 비선형 해석기법의 타당성을 검증하였다.

• 한국산업융합학회 논문집
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• 제10권3호
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• pp.179-185
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• 2007

Quartz glass are used in semiconductor industries as the reaction furnace, wafer carrier and accessaries. During the process the quartz glass received compression by direct contact with other quartz glass ware and metal as the form of weight itself and vacuum pressure and fatigue by vibrations caused by process. Even as the other ceramic materials quartz glass have high compressive strength but often there happened crack and breakage of quartz glass resulted in a great damage in the process. In this paper investigation will be carried out on fracture behavior of quartz glass under local load to give guideline to prevent unintended fracture of quartz glass.

• KSTLE International Journal
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• 제2권1호
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• pp.75-79
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• 2001

This paper is a report on the parametric study of the friction characteristics on the direct acting type OHC valve train system. The numerical simulation was performed by using the IV-TAP. Dynamic analysis by using the lumped mass method was previously performed to define the acting load. The friction characteristics were analyzed by using the partial asperity contact model. The effects of operating conditions and major design parameters on the total driving torque were investigated. From the analytical prediction, it is found that valve spring stillness, surface roughness, and base circle radius are the main factors to reduce the frictional loss on the valve train system.

• 대한기계학회논문집A
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• 제28권1호
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• pp.79-84
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• 2004

A light-guide is one of several important components of backlight unit in TFT-LCD. The manufacturing technology and optical system design of the light guide is very sensitive to quality and cost of the TFT-LCD module. In the present study a new manufacturing method which is called as direct surface forming(DSF) has been tested under various conditions. DSF is very similar to the well-known hot embossing except for partial contact between mold and substrate. The final V-groove pattern shows different shapes depend on the temperature of mold surface, contact time of mold and depth of V-groove.

• 전력전자학회:학술대회논문집
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• 전력전자학회 2014년도 전력전자학술대회 논문집
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• pp.5-6
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• 2014

According to 2013 fire statistical yearbook in the National Emergency Management Agency, the main cause of an electrical fire are classified to short circuit fault, overload fault, electric leakage, partial disconnection, and joint/contact badness. The occurrence factor of fire is electric arc or spark accompanied with electrical faults. Residual Current Protective Devices(RCDs) of high sensitivity type used at single phase (220V) cut off earth leakage and overload but the RCDs can not cut off electric arc or spark to be a main cause of electrical fire. To be improved on such problem, this thesis is proposed to a auxiliary control device for RCD cut off electric arc or spark.

• 정보처리학회논문지C
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• 제13C권5호
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• pp.595-600
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• 2006

오늘날 저가의 RFID 기술은 리더와 태그사이에 물리적인 접촉 없이 인식 가능한 기술로서 기업과 학술적 분야에서 많은 각광을 받고 있다. 그러나 태그의 정보가 전송과정에 무선특성에 따른 과도한 정보 노출과 사용자의 위치정보 추적과 같은 심각한 프라이버시 침해를 유발시킨다. 특히 읽기전용 태그에서의 보안문제는 단지 물리적 방법으로만 해결하고 있다. 이 논문에서는 간단한 XOR연산과 부분 ID를 이용하여 다양한 공격에 안전하며 읽기전용 태그에 적합한 저비용 인증 프로토콜을 제안한다. 제안 프로토콜은 재전송, 도청, 위장 공격에 안전하며 또한 위치 프라이버시가 보장된다.

• Journal of Electrical Engineering and Technology
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• 제10권5호
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• pp.2089-2098
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• 2015

With the continuous development in insulation of electrical equipment design, the reliability of the system has been enhanced. However, in the manufacturing process and during operation under continues stresses introduce local defects, such as voids between interfaces that can responsible to occurrence of partial discharge (PD), electric field distortion and accumulation of charges. These defects may lead to localize corrosion and material degradation of insulation system, and a serious threat to the equipment. A model of three layers of PI film with air gap is presented to understand the influence of interface and voids on exploitation conditions such as strong electrical field, PD activity and charge movement. The analytical analysis, and experimental results are good agreement and show that the lose contact between interfaces accumulate more residual charges and in consequences increase the electric field intensity and accelerates internal discharges. These residual charges are trapped charges, injected by the electrodes has often same polarity, so the electric field in cavities increases significantly and thus partial discharge inception voltage (PDIV) decreases. Contrary, number of PD discharge quantity increases due to interface. Interfacial polarization effect has opposite impact on electric field and PDIV as compare to void.