• Transactions of the Korean Society of Machine Tool Engineers
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• v.17 no.2
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• pp.110-113
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• 2008

Embedded capacitor technology is one of the effective packing technologies for further miniaturization and higher performance of electric packaging system. In this paper, the embedded capacitors were simulated and fabricated in 8-layered printed circuit board employing standard PCB processes. The composites of barium titanante($BaTiO_3$) powder and epoxy resin were employed for the dielectric materials in embedded capacitors. Theoretical considerations regarding the embedded capacitors have been paid to understand the frequency dependent impedance behavior. Frequency dependent impedance of simulated and fabricated embedded capacitors was investigated. Fabricated embedded capacitors have lower self resonance frequency values than that of the simulated embedded capacitors due to the increased parasitic inductance values. Frequency dependent capacitances of fabricated embedded capacitors were well matched with those of simulated embedded capacitors from the 100MHz to 10GHz range. Quality factor of 20 was observed and simulated at 2GHz range in the 10 pF embedded capacitors. Temperature dependent capacitance of fabricated embedded capacitors was presented.

• Journal of the Semiconductor & Display Technology
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• v.11 no.2
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• pp.45-51
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• 2012

Multilayer co-extrusion blown film construction is a popular technique for producing plastic films for various packaging industries. Automated detection of defective films can improve the quality of film production process. In this paper, we propose a film inspection system that can detect and classify film defects robustly. In our system, first, film images are acquired through a high speed line-scan camera under an appropriate lighting system. In order to detect and classify film defects, an inspection algorithm is developed. The algorithm divides the typical film defects into two groups: intensity-based and texture-based. Intensity-based defects are classified based on geometric features. Whereas, to classify texture-based defects, a texture analysis technique based on local binary pattern (LBP) is adopted. Experimental results revealed that our film inspection system is effective in detecting and classifying defects for the multilayer co-extrusion blown film construction line.

• Journal of Digital Contents Society
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• v.18 no.2
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• pp.257-266
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• 2017

Recently, a variety of books have been published in various fields, and the range of selection for both online and offline bookstores have been widened. However, there is a vinyl packaging phenomenon to prevent damage being made to the books in bookstores. This makes it difficult to have a look through on the contents of the book, affecting consumers' purchasing decisions. These factors causes the annual average reading volume to decrease. Therefore, in this paper, we would like to propose a "bookmark" application to provide consumers with book information service using AR and Marker technology, tackling the decrease in sales caused by the problem.

• Korean Journal of Optics and Photonics
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• v.11 no.5
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• pp.340-346
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• 2000

Traveling wave type semiconductor optical amplifiers integrated with spot-size-converter (SSC-TW-SOA) have been extensively studied for the improvement of coupling effiClency With single-mode fiber and fO! the cost reducClon 111 a packaging In tlIis paper the slructural dependence of the spot-slZe-converter on the effective facet reflectlvllY $R_{eff}$ was experimentally as well as thcoretienlly mvestlgated. It was shown that not only a sufficient mode-conversion in a sse region along the latersl and tran~verse directions but also an introductIOn of angled-facet were very essential in order to reduce $R_{eff}$ Very small ripple less than 0.1 dB in an amplified spontaneous emission spectrum was observed with the fabncated SSC-lW-SOA which consists of the wrndow length of $20\mu\textrm{m}$, facet angle of $7^{\circ}$, and antlrelleetioll-coated facet of ] % reflectivity.tivity.

• Journal of the Korea Society for Simulation
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• v.20 no.3
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• pp.49-58
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• 2011

The workloads of facilities and laborers are important for the capacity planning in a factory. They are always referenced whenever a factory develops a new product, increases the production quantity and makes a plan of new investment. There are many measuring methods for estimating the workload effectiveness of facilities and laborers. In this paper, various measuring methods including survey, work sampling, micro-motion study, data gathering from ERP system and simulation, are analyzed for comparing the accuracy of workload. This case study is conducted in a Korean company that produces semiconductor parts like leadframe and packaging substrate.

• Journal of the Korean institute of surface engineering
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• v.36 no.1
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• pp.74-78
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• 2003

The corrosion failure of electronic devices has been a major reliability concern lately. This failure is an ongoing concern because of miniaturization of integrated circuits (IC) and the increased use of polymers in electronic packaging. Recently, plasma-polymerized cyclohexane films were considered as a possible candidate for a interlayer dielectric for multilever metallization of ultra large scale integrated (ULSI) semiconductor devices. In this paper the protective ability of above films as a function of deposition temperature and RF power in an 3.5 wt.% NaCl solution were examined by polarization measurement. The film was characterized by FTIR spectroscopy and contact angle measurement. The protective efficiency of the film increased with increasing deposition temperature and RF power, which induced the higher degree of cross-linking and hydrophobicity of the films.

• Proceedings of the KIEE Conference
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• 2006.07c
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• pp.1635-1636
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• 2006

In this paper, a non-vacuum packaged single crystalline silicon MEMS gyroscope is designed, fabricated and tested. To reduce air damping of the gyroscope structure for non-vacuum packaging, air damping model is used and damping is minimized by analysis. The inner and outer spring length is optimized by ANSYS simulation for rigid body motion. The gyroscope is fabricated by SiOG(Silicon On Glass) process. The performance of the gyroscope is measured to evaluate the characteristic of the gyroscope. The sensitivity, non-linearity, noise density and the bias stability are measured to 9.7693 mV/deg/s, 04265 %, 2.3 mdeg/s/rtHz and 16.1014 deg/s, respectively.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.25 no.10
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• pp.830-836
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• 2012

An efficient cooling system is essential for the electronic packaging such as a high-luminance LED lighting. A special heat transport technology, Pulsating Heat Pipe (PHP), can be applied to the cooling of LED lighting. In this paper, the operational characteristics of the PHP in the imposed thermal boundary conditions of LED lighting were experimentally investigated. The experimental PHP was made of copper tubes of internal diameter of 2.1 mm. The working fluids of ethanol, FC-72, water, acetone and R-123 were chosen for comparison. The results showed that an optimum range of charging ratio exists for high cooling performance; 50% for most of the fluids. Among the five working fluids, water showed the highest heat transfer rate of 260 W. Two distinguished characteristics of pulsating direction were identified. It is also identified that high vapor pressure gradient is one of key parameters for better heat transfer performance.

• Journal of the Korea Furniture Society
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• v.28 no.3
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• pp.233-247
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• 2017

Woodcraft activities have an inseparable relationship with our daily life, and it is a field that needs to be continued because of the value of education for the growing students. The interest in woodworking from childhood to old age is rapidly expanding nowadays, therefore this study has been done to provide images to those who are engaged in woodcraft business and also those who are interested in this field. If we look at the use of wood in our daily life, We can classify it into Architecture, Civil engineering, Furniture, Musical Instrument, Packaging, Recreational instrument, Exercise instrument, Stationery, Daily commodity, and Industrial use. Among them, We examined kinds of stationery and which type of woods were used. As a result of classifying 101 stationery products in 22 countries, stationery materials using wood can be used for Business cards, Envelope houses, Box houses, Pen holders, Locker plates, Stationery baskets, Book holders, Stamps, Paper knives, Bookmarks, and Photo frames. It was found various wooden stationery are made in USA, Japan, UK, Canada etc. And the most frequently used species are hardwoods such as Walnut (Juglans regia), Maple (Acer spp.), Cherry (Prunus serotina), Birch (Betula spp.), Mahogany (Swietenia macrophylla), Tulip (Liriodendron tulipifera Linnaeus), Bubinga (Guibourtia tessmannii J. Leonard), Wenge (Milletia laurentii De. wild), Cocobolo (Dallbergia cultrata Grah), Zebrawood (Microberlinia brazzavillensis A. Chev.) and Ebony (Diospyros spp.).

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.2
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• pp.123-127
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• 2009

In order to get more higher integration density of devices, it is getting to be used more and more micro via interconnection lines for interconnecting layers or devices. However, it is very important to enhance the electrical characteristic by reducing the electrical resistivity of micro via interconnection line because it affects the reliability of packaging. In this paper, Micro vias were patterned with a diameter from 10 to 100 um by increasing the step of 10 um and 100 um height and were fabricated by micromachining technology to investigate the electrical characteristic of micro via interconnection lines. These micro vias were filled with copper by electroplating process with appling pulse current mode. And the electrical characteristics of micro via interconnection lines were measured. The measured value of electrical resistivity shows with a range from 20 to $26\;m{\Omega}$. This value from micro via interconnection lines fabricated by pulse current mode electroplating process shows better result than the resistivity from than micro via interconnection lines fabricated by DC mode ($31\;m{\Omega}$).