• 한국공작기계학회논문집
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• 제17권2호
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• pp.110-113
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• 2008

Embedded capacitor technology is one of the effective packing technologies for further miniaturization and higher performance of electric packaging system. In this paper, the embedded capacitors were simulated and fabricated in 8-layered printed circuit board employing standard PCB processes. The composites of barium titanante($BaTiO_3$) powder and epoxy resin were employed for the dielectric materials in embedded capacitors. Theoretical considerations regarding the embedded capacitors have been paid to understand the frequency dependent impedance behavior. Frequency dependent impedance of simulated and fabricated embedded capacitors was investigated. Fabricated embedded capacitors have lower self resonance frequency values than that of the simulated embedded capacitors due to the increased parasitic inductance values. Frequency dependent capacitances of fabricated embedded capacitors were well matched with those of simulated embedded capacitors from the 100MHz to 10GHz range. Quality factor of 20 was observed and simulated at 2GHz range in the 10 pF embedded capacitors. Temperature dependent capacitance of fabricated embedded capacitors was presented.

• 반도체디스플레이기술학회지
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• 제11권2호
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• pp.45-51
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• 2012

Multilayer co-extrusion blown film construction is a popular technique for producing plastic films for various packaging industries. Automated detection of defective films can improve the quality of film production process. In this paper, we propose a film inspection system that can detect and classify film defects robustly. In our system, first, film images are acquired through a high speed line-scan camera under an appropriate lighting system. In order to detect and classify film defects, an inspection algorithm is developed. The algorithm divides the typical film defects into two groups: intensity-based and texture-based. Intensity-based defects are classified based on geometric features. Whereas, to classify texture-based defects, a texture analysis technique based on local binary pattern (LBP) is adopted. Experimental results revealed that our film inspection system is effective in detecting and classifying defects for the multilayer co-extrusion blown film construction line.

• 디지털콘텐츠학회 논문지
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• 제18권2호
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• pp.257-266
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• 2017

최근에, 분야별로 다양한 도서가 출판되면서 인터넷이나 오프라인 서점에서 구매 선택폭이 넓어진 상황이다. 그러나 오프라인 서점의 경우 책의 손상을 방지하기 위한 비닐포장 현상이 나타나고 있다. 그 결과 책 내용 확인이 어려워 구매결정에 영향을 주게 되는 요인이 되고 있다. 이러한 요인은 연평균 독서량 감소 현상으로 연결된다. 따라서 본 논문에서는 온라인 및 오프라인 서점의 문제점으로 인한 책 판매 감소 현상을 개선하는 마커(Marker)기술 및 AR을 이용한 도서 정보 알림 서비스 "아이 뷰" 어플리케이션을 제안하고자 한다.

• 한국광학회지
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• 제11권5호
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• pp.340-346
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• 2000

최근 모드변환기가 집적된 진행파형 반도체 광증폭기(SSC-TW-SOA)가 광섬유와의 광결합 효율 향상 및 저가격화를 위해 활발히 연구되고 있다. 본 연구에서는 모드변환기의 구조가 단면 반사율에 미치는 영향을 실험 및 이론적으로 조사하였다. SSC-TW-SOA의 유효단면반사율을 낮추기 위해서는 수직 및 수평방향으로 충분히 모드변환을 행하고 동시에 기운단면 구조를 채용하는 것이 매우 효과적임을 이론적 및 실험적으로 확인하였다. 수직 및 수평방향의 모드변환기가 집적된 TW-SOA에 $20\mu\textrm{m}$ 길이의 창구조, $7^{\circ}$기운단면, 1% 무반사 코팅을 도입함으로써 0.1dB 이하의 작은 ASE ripple를 얻을 수 있었다.

• 한국시뮬레이션학회논문지
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• 제20권3호
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• pp.49-58
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• 2011

설비나 작업자에 대한 부하효율은 제조공장에서 생산용량계획을 수립하는데 중요한 정보다. 즉 공장에서 신제품을 개발하거나, 생산량을 증가시킬 경우, 새로운 투자계획을 수립할 경우에도 항상 설비나 작업자에 대한 부하효율을 검토한다. 이러한 부하효율을 추정하기 위해서 다양한 측정방법이 사용된다. 본 본문에서는 설문조사, 순간관측법, 동영상 촬영을 이용한 미세동작연구방법, ERP시스템에서 자료를 취득하는 방법, 시뮬레이션방법 등 다양한 측정방법의 정확성에 대해 실제 사례를 이용해 비교분석하였다. 본 사례연구는 리드프레임이나 패키징용 부품을 생산하는 국내 반도체부품 생산공장을 대상으로 수행하였다.

• 한국표면공학회지
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• 제36권1호
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• pp.74-78
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• 2003

The corrosion failure of electronic devices has been a major reliability concern lately. This failure is an ongoing concern because of miniaturization of integrated circuits (IC) and the increased use of polymers in electronic packaging. Recently, plasma-polymerized cyclohexane films were considered as a possible candidate for a interlayer dielectric for multilever metallization of ultra large scale integrated (ULSI) semiconductor devices. In this paper the protective ability of above films as a function of deposition temperature and RF power in an 3.5 wt.% NaCl solution were examined by polarization measurement. The film was characterized by FTIR spectroscopy and contact angle measurement. The protective efficiency of the film increased with increasing deposition temperature and RF power, which induced the higher degree of cross-linking and hydrophobicity of the films.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2006년도 제37회 하계학술대회 논문집 C
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• pp.1635-1636
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• 2006

In this paper, a non-vacuum packaged single crystalline silicon MEMS gyroscope is designed, fabricated and tested. To reduce air damping of the gyroscope structure for non-vacuum packaging, air damping model is used and damping is minimized by analysis. The inner and outer spring length is optimized by ANSYS simulation for rigid body motion. The gyroscope is fabricated by SiOG(Silicon On Glass) process. The performance of the gyroscope is measured to evaluate the characteristic of the gyroscope. The sensitivity, non-linearity, noise density and the bias stability are measured to 9.7693 mV/deg/s, 04265 %, 2.3 mdeg/s/rtHz and 16.1014 deg/s, respectively.

• 한국전기전자재료학회논문지
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• 제25권10호
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• pp.830-836
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• 2012

An efficient cooling system is essential for the electronic packaging such as a high-luminance LED lighting. A special heat transport technology, Pulsating Heat Pipe (PHP), can be applied to the cooling of LED lighting. In this paper, the operational characteristics of the PHP in the imposed thermal boundary conditions of LED lighting were experimentally investigated. The experimental PHP was made of copper tubes of internal diameter of 2.1 mm. The working fluids of ethanol, FC-72, water, acetone and R-123 were chosen for comparison. The results showed that an optimum range of charging ratio exists for high cooling performance; 50% for most of the fluids. Among the five working fluids, water showed the highest heat transfer rate of 260 W. Two distinguished characteristics of pulsating direction were identified. It is also identified that high vapor pressure gradient is one of key parameters for better heat transfer performance.

• 한국가구학회지
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• 제28권3호
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• pp.233-247
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• 2017

Woodcraft activities have an inseparable relationship with our daily life, and it is a field that needs to be continued because of the value of education for the growing students. The interest in woodworking from childhood to old age is rapidly expanding nowadays, therefore this study has been done to provide images to those who are engaged in woodcraft business and also those who are interested in this field. If we look at the use of wood in our daily life, We can classify it into Architecture, Civil engineering, Furniture, Musical Instrument, Packaging, Recreational instrument, Exercise instrument, Stationery, Daily commodity, and Industrial use. Among them, We examined kinds of stationery and which type of woods were used. As a result of classifying 101 stationery products in 22 countries, stationery materials using wood can be used for Business cards, Envelope houses, Box houses, Pen holders, Locker plates, Stationery baskets, Book holders, Stamps, Paper knives, Bookmarks, and Photo frames. It was found various wooden stationery are made in USA, Japan, UK, Canada etc. And the most frequently used species are hardwoods such as Walnut (Juglans regia), Maple (Acer spp.), Cherry (Prunus serotina), Birch (Betula spp.), Mahogany (Swietenia macrophylla), Tulip (Liriodendron tulipifera Linnaeus), Bubinga (Guibourtia tessmannii J. Leonard), Wenge (Milletia laurentii De. wild), Cocobolo (Dallbergia cultrata Grah), Zebrawood (Microberlinia brazzavillensis A. Chev.) and Ebony (Diospyros spp.).

• 한국전기전자재료학회논문지
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• 제22권2호
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• pp.123-127
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• 2009

In order to get more higher integration density of devices, it is getting to be used more and more micro via interconnection lines for interconnecting layers or devices. However, it is very important to enhance the electrical characteristic by reducing the electrical resistivity of micro via interconnection line because it affects the reliability of packaging. In this paper, Micro vias were patterned with a diameter from 10 to 100 um by increasing the step of 10 um and 100 um height and were fabricated by micromachining technology to investigate the electrical characteristic of micro via interconnection lines. These micro vias were filled with copper by electroplating process with appling pulse current mode. And the electrical characteristics of micro via interconnection lines were measured. The measured value of electrical resistivity shows with a range from 20 to $26\;m{\Omega}$. This value from micro via interconnection lines fabricated by pulse current mode electroplating process shows better result than the resistivity from than micro via interconnection lines fabricated by DC mode ($31\;m{\Omega}$).