• Journal of Advanced Marine Engineering and Technology
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• v.37 no.4
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• pp.351-357
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• 2013

In flip chip packaging, underfill process is used to fill epoxy bonder into the gap between a chip and a substrate in order to improve the reliability of electronic devices. Underfill process by capillary motion can give rise to unwanted air void formations since the arrangement of solder bumps affects the interfacial dynamics of flow meniscus. In this paper, the unsteady flows in the capillary underfill process are visualized and then the racing effect and merging of the meniscus are investigated according to the arrangement of solder bumps. The result is shown that at higher bump density, the fluid flow perpendicular to the main direction of flow becomes stronger so that more air voids are formed. This phenomenon is more conspicuous at a staggered bump array than at a rectangular bump array.

• Transactions of the Korean Society of Automotive Engineers
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• v.21 no.6
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• pp.183-194
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• 2013

Liquid urea based SCR has been used in the market to reduce NOx in the exhaust emission of the diesel engine vehicle. This system has several problems at low temperature, which are freezing below $-12^{\circ}C$, solid deposit formation in the exhaust, and difficulties in dosing system at exhaust temperature below $200^{\circ}C$. Also, it is required complicated exhaust packaging equipment and mixer due to supply uniform ammonia concentration. In order to solve these issues, solid urea, ammonium carbonate, and ammonium carbamate are selected as ammonia sources for the application of solid SCR. In this paper, basic research on reaction rate of three ammonia-transporting materials was performed. TGA (Thermogravimetric Analysis) and DTA (Differential Thermal Analysis) tests for these materials are carried out for various heating conditions. From the results, chemical kinetic parameters such as activation energy and frequency factor are obtained from the Arrhenius plot. Additionally, from test results of DSC (Differential Scanning Calorimeter) for these materials, chemical kinetic parameters using the Kissinger method are calculated. Activation energies of solid SCR from this experiment are compared with proper data of literature study, then obtained data of this experiment are used for the design of reactor and dosing system for candidate vehicle.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.11 no.4
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• pp.1210-1215
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• 2010

The probe card are test modules which are to classify the good semiconductor chips and thin film before the packaging process. In the rapid growth a technology of semiconductor, the number of pads per unit area is increasing and pad arrays are becoming irregular. Therefore, the technology of probe card needs narrow width and lots of probe tip. In this paper, the probe tip based on the MEMS(Micro Electro Mechanical System)technology was developed a new MEMS probe tip for vertical probe card applications. For the structural designs of probe tip were performed to mechanical characteristics and structural analysis using FEM(Finite Element Method). Also, the contact force of MEMS probe tip compared with FEM results and experimental results. Finally, the MEMS probe card was developed a fine pitch smaller than $50{\mu}m$.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.11
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• pp.6472-6477
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• 2014

This study examined the trends of an illustration artist's art marketing widening its area in recent years and proposes a design concept of color cosmetics. Art marketing is a type of culture marketing and means marketing through exhibitions, performances and other artistic activities. Free artistic sensibility expression in which the artistic motif is melted into a product beyond the works of a particular artist, and the product, in turn, can be reflected in the canvas, has attracted attention. The works of illustrators are widening their area into the item in life not canvas. This paper proposes the color cosmetics design that reflect art marketing. The main target who proposed the design concept was trend-oriented and in their early to mid-20s with a strong personality, showing a strong tendency of attracting attention and being recognized. To emphasize the design concept of color cosmetics packaging design, the progressive image of the target class was reflected through brilliant and intense color combination. The cultural value and meaning are provided as the artistic mood becomes a part of life.

• The Journal of the Acoustical Society of Korea
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• v.39 no.2
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• pp.87-97
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• 2020

In this paper, the design of piezoelectric Micro-machined Ultrasonic Transducer (pMUT) for wideband ultrasonic radiation in air was investigated. One of the methods to achieve wide frequency bandwidth in single device is modeling the transducer to multi-resonance system. The new pMUT was designed as a multi-resonance system with the addition of a suitable acoustic structure to the front and back of a thin film structure. A new pMUT consisting of thin film parts, radiation parts, and packaging parts is designed with a Lumped Parameter Model (L.P.M). Finally, it was validated as a Finite Element Method (FEM) simulation. The final designed pMUT achieved a frequency band of 102 kHz ~ 132 kHz (-3 dB).

• Korean journal of communication and information
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• v.51
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• pp.65-86
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• 2010

This paper reviews the problems and opportunities of Japanese newspaper industry. In the focus are particularly issues related to causes of the crisis and reacting strategies overcoming the crisis. To answer the questions, we conducted in-depth interviews with top-level managers of major newspaper companies in Japan. Secondary data were gathered to complement the interview. Top managers mainly perceived the causes of the crisis as young readers' alienation from newspaper due to the change of media environment and structural factors such as increasing production/distribution costs and diminishing appeals for advertisers. They are implementing several strategies to overcome this crisis - developing newspaper content for young readers; packaging customized on-off line advertisement; extending news distribution via online and mobile platforms; diversifying business into diverse sectors such as real-estate; enhancing brand equity of newspaper; and collaborating with rival newspaper companies in operating news site and joint printing/distribution. Lessons from the case of Japanese newspaper industry may be useful starting points for the Korean newspaper companies agonizing for diminishing circulation and advertising revenues.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.305-308
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• 2006

Advanced mobile communication devices require a bright, high information content display in a small, light-weight, low power consumption package. For portable applications flexible (or conformable) and rugged displays will be the future. In this paper we outline our progress towards developing such a low power consumption active-matrix flexible OLED $(FOLED^{TM})$ display. We demonstrate full color 100 ppi QVGA active matrix OLED displays on flexible stainless steel substrates. Our work in this area is focused on integrating three critical enabling technologies. The first technology component is based on UDC's high efficiency long-lived phosphorescent OLED $(PHOLED^{TM})$ device technology, which has now been commercially demonstrated as meeting the low power consumption performance requirements for mobile display applications. Secondly, is the development of flexible active-matrix backplanes, and for this our team are employing PARC's Excimer Laser Annealed (ELA) poly-Si TFTs formed on metal foil substrates as this approach represents an attractive alternative to fabricating poly-Si TFTs on plastic for the realization of first generation flexible active matrix OLED displays. Unlike most plastics, metal foil substrates can withstand a large thermal load and do not require a moisture and oxygen permeation barrier. Thirdly, the key to reliable operation is to ensure that the organic materials are fully encapsulated in a package designed for repetitive flexing, and in this device we employ a multilayer thin film Barix encapsulation technology in collaboration with Vitex systems. Drive electronics and mechanical packaging are provided by L3 Displays.

• Journal of the Institute of Electronics and Information Engineers
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• v.51 no.3
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• pp.45-54
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• 2014

In this paper, We have designed and fabricated 20 InP Gunn diodes using a current limiting epitaxial structure by MINT's optimized fabrication processes. We have also packaged the fabricated InP Gunn diodes using our optimized packaging method, and then designed and fabricated a W-band waveguide FTO to measure characteristics of the packaged InP Gunn diodes. The packaged InP Gunn diode have a ceramic ring, a Au plated stud and a lid, and a Maltese cross. The fabricated InP Gunn diodes have good RF characteristics such as high output powers (11.8~17 dBm) and limiting low currents (less than 400 mA) between 92.9 and 94.78 GHz.

• Journal of the Korean Society for Precision Engineering
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• v.30 no.9
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• pp.901-908
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• 2013

The introduction of industrial intelligent robot using vision sensor has been interested in automated factory. 2D and 3D vision sensors have used to recognize object and to estimate object pose, which is for packaging parts onto a complete whole. But it is not trivial task due to illumination and various types of objects. Object image has distorted due to illumination that has caused low reliability in recognition. In this paper, recognition method of complex shape object has been proposed. An accurate object region has detected from combined binary image, which has achieved using DoG filter and local adaptive binarization. The object has recognized using neural network, which is trained with sub-divided object class according to object type and rotation angle. Predefined shape model of object and maximal slope have used to estimate the pose of object. The performance has evaluated on ETRI database and recognition rate of 96% has obtained.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.7
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• pp.37-43
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• 2010

As the speed of A/V streaming, the transmission-speed requirement of serial link is continuously increasing. Consequently, commercial standards, which are released previously, are increasing transmission speed in their newly-updated versions. The flexibility between previous and updated versions is very important requirement, therefore, the transceiver which can operates at more than one data rate is important market demand. This paper demonstrates 4-channel 3.2/ 6.4 Gbps transmitter, which is capable of selecting 1, 1.5, 2, and 3 times of pre-emphasis and 200, 300, 400, and 600 mVdiff,p2p of output swing. The prototype chip was fabricated using $0.13{\mu}m$ CMOS process. Its performances are verified on PCB using COB packaging.