• Tribology and Lubricants
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• v.40 no.2
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• pp.67-70
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• 2024

Chemical mechanical planarization (CMP) is an essential process for ensuring high integration when manufacturing semiconductor devices. CMP mainly requires the use of polyurethane-based polishing pads as an ultraprecise process to achieve mechanical material removal and the required chemical reactions. A diamond disk performs pad conditioning to remove processing residues on the pad surface and maintain sufficient surface roughness during CMP. However, the diamond grits attached to the disk cause uneven wear of the pad, leading to the poor uniformity of material removal during CMP. This study investigates the pad wear rate profile according to the swing motion of the conditioner during swing-arm-type CMP conditioning using deep learning. During conditioning, the motion of the swing arm is independently controlled in eight zones of the same pad radius. The experiment includes six swingmotion conditions to obtain actual data on the pad wear rate profile, and deep learning learns the pad wear rate profile obtained in the experiment. The absolute average error rate between the experimental values and learning results is 0.01%. This finding confirms that the experimental results can be well represented by learning. Pad wear rate profile prediction using the learning results reveals good agreement between the predicted and experimental values.

• Tribology and Lubricants
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• v.33 no.4
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• pp.134-140
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• 2017

With the increase in adoption of tilting pad journal bearings (TPJBs), various failure mechanisms related to TPJBs have been reported, of which pad wear is a frequently reported one. Pad wear causes change in geometry of the bearing, which can sometimes result in the failure of the entire system. The objective of this research is to investigate the influence of pad wear on the pad temperature, which is one of the widely used condition monitoring methods for TPJBs. For the theoretical investigation, thermohydrodynamic (THD) analysis was conducted by solving the generalized Reynolds equation and the 3D energy equation. The results of the analysis show that the temperature of the loaded pad increases while that of the unloaded pad decreases, when there is wear on the loaded pads. In addition, the minimum film thickness decreases with an increase in the wear depth. A validation test was conducted with a test rig, which mimics the axial turbine when a test rotor is supported by two TPJBs. The test bearing consists of five pads with a diameter of 60 mm, and a resistance temperature detector (RTD) is installed in the pad for temperature monitoring. The test was performed by replacing the two loaded pads with the worn pad. The test result for the TPJB with wear depth of $30{\mu}m$ show that the temperatures of the loaded pads are $8^{\circ}C$ higher and that of the unloaded pad is $2.5^{\circ}C$ lower than that of the normal TPJB. In addition, the predicted pad temperature shows good agreement with the measured pad temperatures.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 2000.06a
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• pp.62-67
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• 2000

This paper was undertaken to do morphological analysis of wear debris for slipper-Pad of hydraulic rotary acuator. The lubricating wear test was performed under different experimental conditions using the wear test device and wear specimens of the pin on disk type was rubbed in paraffinic base oil by three kinds of lubricating materials, varying applied load, sliding distance. The four shape parameters(50% volumetric diameter, aspect, roundness and reflectivity) are used for morphological analysis of wear debris. The results showed that the four shape parameters of wear debris depend on a kind of the lubricating condition. It was capable of presuming wear volume for slipper-pad of hydraulic rotary acuator on driving time.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.4
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• pp.309-313
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• 2006

Pad surface characteristics such as roughness, groove and wear rate of pad have a effect on the within wafer non-uniformity(WIWNU) in chemical mechanical polishing(CMP). Although WIWNU increases as the uniformity of roughness(Rpk: Reduced peak height) becomes worse in an early stage of polishing time, WIWNU decreases as non-uniformity of the Rpk value. Also, WIWNU decreases with the reduction of the pad stiffness, though original mechanical properties of pad are unchanged by the grooving process. In addition, conditioning process causes the inequality of pad wear during in CMP. The profile of pad wear generated by the conditioning process has a significant effect on the WIWNU. These experiments results could help to understand the effect of pad surface characteristics in CMP.

• Tribology and Lubricants
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• v.38 no.1
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• pp.1-7
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• 2022

Chemical-mechanical polishing (CMP) process is a semiconductor process that planarizes a wafer surface using mechanical friction between a polishing pad and a substrate surface during a specific chemical reaction. During the CMP process, polishing pad conditioning is applied to prevent the rapid degradation of the polishing quality caused by polishing pad glazing through repeated material removal processes. However, during the conditioning process, uneven wear on the polishing pad is inevitable because the disk on which diamond particles are electrodeposited is used. Therefore, the abrasion of the polishing pad should be considered not only for the variables during the conditioning process but also when designing the CMP conditioning system. In this study, three design variables of the conditioning system were analyzed, and the effect on the pad wear profile during conditioning was investigated. The three design variables considered in this study were the length of the conditioner arm, diameter of the conditioner disk, and distance between centers. The Taguchi method was used for the experimental design. The effect of the three design variables on pad wear and uniformity was assessed, and new variables used in conditioning system design were proposed.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.38-39
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• 2005

We have investigated the effect of the pad surface characteristics such as roughness, groove density and wear of pad on within wafer non-uniformity(WIWNU) in chemical mechanical polishing(CMP). We found that WIWNU increases as pad surface roughness($R_{pk}$; Reduced peak height) increases in an early stage of polishing. But after polishing time goes to a certain extent, WIWNU decreases as uniformity of pad surface roughness. Also, groove of pad has effect on relative pad stiffness although original mechanical properties of pad are unchanged by grooving. WIWNU decreases as relative pad stiffness decreases. In addition, conditioning process causes non-uniform wear of pad during in CMP. The profile of pad wear has a significant effect on WIWNU.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.32 no.11
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• pp.930-936
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• 2008

This paper studies the effect of pad at initial stage and wear during braking on the dynamic contact pressure distribution. Wear is influenced by variable factor (contact pressure, sliding speed, radius, temperature) during dynamic braking and variation in contact pressure distribution. Many researchers have conducted complex eigenvalue analysis considering wear characteristic with Lim and Ashby wear map. The conventional analysis method is assumed the pad has smooth and flat surfaces. The purpose of this paper is to validate that wear rate induced by braking is considered for the precise squeal prediction. After obtaining pad wear from experiment, it is incorporated with FE model of brake system. Finally, the comparisons in fugitive nature of squeal will be carried out between the complex eigenvalue analysis and noise dynamometer experiment.

• Journal of the Korean Society of Industry Convergence
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• v.23 no.6_2
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• pp.1051-1058
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• 2020

The chemical mechanical planarization (CMP) is a process of physically and chemically polishing the semiconductor substrate. The planarization quality of a substrate can be evaluated by the within wafer non-uniformity (WIWNU). In order to improve WIWNU, it is important to manage the pad profile. In this study, a device capable of non-contact measurement of the pad thickness profile was developed. From the measured pad profile, the profile of the pad surface and the groove was extracted using the envelope function, and the pad thickness profile was derived using the difference between each profile. Thickness profiles of various CMP pads were measured using the developed PMS and envelope function. In the case of IC series pads, regardless of the pad wear amount, the envelopes closely follow the pad surface and grooves, making it easy to calculate the pad thickness profile. In the case of the H80 series pad, the pad thickness profile was easy to derive because the pad with a small wear amount did not reveal deep pores on the pad surface. However, the pad with a large wear amount make errors in the lower envelope profile, because there are pores deeper than the grooves. By removing these deep pores through filtering, the pad flatness could be clearly confirmed. Through the developed PMS and the pad thickness profile calculation method using the envelope function, the pad life, the amount of wear and the pad flatness can be easily derived and used for various pad analysis.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.1 no.1
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• pp.89-100
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• 2002

The purpose if this research was to improve the pressure distribution on the disk brake pad Not uniform pressure distribution on the disk brake pad generate the unbalance wear of it and the unbalance wear of disk brake pad generate vibration, noise, heat and reduce the braking capacity. For improve the pressure distribution on the pad in this research, upper face of caliper housing finger was cut. Two kinds of caliper which uncut and cut of finger face were compared the stress distribution by FEM analysis and real experiment. Also natural frequency and deforming displacement ware calculated. It was understood that pressure distribution could Improve by cut inside upper face of caliper housing finger.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2000.04a
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• pp.285-290
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• 2000

This paper was undertaken to do morphological analysis of wear debris for slipper-pad of hydrauric rotary acuator. The lubricating wear test was performed under different experimental conditions using the wear test device and wear specimens of the pin on disk type was rubbed in paraffinic base oil by three kinds of lubricating materials. varying applied load, sliding distance. The four shape parameters(50% volumetric diameter, aspect, roundness and reflectivity) are used showed that the four shape parameters of wear debris depend on a kind of the lubricating condition. It was capable of presuming wear volume for slipper-pad of hydrauric rotary acuator on driving time.