• Title/Summary/Keyword: Pad Temperature

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Development of a Predictive Model Describing the Growth of Listeria Monocytogenes in Fresh Cut Vegetable (샐러드용 신선 채소에서의 Listerio monocytogenes 성장예측모델 개발)

  • Cho, Joon-Il;Lee, Soon-Ho;Lim, Ji-Su;Kwak, Hyo-Sun;Hwang, In-Gyun
    • Journal of Food Hygiene and Safety
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    • v.26 no.1
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    • pp.25-30
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    • 2011
  • In this study, predictive mathematical models were developed to predict the kinetics of Listeria monocytogenes growth in the mixed fresh-cut vegetables, which is the most popular ready-to-eat food in the world, as a function of temperature (4, 10, 20 and $30^{\circ}C$). At the specified storage temperatures, the primary growth curve fit well ($r^2$=0.916~0.981) with a Gompertz and Baranyi equation to determine the specific growth rate (SGR). The Polynomial model for natural logarithm transformation of the SGR as a function of temperature was obtained by nonlinear regression (Prism, version 4.0, GraphPad Software). As the storage temperature decreased from $30^{\circ}C$ to $4^{\circ}C$, the SGR decreased, respectively. Polynomial model was identified as appropriate secondary model for SGR on the basis of most statistical indices such as mean square error (MSE=0.002718 by Gompertz, 0.055186 by Baranyi), bias factor (Bf=1.050084 by Gompertz, 1.931472 by Baranyi) and accuracy factor (Af=1.160767 by Gompertz, 2.137181 by Baranyi). Results indicate L. monocytogenes growth was affected by temperature mainly, and equation was developed by Gompertz model (-0.1606+$0.0574^*Temp$+$0.0009^*Temp^*Temp$) was more effective than equation was developed by Baranyi model (0.3502-$0.0496^*Temp$+$0.0022^*Temp^*Temp$) for specific growth rate prediction of L.monocytogenes in the mixed fresh-cut vegetables.

Macro and Microscopic Investigation on Fracture Specimen of Alloy 617 Base Metal and Weldment in Low Cycle Fatigue Regime (저사이클 피로 영역에서의 Alloy 617 모재와 용접재의 파괴 시험편에 대한 거시적 및 미시적 관찰)

  • Kim, Seon Jin;Dewa, Rando Tungga;Kim, Woo Gon;Kim, Eung Seon
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.40 no.6
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    • pp.565-571
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    • 2016
  • This paper investigates macro- and microscopic fractography performed on fracture specimens from low cycle fatigue (LCF) testings through an Alloy 617 base metal and weldments. The weldment specimens were taken from gas tungsten arc welding (GTAW) pad of Alloy 617. The aim of the present study is to investigate the macro- and microscopic aspects of the low cycle fatigue fracture mode and mechanism of Alloy 617 base metal and GTAWed weldment specimens. Fully axial total strain controlled fatigue tests were conducted at room temperature with total strain ranges of 0.6, 0.9, 1.2 and 1.5%. Macroscopic fracture surfaces of Alloy 617 base metal specimens showed a flat type normal to the fatigue loading direction, whereas the GTAWed weldment specimens were of a shear/star type. The fracture surfaces of both the base metal and weldment specimens revealed obvious fatigue striations at the crack propagation regime. In addition, the fatigue crack mechanism of the base metal showed a transgranular normal to fatigue loading direction; however, the GTAWed weldment specimens showed a transgranular at approximately $45^{\circ}$ to the fatigue loading direction.

Studies on the Interfacial Reaction of Screen-Printed Sn-37Pb, Sn-3.5Ag and Sn-3.8Ag-0.7Cu Solder Bumps on Ni/Au and OSP finished PCB (Ni/Au 및 OSP로 Finish 처리한 PCB 위에 스크린 프린트 방법으로 형성한 Sn-37Pb, Sn-3.5Ag 및 Sn-3.8Ag-0.7Cu 솔더 범프 계면 반응에 관한 연구)

  • Nah, Hae-Woong;Son, Ho-Young;Paik, Kyung-Wook;Kim, Won-Hoe;Hur, Ki-Rok
    • Korean Journal of Materials Research
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    • v.12 no.9
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    • pp.750-760
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    • 2002
  • In this study, three solders, Sn-37Pb, Sn-3.5Ag, and Sn-3.8Ag-0.7Cu were screen printed on both electroless Ni/Au and OSP metal finished micro-via PCBs (Printed Circuit Boards). The interfacial reaction between PCB metal pad finish materials and solder materials, and its effects on the solder bump joint mechanical reliability were investigated. The lead free solders formed a large amount of intermetallic compounds (IMC) than Sn-37Pb on both electroless Ni/Au and OSP (Organic Solderabilty Preservatives) finished PCBs during solder reflows because of the higher Sn content and higher reflow temperature. For OSP finish, scallop-like $Cu_{6}$ /$Sn_{5}$ and planar $Cu_3$Sn intermetallic compounds (IMC) were formed, and fracture occurred 100% within the solder regardless of reflow numbers and solder materials. Bump shear strength of lead free solders showed higher value than that of Sn-37Pb solder, because lead free solders are usually harder than eutectic Sn-37Pb solder. For Ni/Au finish, polygonal shaped $Ni_3$$Sn_4$ IMC and P-rich Ni layer were formed, and a brittle fracture at the Ni-Sn IMC layer or the interface between Ni-Sn intermetallic and P-rich Ni layer was observed after several reflows. Therefore, bump shear strength values of the Ni/Au finish are relatively lower than those of OSP finish. Especially, spalled IMCs at Sn-3.5Ag interface was observed after several reflow times. And, for the Sn-3.8Ag-0.7Cu solder case, the ternary Sn-Ni-Cu IMCs were observed. As a result, it was found that OSP finished PCB was a better choice for solders on PCB in terms of flip chip mechanical reliability.

Development of Polymer Elastic Bump Formation Process and Bump Deformation Behavior Analysis for Flexible Semiconductor Package Assembly (유연 반도체 패키지 접속을 위한 폴리머 탄성범프 범핑 공정 개발 및 범프 변형 거동 분석)

  • Lee, Jae Hak;Song, Jun-Yeob;Kim, Seung Man;Kim, Yong Jin;Park, Ah-Young
    • Journal of the Microelectronics and Packaging Society
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    • v.26 no.2
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    • pp.31-43
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    • 2019
  • In this study, polymer elastic bumps were fabricated for the flexible electronic package flip chip bonding and the viscoelastic and viscoplastic behavior of the polymer elastic bumps according to the temperature and load were analyzed using FEM and experiments. The polymer elastic bump is easy to deform by the bonding load, and it is confirmed that the bump height flatness problem is easily compensated and the stress concentration on thin chip is reduced remarkably. We also develop a spiral cap type and spoke cap type polymer elastic bump of $200{\mu}m$ diameter to complement Au metal cap crack phenomenon caused by excessive deformation of polymer elastic bump. The proposed polymer elastic bumps could reduce stress of metal wiring during bump deformation compared to metal cap bump, which is completely covered with metal wiring because the metal wiring on these bumps is partially patterned and easily deformable pattern. The spoke cap bump shows the lowest stress concentration in the metal wiring while maintaining the low contact resistance because the contact area between bump and pad was wider than that of the spiral cap bump.

Progress of Composite Fabrication Technologies with the Use of Machinery

  • Choi, Byung-Keun;Kim, Yun-Hae;Ha, Jin-Cheol;Lee, Jin-Woo;Park, Jun-Mu;Park, Soo-Jeong;Moon, Kyung-Man;Chung, Won-Jee;Kim, Man-Soo
    • International Journal of Ocean System Engineering
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    • v.2 no.3
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    • pp.185-194
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    • 2012
  • A Macroscopic combination of two or more distinct materials is commonly referred to as a "Composite Material", having been designed mechanically and chemically superior in function and characteristic than its individual constituent materials. Composite materials are used not only for aerospace and military, but also heavily used in boat/ship building and general composite industries which we are seeing increasingly more. Regardless of the various applications for composite materials, the industry is still limited and requires better fabrication technology and methodology in order to expand and grow. An example of this is that the majority of fabrication facilities nearby still use an antiquated wet lay-up process where fabrication still requires manual hand labor in a 3D environment impeding productivity of composite product design advancement. As an expert in the advanced composites field, I have developed fabrication skills with the use of machinery based on my past composite experience. In autumn 2011, the Korea government confirmed to fund my project. It is the development of a composite sanding machine. I began development of this semi-robotic prototype beginning in 2009. It has possibilities of replacing or augmenting the exhaustive and difficult jobs performed by human hands, such as sanding, grinding, blasting, and polishing in most often, very awkward conditions, and is also will boost productivity, improve surface quality, cut abrasive costs, eliminate vibration injuries, and protect workers from exposure to dust and airborne contamination. Ease of control and operation of the equipment in or outside of the sanding room is a key benefit to end-users. It will prove to be much more economical than normal robotics and minimize errors that commonly occur in factories. The key components and their technologies are a 360 degree rotational shoulder and a wrist that is controlled under PLC controller and joystick manual mode. Development on both of the key modules is complete and are now operational. The Korean government fund boosted my development and I expect to complete full scale development no later than 3rd quarter 2012. Even with the advantages of composite materials, there is still the need to repair or to maintain composite products with a higher level of technology. I have learned many composite repair skills on composite airframe since many composite fabrication skills including repair, requires training for non aerospace applications. The wind energy market is now requiring much larger blades in order to generate more electrical energy for wind farms. One single blade is commonly 50 meters or longer now. When a wind blade becomes damaged from external forces, on-site repair is required on the columns even under strong wind and freezing temperature conditions. In order to correctly obtain polymerization, the repair must be performed on the damaged area within a very limited time. The use of pre-impregnated glass fabric and heating silicone pad and a hot bonder acting precise heating control are surely required.

Comparative study of volumetric change in water-stored and dry-stored complete denture base (공기중과 수중에서 보관한 총의치 의치상의 체적변화에 대한 비교연구)

  • Kim, Jinseon;Lee, Younghoo;Hong, Seoung-Jin;Paek, Janghyun;Noh, Kwantae;Pae, Ahran;Kim, Hyeong-Seob;Kwon, Kung-Rock
    • The Journal of Korean Academy of Prosthodontics
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    • v.59 no.1
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    • pp.18-26
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    • 2021
  • Purpose: Generally, patients are noticed to store denture in water when removed from the mouth. However, few studies have reported the advantage of volumetric change in underwater storage over dry storage. To be a reference in defining the proper denture storage method, this study aims to evaluate the volumetric change and dimensional deformation in case of underwater and dry storage. Materials and methods: Definitive casts were scanned by a model scanner, and denture bases were designed with computer-aided design (CAD) software. Twelve denture bases (upper 6, lower 6) were printed with 3D printer. Printed denture bases were invested and flasked with heat-curing method. 6 upper and 6 lower dentures were divided into group A and B, and each group contains 3 upper and 3 lower dentures. Group A was stored dry at room temperature, group B was stored underwater. Group B was scanned at every 24 hours for 28 days and scanned data was saved as stereolithography (SLA) file. These SLA files were analyzed to measure the difference in volumetric change of a month and Kruskal-Wallis test were used for statistical analysis. Best-fit algorithm was used to overlap and 3-dimensional color-coded map was used to observe the changing pattern of impression surface. Results: No significant difference was found in volumetric changes regardless of the storage methods. In dry-stored denture base, significant changes were found in the palate of upper jaw and posterior lingual border of lower jaw in direction away from the underlying tissue, maxillary tuberosity of upper jaw and retromolar pad area of lower jaw in direction towards the underlying tissue. Conclusion: Storing the denture underwater shows less volumetric change of impression surface than storing in the dry air.