• Journal of the Semiconductor & Display Technology
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• v.18 no.1
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• pp.25-31
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• 2019

In this study, a new adhesion evaluating equipment and data processing methods were developed to overcome some limitations of existing evaluating equipment. Nano-diamond coated tool is a specimen of experiment. When applying frictional force and shear force on the specimen by a rotating polishing pad, delamination occurs at a moment. During each experiment, the vibration, load, and torque is obtained by accelerometer, loadcell and torque s+ kpensor. Frictional force and coefficient of friction are obtained by calculating torque and load. Based on FFT transformation, acceleration is processed and analyzed. As a result, the moment of delamination and the load at that time can be detected by the new developed equipment and measurement system. Finally, we call this load as an Adhesion force.

• Proceedings of the KSR Conference
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• 2006.11b
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• pp.294-299
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• 2006

Korean high speed train(HSR-350x) has adopted a combined electrical and mechanical(friction) braking system. Brake blending control unit(BBCU) controls each brake system to fulfill the required brake performances such as braking distance, deceleration and jerk. When the disc brake is applied in the high speed region, the wear of pad is increased rapidly. In this paper, we discuss the optimized patterns of the disc brake force from the view point of braking energy.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1517-1520
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• 2003

In this paper, we design a wedge type rail-clamp which can protect container crane from wind with constant clamping force regardless of the operating period. When we design wedge type rail clamp, it is important to determine the weight for locker to descent smoothly with an initial clamping force of rail and pad. Therefor, this paper suggest a process to decide a wright within proper range which could be obtained using FEA of wedge type rail clamp.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.11a
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• pp.127-128
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• 2010

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.455-456
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• 2011

• Proceedings of the KSR Conference
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• 2007.05a
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• pp.786-791
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• 2007

Korean high speed train(HSR-350x) has adopted a combined electrical and mechanical(friction) braking system. Brake blending control unit(BBCU) controls each brake system to fulfill the required brake performances such as braking distance, deceleration and jerk. Also the braking system should be designed considering the economical management, such as effective use of generated braking energy and the minimum wear of friction materials(a pad and a brake shoe). In this paper, we establish the disc braking force pattern that reduces the wear of pad in the disc braking system by minimizing the variance of the instantaneous disk baking energy during braking time, and compare the wear mass of pad between the conventional disc braking force pattern and the established results.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.17 no.3
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• pp.622-628
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• 2016

As the suction pad-supporting bike carrier attached to a car may be subject to an excessive dynamic load due to random vibrations and centrifugal forces during driving, its structural safety is of great concern. To examine this, the finite-element method with a fluid-structure interaction should be used because the pressure on the pad bottom is changed in real time according to the fluctuations of the force or the moment applied on the pad. This method, however, has high computing costs in terms of modeling efforts and software expense. Moreover, the accuracy of computation is not easily guaranteed. Therefore, a new method combining the experiment and computation is proposed in this paper: the bottom pressure and contact area of the pad under varying loads was measured in real time and the acquired data are then used in the nonlinear elastic finite-element calculations. The computational and experimental results obtained with the product under development showed that the safety margin of the pad under the axial loading is relatively sufficient, whereas with an excessive rotational loading, the pad is vulnerable to separation or a local surface damage; hence, the safety margin may not be secured. The predicted contact behavior under the variation of the magnitude and type of the loading were in good agreement with the one from the experiment. The proposed analysis method in this study could be used in the design of similar vacuum pad systems.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.10
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• pp.1049-1055
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• 2004

Chemical Mechanical Polishing (CMP) is referred to as a three body tribological system, because it includes two solids in relative motion and the CMP slurry. On the assumption that the abrasives between the pad and the wafer could be a major reason not only for the friction force but also for material removal during polishing, the friction force generated during CMP process was investigated with the change of abrasive size and concentration of CMP slurry. The threshold point of average coefficient of friction (COF) with increase in abrasives concentration during interlayer dielectric (ILD) CMP was found experimentally and verified mathematically based on contact mechanics. The predictable models, Mode I (wafer is in contact with abrasives and pad) and Mode II (wafer is in contact with abrasives only), were proposed and used to explain the threshold point. The average COF value increased in the low abrasives concentration region which might be explained by Mode I. In contrast the average COF value decreased at high abrasives concentration which might be regarded to as Mode II. The threshold point observed seemed to be due to the transition from Mode I to Mode II. The tendency of threshold point with the variation of abrasive size was studied. The increase of particle radius could cause contact status to reach transition area faster. The correlation between COF and material removal rate was also investigated from the tribological and energetic point of view. Due to the energy loss by vibration of polishing equipment, COF value is not proportional to the material removal rate in this experiment.

• International Journal of Automotive Technology
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• v.8 no.2
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• pp.211-217
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• 2007

The wheel slip control systems are able to control the braking force more accurately and can be adapted to different vehicles more easily than conventional ABS (Anti-lock Brake System) systems. In realizing the wheel slip control systems, real-time information such as the tire braking force at each wheel is required. In addition, the optimal target slip values need to be determined depending on the braking objectives such as minimum braking distance and stability enhancement. In this paper, a robust wheel slip controller is developed based on the adaptive sliding mode control method and an optimal target slip assignment algorithm is proposed for maximizing the braking force. An adaptive law is formulated to estimate the braking force in real-time. The wheel slip controller is designed based on the Lyapunov stability theory considering the error bounds in estimating the braking force and the brake disk-pad friction coefficient. The target slip assignment algorithm searches for the optimal target slip value based on the estimated braking force. The performance of the proposed wheel slip control system is verified in HILS (Hardware-In-the-Loop Simulator) experiments and demonstrates the effectiveness of the wheel slip control in various road conditions.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.3
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• pp.31-35
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• 2022

Recently, with the 4th industrial revolution, the demand for high-density semiconductors for large-capacity data processing is increasing. Researchers are interested in researching the reliability of surface mount technology (SMT). In this study, the effect of PCB pad design on assembly and adhesion reliability of passive component was analyzed using design of experiment (DOE). The DOE method was established using the pad length, width, and distance between pads of the PCB as variables. The assembly defect rate of the passive element after the reflow process was derived according to the misplacement direction of the chip resistor. The shear force between the passive element and the PCB was measured using shear tests. In addition, the shape of the solder according to the pad design was analyzed through cross-sectional analysis.