• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.11a
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• pp.38-38
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• 2004

• Journal of the Microelectronics and Packaging Society
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• v.2 no.2
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• pp.57-64
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• 1995

본 연구의 목적은 MCM제품들을 개발하기 전단계로 MCM의 설계 및 MCM 설계에 필요한 CAD에 관한 현황을 조사 및 연구한 것이다.결과적으로 현재 MCM에 관하여 풀어 야 할 문제들을 도출하였으며 차후 이보고서가 MCM 및 HIC분야의 설계 CAD 선택을 연 구하는 Engineer들에게 좋은 자료로 활용될 것으로 판단된다.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.09a
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• pp.33-49
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• 2002

$\Box$ LTCC/LTCC-M technologies are a cost-effective SOP technology $\Box$ LTCC/LTCC-M materials have good RF characteristics and the materials can be used as excellent substrates for high band width applications $\Box$ Reliability of LTCC/LTCC-M package or module can be greatly improved by embedded passive technology and CTE control of the substrates $\Box$ To expand the application area, more development is needed in realization of embedded passives with tight tolerance

• Journal of the Microelectronics and Packaging Society
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• v.4 no.1
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• pp.31-38
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• 1997

대용량, 고속정보처리가 요구되는 B-ISDN용 스위칭 모듈은 90년초부터 MCM으로 제작후 사용되어 왔다. 특히 MCM은 Data 처리의 고속성 및 회로의 고집적이 요구되는 ATM, GPS 및 개인휴대 통신 분야에 광범위하게 개발 및 응용되고 있다. 따라서 본논문에 서는 고속, 고집적 ATM 교환기의 Switching Module을 제품의 Low Cost와 다충회로를 간 단하게 구현할수 있는"Diffusion patterning"(이하 DP)공정과 기보유중인 Thin Film 공정으 로 MCM을 구현하였다.CM을 구현하였다.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.1
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• pp.19-25
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• 2008

In this paper, the front end module (FEM) was proposed for 2.4GHz WLAN band by LTCC multilayer application. The FEM was composed of power amplifier IC, switch IC, and LTCC module. LTCC module consists of output matching circuit and lowpass filter as Tx part, bandpass filter as Rx part. Design of output matching circuit for LTCC was used matching parameter from output matching circuit based on lumped circuit on the PCB board. The dielectric constant of LTCC substrate is 9. The substrate was composed of total 26 layers with each 30um thickness. Ag paste was used for the internal pattern as the conductor material. The size of the module is $4.5mm{\times}3.2mm{\times}1.4mm$. The fabricated FEM showed the gain of 21dB, ACPR of less than -31dBc first side lobe and Less than -59dBc second side lobe and the output power of 23Bm at P1dB.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2006.10a
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• pp.283-291
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• 2006

[ $\blacksquare$ ] Mega Trends $\blacksquare$ Ceramic Based Module -> PCB Based SiP $\blacksquare$ Mobile SiP decreases footprint more than 40% than discrete

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.11a
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• pp.63-63
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• 2004

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.10a
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• pp.39-45
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• 2000

A small camera module fabricated by including bare chip bonding methods is utilized to realize advanced mobile devices. One of the driving forces is the TOG (Tape On Glass) bonding method which reduces the packaging size of the image sensor clip. The TOG module is a new thinner and smaller image sensor module, using flip chip interconnection method with the ACP (Anisotropic Conductive Paste). The TOG production process was established by determining the optimum bonding conditions for both optical glass bonding and image sensor clip bonding lo the flexible PCB. The bonding conditions, including sufficient bonding margins, were studied. Another bonding method is the flip chip bonding method for DSP (Digital Signal Processor) chip. A new AC\ulcorner was developed to enable the short resin curing time of 10 sec. The bonding mechanism of the resin curing method was evaluated using FEM analysis. By using these flip chip bonding techniques, small camera module was realized.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2006.10a
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• pp.1-20
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• 2006

• Corrugated packaging logistics
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• v.3 no.11
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• pp.38-55
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• 1996