• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.15 no.1
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• pp.7-16
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• 2009

The purpose of this study was to evaluate current packaging modules and design the most acceptable packaging module for domestic and international distribution systems. An optimum packaging module can reduce package costs as well as total distribution costs such as transport, materials handling and warehouse costs. Three different sizes of packaging modules, namely U-type($600{\times}500\;mm$), K -ype($550{\times}366\;mm$) and I-type($600{\times}400\;mm$), were evaluated in terms of the area efficiency and MOEs(measures of effectiveness) for the T-11($1100{\times}1100mm$) and T-12($1,200{\times}1,000\;mm$) pallets. The results showed that the U-type module could fit very well for both pallets and the area efficiency of each module was more than 99 percents. Area efficiency of K-and I-type modules was greatly affected by the pallet footprint dimensions. U-type module also performed better result from MOEs evaluation. Twenty sub-multiple sizes derived from the U-type module were suggested for the future development of the Korean and ISO standards on dimension of transport packages.

• Journal of the Microelectronics and Packaging Society
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• v.1 no.2
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• pp.143-146
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• 1994

본 연구에서는 900MHz PLL Module을 설계제조하였다. 제안된 PLL Module은 900MHz VCO 및 PLL Controller로 구성되었다. PLL Module의 출력레벨은 -2dBm이었다.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.6 no.1
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• pp.12-18
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• 2000

If optimum design technique is applied in the design of packaging container for bulk materials, merits on the side of not only economic and compression performance but distribution efficiency are expected. In this study, on the ground of the optimum models for required board area and compression strength performance, optimum design program having faculties of outward and inward optimum design and information design was developed. This program was composed of input module, output module, database and management module, and calculation module. Though the packaging specifications ars same, requied board area, board composition and cost of container were greatly different according to exterior packaging conditions. Also, about 12% in weight of container was lighter, and about $13{\sim}17%$ in cost of container was reduced when the program was applied for 2 kinds of bulk materials.

• Journal of the Microelectronics and Packaging Society
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• v.4 no.2
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• pp.63-70
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• 1997

본 연구에는 휴대용 전화기의 핵심부품인 PLl Module의 초소형화 설계기술 표면실 장기술, 고주파 설계기술, 소형화 SMD 기술, Test 기술 및 PLL Module 활용기술 등을 개 발하였으며 차세대 Digital PLL Module의 설계기반 마련 및 대외 경쟁력 있는 PLl Module 의 초소형화 기술을 확보하였다.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.10 no.1
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• pp.27-36
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• 2004

Software summarized packaging technology related is needed for low cost and high efficiency in production and packaging design of corrugated board, and in development of these softwares, distribution and packaging environment of one's country must be reflected, well. In domestic occasion, software related to corrugated board packaging dont's exist nearly, and in many industrial fields, the more higher role and importance of packaging in various industrial field is, the more higher necessity of that is. In this study, on the base of preceeding studies (Park, 2001; 2003; 2003), software to optimize board combination that is most importance and sensitivity in composition of cost elements in production and packaging design of corrugated board was developed. This software was composed of input module, output module, database and management module, and calculation module, and efficiency of this software was analyzed on the both sides of sensitivity in design result and effectiveness in a case analyse. In the inward design results having same strength, board combination balance, bursting strength, box weight, and cost were greatly different. Therefore, optimum inward design according to user's design specifications is possible, and in a case analysis for actual products, obtained the more profitable results than before design.

• Journal of the Semiconductor & Display Technology
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• v.18 no.4
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• pp.149-153
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• 2019

The technology of electronic packaging among semiconductor technologies is evolving as an axis of the market in its own field beyond the simple assembly process of the past. In the field of electronic packaging technology, the packaging of power modules plays an important role for green electric vehicles. In this power module packaging, the thermal reliability is an important factor, and silicon nitride plays an important part of package substrates, Silicon nitride is a compound that is not found in nature and is made by chemical reaction between silicon and nitrogen. In this study, this core material, silicon nitride, was fabricated by reaction bonded silicon nitride. The fabricated silicon nitride was studied for thermo-mechanical properties, and through this, the structure of power module packaging was made using reaction bonded silicon nitride. And the characteristics of stress were evaluated using finite element analysis conditions. Through this, it was confirmed that reaction bonded silicon nitride could replace the silicon nitride as a package substrate.

• Journal of Korea Society of Digital Industry and Information Management
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• v.10 no.3
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• pp.261-272
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• 2014

Home appliances go through a couple of packaging stages from the plant to consumers. The primary packaging, inner packaging for each part, happens for protection after products leave the plant. The secondary packaging happens in the unit of product, ensuring cushioning packaging to protect products from movement. The final tertiary packaging is for transportation and delivery. Each stage of product packaging, however, costs a lot of money because of disposable packaging materials used in each stage including vinyl, tapes, Styrofoam, and corrugated cardboards. Discarded packaging materials also cause environmental problems. In an effort to come up with a measure to solve those problems, this study proposed a plan to minimize logistics costs with semi-permanent packaging materials to replace disposable ones including Styrofoam, vinyl, and corrugated cardboards in the stages of inner packaging, cushioning packaging, product unit-based packaging, and transportation. The study also developed a model to cut down logistics costs by reducing various packaging stages including the primary, secondary, and tertiary stage only to the secondary one through module-type products instead of the transportation- and delivery-type ones, as well as demonstrated the excellence of the study through numerical analysis.

• Journal of the Microelectronics and Packaging Society
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• v.4 no.2
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• pp.79-83
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• 1997

본 연구에서는 휴대용 전화기 및 무선 LAN 의 핵심부품인 RF-Switch Module의 초소형화 설계기술, 표면실장기술, 고주파설계기술, 소형화 SMD기술, Test 기술 및 RF-Switch Module 활용기술 등을 개발하였으며 RF-Switch Module의 설계기반 마련 및 대외 경쟁력 있는 RF-Switch Module의 초소형화 기술을 확보하였다.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.4
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• pp.7-13
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• 2019

Power module is getting attention from electronic industries such as solar cell, battery and electric vehicles. Transient liquid phase (TLP) boding, sintering with Ag and Cu powders and wire bonding are applied to power module packaging. Sintering is a popular process but it has some disadvantages such as high cost, complex procedures and long bonding time. Meanwhile, TLP bonding has lower bonding temperature, cost effectiveness and less porosity. However, it also needs to improve ductility of the intermetallic compounds (IMCs) at the joint. Wire boding is also an important interconnection process between semiconductor chip and metal lead for direct bonded copper (DBC). In this study, TLP bonding using Sn-based solders and wire bonding process for power electronics packaging are described.

• The monthly packaging world
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• s.85
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• pp.132-138
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• 2000