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J. W. Yoon, J. H. Bang, Y. H. Ko, S. H. Yoo, J. K. Kim, and C. W. Lee, "Power Module Packaging Technology with Extended Reliability for Electric Vehicle Applications", J. Microelectron. Packag. Soc., 21(4), 1 (2014).
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Motioncontrol, Motion Control Co., "Global Market Trends for Automation and Industrial Power Modules", Jun. (2015), from http://www.motioncontrol.co.kr/default/news/?nwsid=n3&uid=9370
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Wikipedia, Wikipedia Foundation. Lnc., from http://en.wikipedia.org/wiki/Powermodule
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4 |
M. H. Roh, H. Nishikawa, and J. P. Jung, "A Review of Ag Paste Bonding for Automotive Power Device Packaging", J. Microelectron. Packag. Soc., 22(4), 15 (2015).
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5 |
S. H. Rajendran, D. H. Jung, W. S. Cheon, and J. P. Jung, "Transient Liquid Phase Bonding of Copper using Sn Coated Cu MWCNT Composite Powders for Power Electronics", Appl. Sci., 9(3), 529 (2019).
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6 |
M. H. Roh, H. Nishikawa, J. P. Jung, and W. J. Kim, "Transient Liquid Phase Bonding for Power Module Packaging", J. Microelectron. Packag. Soc., 24(1), 27 (2017).
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7 |
G. S. Hoppin III and T. F. Berry, "Activated Diffusion Bonding", Weld. J., 49(11), 505 (1970).
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8 |
D. S. Duvall, W. A. Owczarski, and D. F. Paulonis, "Transient Liquid Phase Bonding: A New Method for Joining Heat Resistant Alloys", Weld. J., 53(4), 203 (1974).
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9 |
J. P. Jung and C. S. Kang, "Transient Liquid Phase Process in Ni-B Joining", Mater. Trans., JIM, 38(10), 886 (1997).
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10 |
J. P. Jung and C. S. Kang, "Liquid Phase Diffusion Bonding of Rene80 Using Pure Boron", Mater. Trans., JIM, 37(5), 1008 (1996).
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11 |
J. P. Jung, and C. S. Kang, "Mechanical Property of Liquid Phase Diffusion Bonded Joint of Rene80 / B / Rene80", J. of Kor. Weld. Soc., 13(3), 125 (1995).
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J. P. Jung, C. D. Lee, and C. S. Kang, "A study on the melting induced bonding of 304 stainless steel", J. of Kor. Inst. of Met. & Mater., 31(3), 323 (1993).
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J. P. Jung and C. S. Kang, "Liquid metal formation of Ni/B/Ni diffusion bonded joint", J. of Kor. Inst. of Met. & Mater., 33(10), 1302 (1995).
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14 |
J. P. Jung and C. S. Kang, "A study on the width of liquid layer of Ni/B/Ni diffusion bonding system", J. of Kor. Weld. Soc., 13(4), 402 (1995).
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15 |
J. P. Jung and C. S. Kang, "Liquid phase diffusion bonding procedure of Rene80/B/Rnene80 system", J. of Kor. Weld. Soc., 13(2), 172 (1995).
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16 |
S. H. Rajendran, D. H. Jung, W. S. Jeon, and J. P. Jung, "Transient Liquid Phase Bonding of Copper Using Sn Coated Cu MWCNT Composite Powders of Power Electronics", Appl. Sci., 9(3), 529 (2019).
DOI
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17 |
H. J. Kang, J. H. Lee, J. H. Lee, D. K. Chang, and J. P. Jung, "Fabrication of SiC Power Module Using Electroplated Sn-X- TLP Solders", Proc. Annual meeting of KWJS, Daegu, Korea, 125 (2019).
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18 |
I. Lum, J. P. Jung, and Y. Zhou, "Bonding Mechanism in Ultrasonic Gold Ball Bonds on Copper Substrate", Metall. Mater. Trans. A., 36(5), 1279 (2005).
DOI
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19 |
Y. Tamai, A. Morozumi, T. Saito, F. Momose, Y. Nishimura, E. Mochizuki, and Y. Takahashi, "High thermal cycling reliability of automotive IGBT module with high strength solder alloy", Proc. MES 2015, Osaka, Japan, 123, JIEP (2015).
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20 |
C. S. Kang and J. P. Jung, "Micro-Joining (in Kor.)", Samsung Books, Seoul, Korea, 307 (2002).
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21 |
R. D. Mindlin, "Compliance of Elastic Bodies in Contact", Trans. ASME, J. Appl. Mech., 16, 259 (1949).
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22 |
T. Kurosu, K. Khoo, Y. Nakamura, K. Ozaki, N. Ishikawa, and J. Onuki, "Reliability Enhancement of Thick Al Cu Wire Bonds in IGBT Modules Using Al2Cu Precipitates", Mater. Trans., 52(3), 453 (2012).
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23 |
I. Lum, M. Mayer, and Y. Zhou, "Footprint Study of Ultrasonic Wedge Bonding with Aluminum Wire on Copper Substrate", J. Electron. Mater., 35(3), 433 (2006).
DOI
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24 |
K. Kotani, J. P. Jung, K. Ikeuchi, and F. Matsuda, "Effects of Oxide Morphology on Bond Strength of Diffusion Bonded Interfaces of Al-Alloys", Trans. JWRL, 28(2), 27 (2000).
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25 |
K. Ozaki, T. Kurosu, and J. Onuki, "Development of Damage Free Thick Al-Cu Wire Bonding Process and Reliability of the Wire Bonds", Electrochem., 82(2), 100 (2014).
DOI
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26 |
J. H. Lee, D. H. Jung, and J. P. Jung, "Transient Liquid Phase Diffusion Bonding Technology for Power Semiconductor Packaging", J. Microelectron. Packag. Soc., 25(4), 9 (2018).
DOI
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