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http://dx.doi.org/10.6117/kmeps.2019.26.4.007

TLP and Wire Bonding for Power Module  

Kang, Hyejun (Department of Materials Science and Engineering, University of Seoul)
Jung, Jaepil (Department of Materials Science and Engineering, University of Seoul)
Publication Information
Journal of the Microelectronics and Packaging Society / v.26, no.4, 2019 , pp. 7-13 More about this Journal
Abstract
Power module is getting attention from electronic industries such as solar cell, battery and electric vehicles. Transient liquid phase (TLP) boding, sintering with Ag and Cu powders and wire bonding are applied to power module packaging. Sintering is a popular process but it has some disadvantages such as high cost, complex procedures and long bonding time. Meanwhile, TLP bonding has lower bonding temperature, cost effectiveness and less porosity. However, it also needs to improve ductility of the intermetallic compounds (IMCs) at the joint. Wire boding is also an important interconnection process between semiconductor chip and metal lead for direct bonded copper (DBC). In this study, TLP bonding using Sn-based solders and wire bonding process for power electronics packaging are described.
Keywords
power module; TLP bonding; wire bonding; electronics packaging;
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Times Cited By KSCI : 4  (Citation Analysis)
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