• Journal of the Microelectronics and Packaging Society
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• v.29 no.1
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• pp.1-6
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• 2022

The mobile device industry demands much higher levels of integration and lower costs coupled with a growing awareness of the complete system's configuration. A subsystem module package is similar to a board-level circuit that integrates a system function in a package beyond a System-in-Package (SiP) design. It is an advanced IC packaging solution to enhance the PDN and achieve a smaller form factor. Unlike a system-level design with a decoupling capacitor, a subsystem module package system needs to redefine the role of the capacitor and its configuration for PDN performance. Specifically, the design of package's form factor should include careful consideration of optimal PDN performance and the number of components, which need to define the decoupling capacitor's value and the placement strategy for a low impedance profile with associated cost benefits. This paper will focus on both the static case that addresses the voltage (IR) drop and AC analysis in the frequency domain with three specific topics. First, it will highlight the role of simulation in the subsystem module design for the PDN. Second, it will compare the performance of double-sided component placement (DSCP) motherboards with the subsystem module package and then prove the advantage of the subsystem module package. Finally, it will introduce three-terminal decoupling capacitor (decap) configurations of capacitor size, count and value for the subsystem module package to determine the optimum performance and package density based on the cost-effective model.

• Food Science and Preservation
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• v.24 no.7
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• pp.934-941
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• 2017

The objective of this study was to investigate the effect of corrugated packaging coated with aluminum (Al) on quality characteristics of red paprika during storage at $25^{\circ}C$. Characteristics such as weight loss, hardness, total phenolic content, antioxidant activities, polygalacturonic acid (PG) activity, and oxidative enzyme activities (polyphenol oxidase and peroxidase activities) of paprikas, packed in corrugated packaging with or without Al-coating were compared as a function of storage time. Al coating inside of corrugated box was found to inhibit PG activity, resulting in prevention of weight loss and maintenance of hardness of paprika during storage, compared to the control sample. This may be due to Al coating treatment that enhance moisture-proof property and hinder gas transmission of corrugated packaging. Furthermore, paprika in Al-coated-corrugated packaging was lower in oxidative enzyme activities than the control, which caused higher total phenolic content and antioxidant activities during storage. As a results, the Al coated-corrugated packaging can be used as a functional packaging material to extend the shelf-life and improve the storage quality of paprika by preventing their respiration and transpiration.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2006.10a
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• pp.37-45
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• 2006

The mobile-phone which Camera was put on was released at the end of 2000 and dramatically puts up the deployment ratio because not only simple Camera but also a function that the photograph which I took is dispatched was added. It is the force that demand in this year presses 600,000,000 sale of a mobile-phone is estimated to be 960,000,000 of them in 2006, and to be able to include two errands with a support model after 3G. A person of entry to a camera-module appear much. In addition, the various kinds of products open markedly which a product comes to be known widely in the world, and the application range has opened widely, and considered QCDT come to be key issues for answer to market demand. By manufacturing industry, there is peculiar culture to each industry, camera-module is the composition the various industries. The construction of true Supply-chain becomes unavoidable to make a good product. I describe the point that the situation of each supply-chain and the direction for the future by the view point of module assembly maker.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2005.09a
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• pp.111-129
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• 2005

Pop provides OEMs and EMS with a platform to cost effectively expand options for logic + memory 3D integration - Expands device options by simplifying business logistics of stacking - Integration controlled at the system level to best match stacked combinations with system requirements - Eliminates margin stacking and expands technology reuse - Helps manage the huge cost impacts associated with increasing demand for multi media processing and memory. PoP is well timed to enable and leverage: - Mass customization of systems for different use (form, fit and function) requirements o Bband and apps processor + memory stack platforms - Logic transition to flip chip enables PoP size reduction o Area and height reduction. Industry standardization is progressing. Amkor provides full turn-key support for base package, memory package and full system integration.

• The Journal of Korean Association of Computer Education
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• v.6 no.3
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• pp.75-85
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• 2003

This study develops the System(MetaGene) to create meta-data for learning object based on SCORM including meta-data of Assets. SCO, Contents Aggregation and metadata of Contents Package. API function cocle is embeded in Learning Object for interfacing API adopter in LMS to support SCORM and for tracking on learning process based on data models. Also, the learning objects are packaged the PIF(Packaged Interchange File) to transmit with LMS. MetaGene is verified by $SCORM^{(TM)}$ Conformance TestSuite for meta-data of learning objects, manifest file of Contents Packaging.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.4
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• pp.33-37
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• 2012

Microstructure developments of $RuO_2$ based thick film resistors during firing as a function of glass viscosity were analytically quantified and its effect on the electrical property was investigated. The microstructure development was retarded as the viscosity of glass was increased. It was found that the viscosity range for each stage of microstructure development are as follows ; $7500-10^5Pa{\cdot}s$ for the glass sintering, $2000-7500Pa{\cdot}s$ for the glass island formation, $700-2000Pa{\cdot}s$ for the glass spreading, and $50-700Pa{\cdot}s$ for the infiltration. The sheet resistivity decreased as the viscosity of glass in the resistor film increased due to the higher chance of sintering for the conductive particles with the higher viscosity of the glass.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.2
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• pp.1-9
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• 2011

Rare metals, called as vitamins of industry, are defined as the elements which are very few in the earth and are difficult to extract from ores. The requirements for total amounts of rare metals have increased as the global economics grows and the function of electronic components varies considerably. The rare metals have been maldistributed to America, CIS(Commonwealth of Independent States), China, Australia, Canada as about 80% of total natural resources, which also lead to unequal materials flow or distribution. Therefore, it was needed to investigate the feature of rare metals in terms of industry as well as technology. We could identify the industrial issues associated with the supply of critical rare elements in electronic components.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 1999.11a
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• pp.59-63
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• 1999

• Journal of the Microelectronics and Packaging Society
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• v.21 no.1
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• pp.41-44
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• 2014

We employed UV-Ozone treatment method for the fabrication of dense and highly conductive nanoparticle thin films. We demonstrated the UV-Ozone treatment effect on the silver nanoparticle thin films as a function of time and temperature. The capping layers of nanoparticles were decomposed after UV-Ozone treatment and dense nanoparticle thin films were obtained. Moreover, electrical and mechanical properties of the thin films after UV-Ozone treatment were measured by using resistance measurements under tension in an in-situ tensile tester. The initial resistance of nanoparticle thin films was decreased by 82.6% with optimized UV-Ozone treatment condition of $150^{\circ}C$ for 20 minutes.

• Journal of the Microelectronics and Packaging Society
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• v.5 no.2
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• pp.37-48
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• 1998

The popcorn cracking phenomena in plastic IC packages during reflow soldering are investigated by considering the heat transfer and moisture diffusion through the epoxy molding compound(EMC) along with the mechanics of interface delamination. Heat transfer and moisture diffusion through EMC under die pad are analyzed by finite difference method (FDM)during the pre-conditioning and subsequent reflow soldiering pro-cess and the amounts of moisture mass and vapor pressure at delaminated die pad/ EMC interface are calculated as a function of the reflow soldering time. The energy release rate stress intensity factor and phase angle were obtained under various loading conditions which are thermal crack face vapor pressure and mixed loadings. It was shown that thermal loading was the main driving force for the crack propagation for small crack lengths but vapor pressure loading played more significant role as crack grew.