• 마이크로전자및패키징학회지
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• 제29권1호
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• pp.1-6
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• 2022

The mobile device industry demands much higher levels of integration and lower costs coupled with a growing awareness of the complete system's configuration. A subsystem module package is similar to a board-level circuit that integrates a system function in a package beyond a System-in-Package (SiP) design. It is an advanced IC packaging solution to enhance the PDN and achieve a smaller form factor. Unlike a system-level design with a decoupling capacitor, a subsystem module package system needs to redefine the role of the capacitor and its configuration for PDN performance. Specifically, the design of package's form factor should include careful consideration of optimal PDN performance and the number of components, which need to define the decoupling capacitor's value and the placement strategy for a low impedance profile with associated cost benefits. This paper will focus on both the static case that addresses the voltage (IR) drop and AC analysis in the frequency domain with three specific topics. First, it will highlight the role of simulation in the subsystem module design for the PDN. Second, it will compare the performance of double-sided component placement (DSCP) motherboards with the subsystem module package and then prove the advantage of the subsystem module package. Finally, it will introduce three-terminal decoupling capacitor (decap) configurations of capacitor size, count and value for the subsystem module package to determine the optimum performance and package density based on the cost-effective model.

• 한국식품저장유통학회지
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• 제24권7호
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• pp.934-941
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• 2017

파프리카는 우리나라의 대표적인 수출작물로 알려져 있지만 장거리 유통 중 일어나는 품질열화로 인해 상품적 가치가 감소되는 문제가 있다. 따라서 본 연구는 농산물 유통 시 주로 사용되는 골판지상자의 내부에 알루미늄을 코팅하여 기능성을 부여한 포장용기를 개발하였으며, 이를 이용하여 파프리카를 포장하여 저장 중 선도유지 및 품질특성에 미치는 영향을 알아보았다. 골판지상자 내부에 알루미늄을 코팅함으로써 방습성을 향상시키고 기체투과도를 저하시킴으로써 포장된 파프리카의 펙틴분해효소 활성이 저하됨에 따라 파프리카의 중량변화율과 조직연화 현상이 저해되었고, 산화효소 활성이 감소함으로써 총 페놀 함량 및 항산화 활성이 향상되는 것으로 나타났다. 결과적으로 알루미늄 코팅한 골판지상자는 파프리카의 상품성 및 저장성을 향상시키는 포장용기로 이용될 수 있을 것으로 생각되며, 알루미늄박의 내수성, 내한성, 보향성, 내오염성 등의 특성을 활용한 추가연구를 통해 국내 농산물의 장거리 유통 및 수출 활성화에 이바지할 수 있을 것이라 생각된다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2006년도 ISMP 2006
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• pp.37-45
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• 2006

The mobile-phone which Camera was put on was released at the end of 2000 and dramatically puts up the deployment ratio because not only simple Camera but also a function that the photograph which I took is dispatched was added. It is the force that demand in this year presses 600,000,000 sale of a mobile-phone is estimated to be 960,000,000 of them in 2006, and to be able to include two errands with a support model after 3G. A person of entry to a camera-module appear much. In addition, the various kinds of products open markedly which a product comes to be known widely in the world, and the application range has opened widely, and considered QCDT come to be key issues for answer to market demand. By manufacturing industry, there is peculiar culture to each industry, camera-module is the composition the various industries. The construction of true Supply-chain becomes unavoidable to make a good product. I describe the point that the situation of each supply-chain and the direction for the future by the view point of module assembly maker.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2005년도 ISMP
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• pp.111-129
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• 2005

Pop provides OEMs and EMS with a platform to cost effectively expand options for logic + memory 3D integration - Expands device options by simplifying business logistics of stacking - Integration controlled at the system level to best match stacked combinations with system requirements - Eliminates margin stacking and expands technology reuse - Helps manage the huge cost impacts associated with increasing demand for multi media processing and memory. PoP is well timed to enable and leverage: - Mass customization of systems for different use (form, fit and function) requirements o Bband and apps processor + memory stack platforms - Logic transition to flip chip enables PoP size reduction o Area and height reduction. Industry standardization is progressing. Amkor provides full turn-key support for base package, memory package and full system integration.

• 컴퓨터교육학회논문지
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• 제6권3호
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• pp.75-85
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• 2003

본 연구는 SCORM 기반 학습 객체의 메타데이타 생성 즉 Asset, SCO, Contents Aggregation과 Contents Package에 대한 메타데이터를 생성하는 시스템(MetaGene)을 개발한다. SCORM 을 지원하는 LMS내 API 어댑터와 인터페이스를 위한 학습 객체 내에 API 활성화 함수를 내장시키고, 데이터 모델을 기반으로 학습 과정을 트래킹 하는 코드도 포함 시킨다. 또한 학습 객체들이 LMS에 전송되게 PIF(Package Interchange File)로 패키징 시킨다. MetaGene에 생성된 학습객체의 메타데이터와 컨텐츠 패키지의 manifest file을 $SCORM^{(TM)}$ Conformance Testsuite을 이용하여 유효성을 검증한다.

• 마이크로전자및패키징학회지
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• 제19권4호
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• pp.33-37
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• 2012

Microstructure developments of $RuO_2$ based thick film resistors during firing as a function of glass viscosity were analytically quantified and its effect on the electrical property was investigated. The microstructure development was retarded as the viscosity of glass was increased. It was found that the viscosity range for each stage of microstructure development are as follows ; $7500-10^5Pa{\cdot}s$ for the glass sintering, $2000-7500Pa{\cdot}s$ for the glass island formation, $700-2000Pa{\cdot}s$ for the glass spreading, and $50-700Pa{\cdot}s$ for the infiltration. The sheet resistivity decreased as the viscosity of glass in the resistor film increased due to the higher chance of sintering for the conductive particles with the higher viscosity of the glass.

• 마이크로전자및패키징학회지
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• 제18권2호
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• pp.1-9
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• 2011

Rare metals, called as vitamins of industry, are defined as the elements which are very few in the earth and are difficult to extract from ores. The requirements for total amounts of rare metals have increased as the global economics grows and the function of electronic components varies considerably. The rare metals have been maldistributed to America, CIS(Commonwealth of Independent States), China, Australia, Canada as about 80% of total natural resources, which also lead to unequal materials flow or distribution. Therefore, it was needed to investigate the feature of rare metals in terms of industry as well as technology. We could identify the industrial issues associated with the supply of critical rare elements in electronic components.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 1999년도 추계 기술심포지움 논문집
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• pp.59-63
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• 1999

• 마이크로전자및패키징학회지
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• 제21권1호
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• pp.41-44
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• 2014

We employed UV-Ozone treatment method for the fabrication of dense and highly conductive nanoparticle thin films. We demonstrated the UV-Ozone treatment effect on the silver nanoparticle thin films as a function of time and temperature. The capping layers of nanoparticles were decomposed after UV-Ozone treatment and dense nanoparticle thin films were obtained. Moreover, electrical and mechanical properties of the thin films after UV-Ozone treatment were measured by using resistance measurements under tension in an in-situ tensile tester. The initial resistance of nanoparticle thin films was decreased by 82.6% with optimized UV-Ozone treatment condition of $150^{\circ}C$ for 20 minutes.

• 마이크로전자및패키징학회지
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• 제5권2호
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• pp.37-48
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• 1998

The popcorn cracking phenomena in plastic IC packages during reflow soldering are investigated by considering the heat transfer and moisture diffusion through the epoxy molding compound(EMC) along with the mechanics of interface delamination. Heat transfer and moisture diffusion through EMC under die pad are analyzed by finite difference method (FDM)during the pre-conditioning and subsequent reflow soldiering pro-cess and the amounts of moisture mass and vapor pressure at delaminated die pad/ EMC interface are calculated as a function of the reflow soldering time. The energy release rate stress intensity factor and phase angle were obtained under various loading conditions which are thermal crack face vapor pressure and mixed loadings. It was shown that thermal loading was the main driving force for the crack propagation for small crack lengths but vapor pressure loading played more significant role as crack grew.