• The monthly packaging world
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• s.135
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• pp.139-153
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• 2004

• Journal of Institute of Control, Robotics and Systems
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• v.16 no.2
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• pp.172-176
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• 2010

Recently, LCD (Liquid Crystal Display) requires various technical challenges; high definition, high quality, big size, and low price. These demands more pixels in the fixed area of the LCD and very fine lead pitch of the driving IC which controls the pixels. Therefore, a new packaging technology is needed to meet such technical requirement. NCP (Non Conductive Paste) is one of the new packaging methods and has excellent characteristics to overcome the problems of the ACF (Anisotropic Conductive Film). In this paper, we analyzed the process of the NCP for COF (Chip on FPCB) and proposed the key design parameters of the NCP process. Through a series of experiments, we obtained the stable values of the design parameters for successful NCP process.

• Journal of the Korea Convergence Society
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• v.12 no.11
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• pp.247-256
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• 2021

With the continuous progress and development of the social economy, the importance of commodity packaging is increasingly manifested. It has become an important form of communication between businesses and consumers, and an important means of competition between businesses. The research scope of the thesis: First, through literature investigation, analyze the function of packaging design and consumers' buying attitude, and analyze the name, color, logo, illustration, etc. for general chocolate packaging and travel souvenir chocolate packaging. Research method: Through questionnaire survey, according to consumers' purchasing attitude and personal value of package design, we have in-depth understanding of consumers' purchasing power and package design's influence on purchasing conditions and research. According to the results of this study, first, from the perspective of general chocolate packaging and travel souvenir chocolate packaging to consumer consumption phenomena, general chocolate is more popular. Second, when consumers buy products, the taste of chocolate is more important than product packaging design. Third, in each product group, consumers value their own value when buying chocolate products. Fourth, due to the two important attributes of packaging design and taste, ordinary chocolate has a higher purchase intention than travel souvenir chocolate.

• Journal of the Korean Ceramic Society
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• v.44 no.3 s.298
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• pp.157-161
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• 2007

Line width under $100\;{\mu}m$ with good resolution is difficult to achieve using conventional thick-film process utilizing screen printing method. However combined with lithography technology finer line and space for miniaturization and highly integrated package is achievable. In this study, photosensitive Ag paste of optimum formulation used for thick film lithography technology was fabricated by various Ag powder, glass powder and additives. As the result, line width of $30\;{\mu}m$ with good definition and reduced mismatch during co-firing with LTCC substrate was acquired. Formulated Ag paste was used to pattern embedded fine line inductor with over 90% yield.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.2
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• pp.53-58
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• 2020

Analysis of electric semiconductor packaging technology for electric vehicles was performed. Topic modeling using LDA technique was performed by collecting valid patents by deriving valid patents. It was classified into 20 topics, and the definition of technology was defined through extracted words for each topic. In order to analyze the trend of each topic, the trend of power semiconductor packaging technology was analyzed by deriving hot and cold topics by topic through regression analysis on frequency by year. The package structure technology according to the withstand voltage, the input/output-related control technology and the heat dissipation technology were derived as the hot topic technology, and the inductance reduction technology was derived as the cold topic technology.

• Journal of the Korean Society of Floral Art and Design
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• no.43
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• pp.81-100
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• 2020

Since sustainable packaging of flower basket designs that are sold from florist shops is needed for both the seller and the buyer, studying of second packaging of flower basket design has begun. In this study, based on the survey that has been done in 2019, and the analysis of the interview that has been done in 2020, the suggestion of sustainable packaging development is the purpose. The definition of flower basket design was done and surveys of the status of domestic flower basket designs' second packaging were done in accordance with the type of basket which is an object, transportation, and characteristic of a florist shop. For sustainable packaging, based on physical theory, second packaging which depends on the packaging that includes design factor, transportation final destination has to be different. The factors to be considered as sustainable packaging are the quality of opaque paper, the necessity of first packaging, packaging structure that can fix an object, the form of second packaging influenced by types of transportation. Suggestions for packaging development included new materials for first packaging, eco-friendly objects that can be recycled and reused, structural packaging design, standardization and variability of packaging, protection of floristry which is the fundamental purpose of packaging, and brand advertisement effect. Based on the result of this study further designs of packaging will be commercialized. This study is significant for serving the opportunity of new packaging design for futuristic floristry that fit for unmanned system and studying of categories of products.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.25 no.2
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• pp.37-45
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• 2019

Packaging protects products and delivers information to consumers, and interacts with consumers using various technologies such as NFC and QR Code. Recently, augmented reality technology is widely used in the marketing field, and augmented reality market is expected to continue to grow according to Gartner Hype cycle. However, augmented reality is only used by a few companies in the packaging field. By applying augmented reality to packaging, companies can move away from the limited packaging size and provide consumers with more information about their products. In addition, augmented reality can improve the understanding of the product to consumers by interacting with consumers through a variety of content, and positively attract consumers' interest in the brand. Therefore, this study summarized the definition, characteristics, advantages, and market status of packaging and augmented reality, and analyzed the characteristics and cases of content types of augmented reality. As a result, we confirmed the characteristics of marketing using augmented reality, and especially the necessity of applying augmented reality as a marketing tool in the field of packaging.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.28 no.1
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• pp.31-38
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• 2022

Due to the increasing consumer demands for the safety, shelf life, and quality of food, the application and development of active packaging in the food and packaging industry have been improved. According to the standards and specifications of the Republic of Korea for utensils, containers, and packages, the function of active packaging is to remove or alleviate factors that degrade food quality. Although extensive reviews regarding the development and commercialization of active packaging have been conducted, the legal regulations and safety assessments concerning active packaging have rarely been examined. This review provides information regarding the definition, structure, components, operational mechanisms, and applications for active packaging that actively removes oxygen, moisture, carbon dioxide, and ethylene. Furthermore, the legal regulations and research results related to the development of test methods for safety assessments of active packaging are investigated.

• Journal of Nutrition and Health
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• v.38 no.3
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• pp.251-258
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• 2005

The purposes of this study were to conceptualize the Home Meal Replacement (HMR) in Korea and to gather professionals' opinions of prospect and task for HMR industry in Korea. A total of 67 experts participated in a three round survey by Delphi technique, which was used to integrate and share the each expert's professional idea. According to the result, HMR was translated into 'Gajeongsiksa daeyongsik' in Korean and given definition to 'a meal taken directly or through brief cooking process at home by purchasing ready to eat or ready to end-cook type of food'. As the result of categorizing HMR products of Korean food, 'I. Ready to eat' such as side dishes, kimchi, salad, sandwich, kimbab, and so on and 'II. Ready to heat' such as rice, porridge, retort food (soup, broth, curry, spaghetti, etc.), frozen pizza, grilled food, jabchae, instant soup, and so on were construed in a limited sense of the HMR. In addition, 'III. Ready to end-cook' such as frozen dumpling, frozen pork cutlet, seasoned meat, powder-type soup, and so on as well as these two kinds were interpreted in a broad sense of the HMR. In the prospect of HMR industry in Korea, the Korean HMR industry would develop continuously accompanied by increasing of consumers using HMR products. Introduction and generalization of HMRs would serve the convenience for meal preparation and then influence the change of home meal pattern. Nevertheless, it was concerned about that using HMRs might have limitation on solving the problems of dietary life including irregular meal, skipping a meal, and so on and influence the nutrition imbalance. For the development of HMRs, developing various menu and the packaging materials for HMR products, constructing the thorough sanitary management, and strengthening R & D for the HMR of Korean food were the future tasks in Korean HMR industry.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.