• 제목/요약/키워드: Package volume

검색결과 136건 처리시간 0.01초

김치포장의 압력 및 부피 변화에 영향을 미치는 인자의 분석 (Analysis of Variables Influencing the Pressure Build-up and Volume Expansion of Kimchi Package)

  • 이동선;최홍식;박완수
    • 한국식품영양과학회지
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    • 제28권2호
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    • pp.429-437
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    • 1999
  • A mathematical model was established for estimating changes in pressure and volume of permeable kimchi packages. The model comprises the CO2 gas production from kimchi and permeation of O2, CO2 and N2 through the permeable film or sheet. Using the developed model, the effects of various packaging variables on the pressure and volume changes were analyzed for rigid and flexible packag es of kimchi(3% salt content) at 15oC, and then effect of storage temperature was also looked into. In case of rigid pack of 400g, using the plastic sheet of high CO2 permeability and initial vacuumizing can help to relieve the problem of pressure build up. The lower fill weight can further reduce the pressure, but will result in higher packaging cost. For the flexible package of 3 kg, highly permeable films such as low density polyethylene(LDPE) and polypropylene can reduce the volume expansion. Higher ratio of CO2 permeability to O2 and N2 permeabilities are effective in reducing the volume expansion. Increased surface area cannot contribute to reduction of volume expansion for highly permeable flexible packages of kimchi. For the impermeable packages, pressure and volume at over ripening stage (acidity 1.0%) increase with decreased temperature, while those at optimum ripening stage(acidity 0.6%) change little with temperature. Pressure of permeable rigid LDPE package increases with tem perature at any ripening stage, and temperature affects the volume of flexible LDPE package very slightly. Experimental verification of the present results and package design with economical consid eration are needed as a next step for practical application.

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후방 충격압출 성형 공정의 FVM과 FEM의 적용성에 관한 연구 (A Study on the comparison of FEM and FEM for Backward Impact Extrusion Process)

  • 정상원;조규종;김성훈
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2003년도 춘계학술대회 논문집
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    • pp.1565-1568
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    • 2003
  • The backward extrusion process is one of the commonly used metal forming processes. In this paper. a battery case which has the rectangular section, is analyzed using a 3D metal forming package(MSC.Superforge). This pacakge uses the finite volume analysis method. It is shown that the MSC.Superforge package using finite volume method provides result very close to those obtained from a finite element analysis package(MSC.Superform). However, the simulation time using the finite volume method was almost 10 % of the simulation time consumed by the other package using finite element method. Moreover, the finite volume method used in MSC.Superforge can eliminate the remeshing problems that make the simulating a metal forming process with severe deformation, such as the extrusion process, so difficult.

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낙하충격해석을 통한 대형 전자제품의 완충포장재 최적설계 (Optimal Design for Cushioning Package of a Heavy Electronic Product Using Mechanical Drop Analysis)

  • 금대현;김원진;김성대;박상후
    • 한국소음진동공학회논문집
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    • 제14권2호
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    • pp.128-135
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    • 2004
  • Generally, heavy electronic products undergo many different types of shocks in transportation from a manufacturer to customers. Cushioning package is used to protect electronic products from severe shock environments. Since the mass distribution of heavy electronic products is usually unbalanced and complex. it is very difficult to design a cushioning package with having high performance by considering only the equivalent stiffness of that. Therefore, when designing the cushioning package for a heavy electronic product, it is necessary to optimize its shape in order to maximize the cushioning performance. In this study, it is focused on designing an optimal shape of cushioning package for a large refrigerator and an efficient design method is suggested by using a dynamic finite element analysis. As the results of this study the optimal shape of cushioning package, which has high cushioning performance and minimized volume, was obtained through the mechanical drop analysis and a optimization process. Through free drop tests of refrigerators, it was identified that the cushioning performance of the cushioning package was improved up by 25% and the its own volume was reduced by 22 %.

CO2 흡수제 함유 김치포장에서 CO2 농도와 제품 숙성도의 상호관련성 (Interrelationship between Kimchi Ripening and CO2 Concentration of the Headspace in Flexible Packages Included with CO2 Absorber)

  • 정수연;이동선;안덕순
    • 한국포장학회지
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    • 제26권2호
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    • pp.71-76
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    • 2020
  • CO2 concentration in kimchi package has emerged recently as a potential index of product ripening to be monitored or sensed in intelligent packaging. Considering that addition of CO2 absorber into the flexible kimchi package changes behavior of its CO2 concentration, ripening of kimchi in total acidity, package CO2 concentration in partial pressure (PCO2) and package volume at 10℃ were estimated by mathematical model for two size packages included with different CO2 absorbers. In small size package containing 0.5 kg of kimchi, relatively less gas permeable low density polyethylene (LDPE) sachet of the absorber was found to give rise of PCO2 linearly correlated with acidity at acceptable conditions of absorber amount and size. The levels of PCO2 at optimum ripening were different with absorber amount. However, highly gas permeable microporous spunbonded film (Tyvek) sachet did not show the linear relationship except a condition of 1.5 g of CO2 absorbent. In large size package containing 2.0 kg, absorber sachets of LDPE and Tyvek could give the linear relationship between product acidity and package PCO2 but at different levels (PCO2 of package with LDPE sachet: 0.46~0.79 bar, PCO2 of package with Tyvek sachet: 0.00~0.75 bar). The PCO2 at optimal ripening was found to be less variable with LDPE sachets than with Tyvek ones. Use of package CO2 concentration as an indicator of kimchi ripening was shown to be possible on the limited conditions where the linear relationship between them is established or confirmed.

낙하충격해석을 통한 대형 전자제품의 완충포장재 최적설계 (Optimal Design for Cushioning Package of a Heavy Electronic Product using Mechanical Drop Analysis)

  • 금대현;김원진;김성대;박상후
    • 한국소음진동공학회:학술대회논문집
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    • 한국소음진동공학회 2003년도 추계학술대회논문집
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    • pp.677-683
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    • 2003
  • Generally, heavy electronic products undergo many different types of shocks in transporting from a manufacturer to customers. Cushioning package materials are used to protect electronic products from severe shock environments. Since the mass distributions of heavy electronic products are usually unbalanced and complex, it is very difficult to design a cushioning package with haying high performance by considering only the equivalent stiffness of that. Therefore, when designing the cushioning material for a heavy electronic product, it is necessary to optimize its shape in order to maximize the cushioning performance. In this study, it is focused on designing an optimal shape of cushioning material for a large-sized refrigerator and an efficient design method is suggested by using a dynamic finite element analysis. As the results of this study, the optimal shape of cushioning material, which has high cushioning performance and minimized volume, was obtained from the drop analysis and a optimization process. From free drop tests of a refrigerator, it was identified that the cushioning performance of the optimal package were improved up to 16 % and the volume of it was reduced in a range of 22 %.

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Thermal Performance Analysis for Cu Block and Dense Via-cluster Design of Organic Substrate in Package-On-Package

  • Lim, HoJeong;Jung, GyuIk;Kim, JiHyun;Fuentes, Ruben
    • 마이크로전자및패키징학회지
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    • 제24권4호
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    • pp.91-95
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    • 2017
  • Package-On-Package (PoP) technology is developing toward smaller form factors with high-speed data transfer capabilities to cope with high DDR4x memory capacity. The common application processor (AP) used for PoP devices in smartphones has the bottom package as logic and the top package as memory, which requires both thermally and electrically enhanced functions. Therefore, it is imperative that PoP designs consider both thermal and power distribution network (PDN) issues. Stacked packages have poorer thermal dissipation than single packages. Since the bottom package usually has higher power consumption than the top package, the bottom package impacts the thermal budget of the top package (memory). This paper investigates the thermal and electrical characteristics of PoP designs, particularly the bottom package. Findings include that via and dense via-cluster volume have an important role to lower thermal resistance to the motherboard, which can be an effective way to manage chip hot spots and reduce the thermal impact on the memory package. A Cu block and dense via-cluster layout with an optimal location are proposed to drain the heat from the chip hot spots to motherboard which will enhance thermal and electrical performance at the design stage. The analytical thermal results can be used for design guidelines in 3D packaging.

'부유' 단감의 MA포장 조건에 따른 포장기체조성 및 과실의 품질 변화 (Package Atmosphere and Quality as Affected by Modified Atmosphere Conditions of Persimmon (Diospyros kaki. cv. Fuyu) Fruits)

  • 안광환;송원두;박두상;이연;이동선;최성진
    • 한국식품과학회지
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    • 제33권2호
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    • pp.200-204
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    • 2001
  • '부유' 단감의 MA포장 조건에 따라 $0^{\circ}C$ 저온저장 중 포장내 공기조성 및 과실의 품질 변화를 조사하였다. 처리내용은 포장방법을 1개 열접착, 5개 열접착, 5개 손결속으로 하고, 포장지 두께는 각각 0.03 ㎜, 0.05 ㎜, 0.06 ㎜로 하였다. 조사 결과, 저장 중 포장내 free-volume은 감소하는 경향을 보였다. 특히 열접착 처리구의 free-volume은 처리간 시기적 차이는 있었으나 저장 중 완전히 감소하였다. free-volume의 감소 속도는 포장단위가 크고, 포장지 두께가 얇을수록 빨랐다. 저장중 포장내 산소 농도는 $1.1{\sim}17.1%$, 이산화탄소 농도는 $1.1{\sim}8.3%$ 수준이었고, 저장기간 중 산소 농도는 감소하고, 이산화탄소는 증가하는 경향이었고 포장지가 얇을수록 산소 농도는 높고 이산화탄소 농도는 낮았다. 또한 저장중 이산화탄소 농도가 $4.0{\sim}8.3%$ 수준으로 높게 유지되고, 산소 농도가 $1.1{\sim}4.0%$로 낮게 안정상태로 유지된 0.05 ㎜, 0.06 ㎜ 5개 포장구에서 경도가 높게 유지되었으나, 저장 20주 후 이산화탄소 농도가 8.3%까지 높아진 0.06 ㎜ 5개 열접착 포장구에서 과육갈변과의 발생이 가장 많았다. 반면 산소 농도가 상대적으로 높고 이산화탄소 농도가 비교적 낮은 0.03 ㎜ 포장구와 1개 포장구는 과피흑변과의 발생이 많았다.

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등가 이방성 점탄성 모델 기반 열 응력에 따른 휨 해석 기법 개발 (Development of Warpage Simulation Method according to Thermal Stress based on Equivalent Anisotropic Viscoelastic Model)

  • 김헌수;김학성
    • 마이크로전자및패키징학회지
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    • 제29권3호
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    • pp.43-48
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    • 2022
  • 본 연구에서는 재료의 이방성 점탄성 거동을 고려한 해석 기법을 개발하여 휨(Warpage) 해석의 정합성을 개선하고자 하였다. 먼저, 이방성 점탄성 거동 구현을 위해 구리 패턴(Cu trace) 및 범프(Bump)가 존재하는 패키지를 모델링 하였다. 복잡한 형상의 범프 영역은 대표체적요소 모델을 기반으로 등가 이방성 점탄성 물성 및 열 팽창계수를 도출하였다. 도출된 물성을 기반으로 패키지에 0~125도의 열 주기(Thermal cycle)를 가하였으며, 열 주기에 따른 패키지의 휨 경향을 확인하였다. 해석 결과의 검증을 위해 해석 모델과 동일한 패키지를 제작하였고, 쉐도우 모아레 간섭계(Shadow Moire interferometer)를 통해 열 주기에 따른 실제 패키지의 휨 정도를 측정하였다. 결과적으로 구리 패턴, 범프 등의 요소가 고려된 등가 이방성 점탄성 해석 기법의 적용으로 5 ㎛ 이내의 오차로 패키지의 휨 정도를 계산하고 휨의 형태를 예측할 수 있었다.

떡국 떡의 품질유지에 미치는 변형기체포장(MAP) 효과 (Effect of Modified Atmosphere Packaging on Quality Preservation of Rice Cake (Ddukgukdduk))

  • 정수연;안덕순
    • 한국포장학회지
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    • 제28권1호
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    • pp.9-14
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    • 2022
  • Packages of different atmospheres (air (control), 100% CO2, vacuum, and vacuum + O2 absorber) were prepared for 0.4 kg rice cake (ddukgukdduk) using gas-barrier plastic film and stored at 10℃ for 11 days. The stored products were evaluated in their packages atmosphere, total aerobic bacteria, yeast and molds, texture and sensory quality during storage period. In the air package, the O2 concentration decreased from initial 21% to 16% on storage 4 days and the CO2 concentration increased to 23% on storage of 11 days, which resulted from the growth of microorganisms. CO2 concentration decreased from initial 98% to 36% on storage 11 days in the 100% CO2 package. It is reasoned that CO2 was dissolved into the product reducing the volume of the package. Vacuum and vacuum +O2 absorber package maintained shrunk vacuum condition until 11 days of storage. Total aerobic bacteria count increased significantly in the control package (6.41 log (cfu/g) after 11 days) compared to the 100% CO2 package (4.96 log (cfu/g) after 11 days). Yeast and molds were 6.66 in control package, 3.43 in 100% CO2 package, 4.66 in vacuum package, and 3.78 in vacuum + O2 absorber package after 11 days. There was no significant difference between control and the other treatments for the texture of the stored products. Sensory quality was the worst in control package on the storage of 8 days. All treatment groups except control improved the quality preservation, but vacuum and vacuum + O2 absorber packages suffered from cracking of the product. Thus 100% CO2 flushing is suggested as a desired packaging condition.

모터 일체형 유압 파워 패키지의 개발 (Development of a Hydraulic Power Package Enclosed with an Electric Motor)

  • 박용호;이창돈;이진걸
    • 동력기계공학회지
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    • 제4권3호
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    • pp.55-61
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    • 2000
  • In this study, a new design of an one-body type of an unbalanced-fixed- displacement type vane pump combined with an induction type electric motor was suggested. By the application of the new design scheme, it was possible to reduce the number of parts of the pump system and to cut down the volume of power package than that of already-used products. The case in this study enabled efficient heat transfer and electricity insulation of hydraulic fluid. Thus oil moves through the inside of the package for cooling and returns to the reservoir. Because of this design, it was difficult to measure the shaft-input torque. Therefore the package overall efficiency in the paper was evaluated with a ratio of hydraulic power and electric power.

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