• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.10 no.1
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• pp.7-14
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• 2004

Migration behavior of selected solvents and food samples showed differences of the chemical structures and polarities, the food samples which have similar polar expresses more higher affinity than different polar degrees. Water which is polar has a highest partitioning coefficient values on polar isopropanol, and oil which is nonpolar has highest partitioning value on non-polar toluene. The increasing order of partitioning values was accord with increasing water contents in food samples. It is showed that the wheat flour with 13.2% moisture content has the highest partitioning coefficient values on the isopropanol with -OH. Kp value of sugar showed remarkable lower partitioning coefficient values than other food samples due to high degree crystallinity. This phenomenon can be predictable with ${\delta}$ values, because order of partitioning coefficient values which comes out through the experiment and the sequence of Hildebrand solubility parameter value difference between food sample and printing ink solvent correspond almost. This Hildebrand solubility parameter value can be easily applied to the food package industry because the effect of food-safety can be considered without passing through complicated steps by using this method.

• Korean Chemical Engineering Research
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• v.60 no.2
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• pp.308-312
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• 2022

3D printing technology, which creates a physical object by various material deposition, has been widely used in recent years in the manufacturing field because of its advantages. Among the various printing technologies, droplet-based 3D printing technology (e.g., Polyjet^®) enables a high-resolution printing using photocurable materials such as hydrogels. Depending on the degree of light exposure, ejected photocurable droplets may have different properties (e.g., viscosity) until they collide with the substrate and it leads to the different spreading behaviors of the droplets (i.e., impact, spreading, and recoiling) during deposition on the substrate. In this study, experimental observation and analysis of the changes in hydrogel droplet viscosity and spreading behavior according to the light exposure were carried out based on high-speed image processing.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.192-192
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• 2009

We have successfully demonstrated the inkjet printing process to fabricate $Al_2O_3$ thick films without a high temperature sintering process. A single solvent system had a coffee ring pattern after printing of $Al_2O_3$ dot, line and area. In order to fabricate the smooth surface of $Al_2O_3$ thick film, we have introduced a co-solvent system which has nano-sized $Al_2O_3$ powders in the mixture of Ethylene glycol monomethyl ester and Di propylene glycol methyl ether. This co-solvent system approached a uniform and dense deposition of $Al_2O_3$ powders on the substrate. The packing density of inkjet-printed $Al_2O_3$ films is more than 70% which is very high compared to the value obtained from the films synthesized by other conventional methods such as casting processes. The characterization of the inkjet-printed $Al_2O_3$ films has been implemented to investigate its thickness and roughness. Also the dielectric loss of the films has been measured to understand the feasibility of its application to 3D integration package substrate.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.25 no.10
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• pp.849-856
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• 2012

Chip on board type white light emitting diode on metal core printed circuit board with high thixotropy silicone is fabricated by vacuum printing encapsulation system. Encapsulant is chosen by taking into account experimental results from differential scanning calorimeter, shearing strength, and optical transmittance. We have observed that radiant flux and package efficacy are increased from 336 mW to 450 mW and from 11.9 lm/W to 36.2 lm/W as single dome diameter is varied from 2.2 mm to 2.8 mm, respectively. Double encapsulation structure with 2.8 mm of dome diameter shows further significant enhancement of radiant flux and package efficacy to 667 mW and 52.4 lm/W, which are 417 mW and 34.8 lm/W at single encapsulation structure, respectively.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.26 no.10
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• pp.1447-1452
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• 2022

Seoul Special City, one of the world's top 10 cities and Metro City, has traditional urban manufacturing industries such as printing, sewing, and mechanical metals. Small business owners in these manufacturing clusters have developed in the form of mutual assistance. Due to the nature of the agglomeration site, each process is handled by an individual company. It is difficult for relatively small business owners to prepare order processing services that provide real-time logistics movement information between processes. This paper collects and analyzes existing logistics data for smooth order and delivery of small business owners in package manufacturing and special printing fields We design an artificial intelligence Fulfillment Service Platform system with CRNN, k-NN, and ID3 Decision Tree Algorithm. Through this study, it is expected that it will greatly contribute to increasing sales and improving capabilities by allowing small business owners in integrated areas to use individual orders and delivery customized services through the Cloud network.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.81-81
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• 2009

Non-sintered Alumina films were fabricated via inkjet printing processes without a high temperature sintering process. The packing density of these inkjet-printed alumina films measured around 60%. Polymer resin was infiltrated thru these non-sintered films in order to fill out the 40% of voids constituting the rest of the inkjet-printed films. The concept of inkjet-printed Alumina-Resin hybrid materials was designed in order to be applicable to the ceramic package substrates for 3D-system module integration which may possibly substitute LTCC-based 3D module integration. So, the dielectric properties of these inkjet-printed $Al_2O_3$ hybridmaterialsareofourgreatinterest. We have measured dielectric constant and dissipation factor of the inkjet-printed $Al_2O_3$-resinhybridfilmsbyvaryingtheamountofresininfiltratedthruthe$Al_2O_3$films.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.10 no.1
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• pp.1-6
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• 2004

Amount of residual ink solvent on the packaging materials from Korea, Japan and Europe was measured and compared. The amount of packaging materials from Korea was much higher than that of Japan and Europe. To reduce the residual amounts of ink solvent, aging condition of printed packaging materials including aging time and temperature was modified and evaluated. Aging with high temperature and short time ($60^{\circ}C$ and 24 hours) was more effective for reduction of residual amount of ink solvent than that with low temperature and long time. To find out change of reduction pattern of residual amount of solvent according to plastic packaging material, several monolayer and multilayer packaging materials were selected. Among the monolayer packaging materials, the amount of EVOH and PET was lower than that of polyolefin plastic film including PE and PP. PP/EVOH/PET among the selected multilayer film showed the lowest amount of residual ink solvent on food packaging materials. Result of this research revealed that the residual amount of ink solvent can be reduced by proper selection of aging condition with and by appropriate application of mutilayer plastic film.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.271-271
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• 2010

$BaTiO_3$(BT) has high permittivity so that has been applied to dielectric and insulator materials in 3D system-level package integration. In order to achieve excellent performance of device, the BT layer should be highly dense. In this study, BT thick films were prepared by the inkjet printing method. And these films were cured at $280^{\circ}C$ after infiltration of polymer resin. As a result, we have successfully fabricated not only the inkjet-printed hybrid BT film but also metal-insulator-metal(MIM) capacitor without sintering process. Changes in the dielectric constant of BT hybrid film with particle size and packing density were investigated. The dielectric constant was increased with increasing packing density and particle size. Further, the BT hybrid film using two different size particles had even higher packing density and dielectric constant.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.6
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• pp.575-579
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• 2004

Package reliability test was conducted to investigate the effect of solder paste composition at BGA Package. It was found that the shape and size of the phase form are affected by the processing parameters. The material have used to fill in the via was Sn/36Pb/2Ag and Sn/0.75Cu type solder paste. Sn/36Pb/2Ag and Sn/0.75Cu paste were fabricated on Tape-BGA substrates by screen printing process, and via ball mount data were characterized with variations of dwell time of 85 seconds at reflow peak temperature at 22$0^{\circ}C$ or 24$0^{\circ}C$. The test condition was MRT 30 $^{\circ}C$/60 %RH/96 HR. Failures formed of a ball-off in solder paste process were observed by using a Optical Microscope and SEM(Scanning Electron Microscope). It was concluded that intermetallic layer growth played important roles in increasing solder fatigue strength for addition of Ag composition. The degradation of shear strength of solder composition is discussed.

• Journal of the Korean Society of Food Science and Nutrition
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• v.41 no.3
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• pp.418-429
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• 2012

In this study we surveyed the packaging preferences of consumers for Korean rice cakes as current commercial products in Korea. The questionnaire was developed from a preliminary investigation of typical rice cake packaging patterns and sent to 2332 residents in Korea by random sampling mail. The questionnaire contained questions on the preferences of interior design in packaging, opening methods, individually separated types, printing position, packaging methods, and packaging materials such as paper and plastic. There were responses from 304 residents. The collected data was analyzed by an SPSS package program. Most of the packaging used for Korean rice cakes was plastic (58.9%) which was used for packaging materials and stretch wrap (42.9%) as packing methods. The results showed the preference was the perforated line type used by hand for opening a packaging and interior packaging design with 2~3 partitions. Most respondents expressed an interest in using individual packaging and having printing directly on the packaging. Also, the respondents preferred the packaging design that let them see the contents of a package. Based on the results of the questionnaire, this paper suggested that most consumers would prefer to choose a packaging system with a partition design in a plastic container, individually separated products, and a transparent container for Korean rice cakes. The results of packaging preferences could provide important information for suitable packaging development for Korean rice cakes. Further research should be conducted to improve the shelf life of Korean rice cakes with functional packaging systems such as modified atmosphere packaging or anti-microbial packaging.