• Transactions on Electrical and Electronic Materials
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• v.18 no.2
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• pp.59-61
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• 2017

This research was analyzed thermal characteristics that was appointed disadvantage when smart LED driver ICs was packaged and we applied extracted thermal characteristics for optimal layout design. We confirmed reliability of smart LED driver ICs package without additional heat sink. If the package is not heat sink, we are possible to minimize package. For extracting thermal loss due to overshoot current, we increased driver current by two and three times. As a result of experiment, we obtained 22 mW and 49.5 mW thermal loss. And we obtained optimal data of 350 mA driver current. It is important to distance between power MOSFET and driver ICs. If the distance was increased, the temperature of package was decreased. And so we obtained optimal data of 3.7 mm distance between power MOSFET and driver ICs. Finally, we fabricated real package and we analyzed the electrical characteristics. We obtained constant 35 V output voltage and 80% efficiency.

• Journal of Korea Society of Digital Industry and Information Management
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• v.6 no.1
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• pp.159-167
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• 2010

We research a competitive advantage of telecom bundling package of three mobile telecom company by figuring out utility that consumers perceived and focused on mobile telecom and high speed internet in one bundled package. As a method, conjoint analysis was applied. And in conclusion, consumers considered retaining mobile telecom company as the most important factor to them and branding as the following important one when one bundled package of telecom service is provided in total market. When the market is divided into two submarkets and the second largest submarket is analyzed personal bundled package was most important and three year agreement with a stipulated discount has the highest utility. As a result of this analysis, mobile telecom company managers need to organize bundled package after consideration of their current position and brand power in the market, and then devise proper market strategy

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.11a
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• pp.119-123
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• 2001

In this paper, a new structure and fabrication method for the wafer level package(WLP) is presented. A packaged VLSI chip is encapsulated by a parylene(which is a low k material) layer as a dielectric layer and is molded by SUB photo-epoxy with dielectric constant of 3.0 at 100 MHz. The electrical parameters (R, L, C) of package traces are extracted by using the Maxwell 3-D simulator. Based on HSPICE simulation results, the proposed wafer level package can operate for frequencies up to 20GHz.

• Proceedings of the Korea Electromagnetic Engineering Society Conference
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• 2000.11a
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• pp.104-108
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• 2000

In this paper, we characterized a novel MEMS package using high resistivity silicon for microwave and millimeter-wave devices. The manufactured MEMS package shows -20dB of S$\sub$11/ and -0.4dB of S$\sub$21/ up to 200GHz. The new package can be a low cost and high performance solution due to process compatibility with on-chip devices and very small and precise dimensions by semiconduotor technology.

• Proceedings of the Korean Operations and Management Science Society Conference
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• 1990.04a
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• pp.71-80
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• 1990

The main objectives of this paper are as follows: 1) identifying th procedural characteristics of application software package acquisition and, 2) analyzing the relationship between those characteristics and MIS performance. Three stages and thirty core tasks of the application software package acquisition process were identified after reviewing relevant literature. The model specifying the relationship between procedural characteristics of application software package acquisition and MIS performance was established and 12 hypotheses were derived. Data were collected form 41 Korean companies and hypotheses were tested empirically.

• Proceedings of the Korean Information Science Society Conference
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• 2004.10c
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• pp.370-372
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• 2004

본 논문에서는 개방형 운영체제인 리눅스상에서 package streaming service를 제공하는 Network Streaming Service(통칭 NSS)를 설계하는 문제를 다룬다. NSS는 client가 serve 측에 설치된 소프트웨어 package를 마치 client 자신의 local disk상에 이미 인스톨된 패키지를 실행하는 것처럼 동작하도록 해준다. NSS는 client측의 NSS Mounter, Package Streaming Consumer, NSS Configurator와 server측의 NSS Load Balancer, Package Streaming Supplier, NSS Manager, Accounting & Security Manager로 구성되며 local disk caching과 background prefetching 기능을 사용하여 향상된 서비스를 제공한다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.31 no.2
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• pp.122-127
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• 2018

In an attempt to estimate the life projection of LED packages, IESNA published a paper regarding an LED package measurement test method in 2008, and a life projection technical document in 2011, to be used for LED life estimation. IESNA's publications regarding LED package measurement methods were functional, but they were not internationally standardized before 2017. In order to develop a standardized method, the International Standard chose to use the LM-80 as a measurement method for LED life projection in their publication in 2017. Many projection methods have been discussed by the IEC Technical Committee 34 working group, including the method using an exponential function, which reflects lumen degradation characteristics well. This study is designed to explore alternative LED package life estimation methods using an exponential function with statistical analysis, other than the one suggested by the International Standard.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.3
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• pp.31-35
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• 2013

TSOP(Thin Small Outline Package) is the IC package using lead frame, which is the type of low cost package for white electronics, auto mobile, desktop PC, and so on. Its performance is not excellent compared to BGA or flip-chip CSP, but it has been used mostly because of low price of TSOP package. However, it has been issued in TSOP package that thermal deflection of lead frame occurs frequently during molding process and Au wire between semiconductor die and pad is debonded. It has been required to solve this problem through substituting materials with low CTE and improving structure of lead frame. We focused on developing the lead frame structure having thermal stability, which was carried out by numerical analysis in this study. Thermal deflection of lead frame in TSOP package was simulated with positions of anti-deflection adhesives, which was ranging 198 um~366 um from semiconductor die. It was definitely understood that thermal deflection of TSOP package with anti-deflection adhesives was improved as 30.738 um in the case of inside(198 um), which was compared to that of the conventional TSOP package. This result is caused by that the anti-deflection adhesives is contributed to restrict thermal expansion of lead frame. Therefore, it is expected that the anti-deflection adhesives can be applied to lead frame packages and enhance their thermal deflection without any change of substitutive materials with low CTE.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.1
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• pp.17-22
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• 2018

In this paper, the effects of solder joint aging on the reliability of embedded package solder joints were investigated using numerical analysis by finite element method. Solder joints were SAC305 with aging time 0, 60, 180 days. For reliability analysis, warpage of package and equivalent creep strain (ECS) and total strain energy density (TSED) of solder joint were analyzed. The analysis results show that the package warpage is decreased in the case of the embedded package compared to the non embedded package, and the reliability life of the solder joint is predicted to be high. Also, it was interpreted that the longer the aging time, the less the warpage of the embedded package, but the reliability life of the solder joint would be shortened.

• The KIPS Transactions:PartD
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• v.10D no.5
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• pp.821-828
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• 2003

Package software should have the feature that enables purchasers to discriminate a product suitable for them among a number of software belonging to the similar kind of product. Purchaser's ability to choose a package software depends on whether they can judge that a package software conforms to the relevant standard through an objective quality test process and method or not. There are the standards that can be applicable to the quality evaluation of package software, such as and . This study developed a system with which purchasers can effectively select a package software suitable for their needs, building quality test process for package software and developing test metric and application method.