• Journal of the Institute of Electronics Engineers of Korea SD
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• v.37 no.1
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• pp.8-18
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• 2000

We presented a BGA(Ball Grid Array) package for RF circuit modules and extracted its electrical parameters. As the frequency of RF system devices increases, the effect of its electrical parasitics in the wireless communication system requires new structure of RF circuit modules because of its needs to be considered of electrical performance for minimization and module mobility. RF circuit modules with BGA packages can provide some advantages such as minimization, shorter circuit routing, and noise improvement by reducing electrical noise affected to analog and digital mixed circuits, etc. We constructed a BGA package of ITS(Intelligent Transportation System) RF module and measured electrical parameters with a TDR(Time Domain Reflectometry) equipment and compared its electrical parasitic parameters with PCB RF circuits. With a BGA substrate of 3${\times}$3 input and output terminals, we have found that self capacitance of BGA solder ball is 68.6fF, and self inductance 146pH, whose values were reduced to 34% and 47% of the value of QFP package structure. S11 parameter measurement with a HP4396B Network Analyzer showed the resonance frequency of 1.55GHz and the loss of 0.26dB. Routing length of the substrate was reduced to 39.8mm. Thus, we may improve electrical performance when we use BGA package structures in the design of RF circuit modules.

• The KIPS Transactions:PartD
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• v.10D no.5
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• pp.821-828
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• 2003

Package software should have the feature that enables purchasers to discriminate a product suitable for them among a number of software belonging to the similar kind of product. Purchaser's ability to choose a package software depends on whether they can judge that a package software conforms to the relevant standard through an objective quality test process and method or not. There are the standards that can be applicable to the quality evaluation of package software, such as and . This study developed a system with which purchasers can effectively select a package software suitable for their needs, building quality test process for package software and developing test metric and application method.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.4
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• pp.75-79
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• 2013

A power distribution network (PDN) is a network that provides connection between the voltage source supply and the power/ground terminals of a microprocessor chip. It consists of a voltage regulator module, a printed circuit board, a package substrate, a microprocessor chip as well as decoupling capacitors. For power integrity analysis, the board and package layouts have to be transformed into an electrical network of resistor, inductor and capacitor components which may be expressed using the S-parameters models. This modeling process generally takes from several hours up to a few days for a complete board or package layout. When the board and package layouts change, they need to be re-extracted and the S-parameters models also need to be re-generated for power integrity assessment. This not only consumes a lot of resources such as time and manpower, the task of PDN modeling is also tedious and mundane. In this paper, a block-based PDN modeling is proposed. Here, the board or package layout is partitioned into sub-blocks and each of them is modeled independently. In the event of a change in power rails routing, only the affected sub-blocks will be reextracted and re-modeled. Simulation results show that the proposed block-based PDN modeling not only can save at least 75% of processing time but it can, at the same time, keep the modeling accuracy on par with the traditional PDN modeling methodology.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.12 no.2
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• pp.45-53
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• 1998

This paper describes the development of educational and training package with Integrated graphic environment for power system analysis '||'&'||' operation. This package runs on a personal computer with interactive scheme and includes a graphic editor for modeling of power system, a database system, the various graphic illustration '||'&'||' animation modules to represent the simulation results, and the application module of the power system analysis '||'&'||' operation. The proposed package is tested on a sample system, the package will be useful for the education and training of power system analysis and operation.

• International Journal of Fuzzy Logic and Intelligent Systems
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• v.1 no.1
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• pp.104-112
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• 2001

Simply, Nonlinear dynamics theory means the complicated and noise-like phenomena originated form nonlinearity involved in deterministic dynamical system. An almost all the natural signals have nonlinear property. However, there exist few analysis software tool or package for a research and development of applications. We develop nonlinear time series analysis simulator is to provide a common and useful tool for this purpose and to promote research and development of nonlinear dynamics theory. This simulator is consists of the following four modules such as generation module, preprocessing module, analysis module and ICA module. In this paper, we applied to Electroencephalograph (EEG), as it turned out, our simulator is able to analyze nonlinear time series. Besides, we could get the useful results using the various parameters. These results are used to diagnostic the brain diseases.

• ETRI Journal
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• v.26 no.1
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• pp.57-60
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• 2004

We propose an inductive compensation method for a surface-mountable 10 Gbps photoreceiver module. Since many typical 10 Gbps photoreceiver modules consist of a photodetector and low-noise pre-amplifier, the impedance mismatch between the photodetector and pre-amplifier, as well as package parasitics, may reduce the frequency bandwidth. In this paper, we inserted an inductive component between the photodetector and pre-amplifier in order to create frequency bandwidth expansion. From the measurement results, we have found that the proposed technique can increase the -3 dB bandwidth about 4.2 GHz wider compared with an uncompensated module. And, from a bit-error rate (BER) test, we observed -15.7 dB sensitivity at $10^{-12}$ BER. This inductive compensation can be implemented easily and is compatible with common manufacturing processes of photoreceiver modules.

• Proceedings of the KSRS Conference
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• 2003.11a
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• pp.337-339
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• 2003

This paper describes the SAR geocoding module, which is the sub-module of a IRHIS ('Integrated RS s/w for High resolution satellite ImageS'): package of 'Development of High Resolution Satellite Image Processing Technique' project in Electronics and Telecommunications Research Institute (ETRI). The function of this module is following. 1) Orbit Type : ERS1/ERS2, RADARSAT 2) Data Format : SAR CEOS Format(Single Look Complex) 3) Function: - Geocode : Generate a map projected SAR image based on only orbit information - Orthorectify: Generate a rigorous geocoded SAR image with a DEM information In this paper, we briefly describe the algorithm that is adopted to the functions, and component architecture.

• The Transactions of the Korean Institute of Power Electronics
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• v.28 no.1
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• pp.39-47
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• 2023

This paper applies a structural technique with uniform parallel switch characteristics in gates and power loops to minimize the ringing and current imbalance that occurs when a general discrete package (TO-247)-based power semiconductor device is operated in parallel. Also, this propose a heat sink integrated switching module with heat sink design flexibility and high power density. The developed heat dissipation-integrated switching module verifies the symmetry of the parasitic inductance of the parallel switch through Q3D by ansys and the validity of the structural technique of the parallel switch using the LLC resonant converter experiment operating at a rated capacity of 7.5 kW.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.15 no.1
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• pp.7-16
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• 2009

The purpose of this study was to evaluate current packaging modules and design the most acceptable packaging module for domestic and international distribution systems. An optimum packaging module can reduce package costs as well as total distribution costs such as transport, materials handling and warehouse costs. Three different sizes of packaging modules, namely U-type($600{\times}500\;mm$), K -ype($550{\times}366\;mm$) and I-type($600{\times}400\;mm$), were evaluated in terms of the area efficiency and MOEs(measures of effectiveness) for the T-11($1100{\times}1100mm$) and T-12($1,200{\times}1,000\;mm$) pallets. The results showed that the U-type module could fit very well for both pallets and the area efficiency of each module was more than 99 percents. Area efficiency of K-and I-type modules was greatly affected by the pallet footprint dimensions. U-type module also performed better result from MOEs evaluation. Twenty sub-multiple sizes derived from the U-type module were suggested for the future development of the Korean and ISO standards on dimension of transport packages.

• Journal of the Korean institute of surface engineering
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• v.43 no.3
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• pp.142-147
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• 2010

We evaluated characteristics of ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) surface treatment for mobile equipment that requires high reliability, in addition to investigating surface treatment processes for semiconductor boards that require high reliability such as regular PCB-package systems, board-on-chip, chip-scaled package (CSP), etc and application for semiconductor package board of SIP, BOC. As a result, it appeared that ENEPIG has superior properties compared to ENIG surface treatment in corrosion resistance, solder junction, wetting, etc. We anticipate that these results will be able to lend credibility to ENEPIG as a low-cost alternative for producing mobile devices such as the cell phones, especially when applied to mass production.