• Title/Summary/Keyword: Package method.

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Observation on Neck Form of Young Japanese Women for Clothing Design I - A Method for Approximate Development of 3-D Measure Valuses - (의복설계를 위한 성인여성의 경부형태의 관찰 I - 도형의 자동제도를 위한 3차원 계측지의 처리방법 -)

  • 최영옥
    • Journal of the Korean Society of Costume
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    • v.31
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    • pp.89-99
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    • 1997
  • In order to know what sorts of features of neck fore may be required to make plans for tight fitting collars the neck form of young japanese women were measured three deme-nsionally using. GRASP(Grating projection System for Profiling) and plaster torso. The following results were obtained: 1. We could be known the features of neck form for tight fitting collars by using both plaster torso method and GRASP method. 2. By the BASIC language in NEC computer and EXCEL package program in macin-TOSHI computer it became possible to draft a numble of neck surface automatically there-fore we got analysis of a mass of subjects.

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Modal Analysis on SPL of the Periodic Structure depend on Unsymmetrical Beam Space (비대칭형 보강재 간격에 따른 주기구조물의 SPL모드 해석)

  • 김택현;김종태
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.11 no.1
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    • pp.52-60
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    • 2002
  • The purpose of this research is to study the vibration and acoustic pressure radiation from a thin isotropic flat plate stiffened by a rectangular array of beams, and excited by a time harmonic point force. These constructions on aircraft and ship structures are often subjected to fiequency dependent pressure fluctuations and forces. Forces from the these excitations induce structural vibrations in a wide range of fiequencies, which may cause such things as acoustic fatigue and internal cabin noise in the aircraft. It is thus important that the response characteristics and vibration modes of such periodic structures be horn. From this theoretical model, the sound pressure levels(SPL) in a semi-infinite fluid(water) bounded by the plate with the variation in the locations of an external time harmonic point farce on the plate can be calculated efficiently using three numerical tools such as the Gauss-jordan method the LU decomposition method md the IMSL numerical package.

A Study on dry decapsulation by Using a UV Laser (자외선 레이저를 이용한 건식디캡슐레이션에 관한 연구)

  • Hong, Y.S.;Kim, J.B.;Seo, M.H.;Choi, J.H.;Yoon, M.K.;Nam, G.J.
    • Laser Solutions
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    • v.11 no.1
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    • pp.7-11
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    • 2008
  • Decapsulation technology is useful to inspect EMC of package device and the etching technology enable to check inside of device by removing plastic molding. Chemical etching method is used widely to fabricate a lot of semiconductor. But the method has some disadvantage due to wet process. Proposed method in this paper shows the application possibility such as fast processing time, processing accuracy and dry process. These result was obtained by directly removing of packed EMC using UV laser.

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Roll Forming Analysis for High Strength Steel Bumper Process (고장력강 범퍼 빔의 롤 포밍 공정)

  • Kim, Dong Hong;Jung, Dong Won
    • Journal of the Korean Society for Precision Engineering
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    • v.30 no.8
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    • pp.797-801
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    • 2013
  • Today's automotive industry is evolving toward low-emissions or zero-emissions high-efficiency vehicles. Highly efficient power sources are required, as well as high strength steels for various parts to increase safety. In this study, we investigated the roll-forming process for the development of high strength, lightweight steel bumper beams. The roll-forming process was analyzed using the software package Shape-RF in combination with a rigid-plastic finite element method model. An optimal roll-forming process based on roll-pass was obtained using finite element method simulations.

A Faulty Synchronous Machine Model for Efficient Interface with Power System

  • Amangaldi Koochaki
    • Journal of Electrical Engineering and Technology
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    • v.10 no.3
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    • pp.812-819
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    • 2015
  • This paper presents a new approach for simulating the internal faults of synchronous machines using distributed computing and Large Change Sensitivity (LCS) analysis. LCS analysis caters for a parallel solution of 3-phase model of a faulted machine within the symmetrical component-based model of interconnected network. The proposed method considers dynamic behavior of the faulty machine and connected system and tries to accurately solve the synchronous machine’s internal fault conditions in the system. The proposed method is implemented in stand-alone FORTRAN-based phasor software and the results have been compared with available recordings from real networks and precisely simulated faults by use of the ATP/EMTP as a time domain software package. An encouraging correlation between the simulation results using proposed method, ATP simulation and measurements was observed and reported. The simplified approach also enables engineers to quickly investigate their particular cases with a reasonable precision.

A Symbolic Computation Method for Automatic Generation of a Full Vehicle Model Simulation Code for a Driving Simulator

  • Lee Ji-Young;Lee Woon-Sung
    • Journal of Mechanical Science and Technology
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    • v.19 no.spc1
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    • pp.395-402
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    • 2005
  • This paper deals with modeling and computer simulation of a full multibody vehicle model for a driving simulator. The multibody vehicle model is based on the recursive formulation and a corresponding simulation code is generated automatically from AUTOCODE, which is a symbolic computation package developed by the authors using MAPLE. The paper describes a procedure for automatically generating a highly efficient simulation code for the full vehicle model, while incorporating realistically modeled components. The following issues have been accounted for in the procedure, including software design for representing a mechanical system in symbolic form as a set of computer data objects, a multibody formulation for systems with various types of connections between bodies, automatic manipulation of symbolic expressions in the multibody formulation, interface design for allowing users to describe unconventional force-and torque-producing components, and a method for accommodating external computer subroutines that may have already been developed. The effectiveness and efficiency of the proposed method have been demonstrated by the simulation code developed and implemented for driving simulation.

Application of Dynamic Programming to Optimization of a System Reliability

  • Sok, Yong-U
    • Journal of the military operations research society of Korea
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    • v.24 no.2
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    • pp.130-145
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    • 1998
  • This paper is concerned with the optimization of a system reliability. Two kinds of the reliability model for optimal allocation of parallel redundancy are considered. The algorithm for solving the optimal redundancy problem is proposed by the use of dynamic programming(DP) method. The problem is approached with a standard DP formulation and the DP algorithm is applied to the model and then the optimal solution is found by the backtracking method. The method is applicable to the models having no constraints or having a cost constraint subject to a specified minimum requirement of the system reliability. A consequence of this study is that the developed computer program package are implemental for the optimization of the system reliability.

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Modeling of Soldering Proess using Longitudinal Thermosonic Method (종방향 열초음파 방법을 이용한 솔더링 공정의 모델링)

  • 김정호;이지혜;유중돈;최두선
    • Proceedings of the KWS Conference
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    • 2003.05a
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    • pp.224-227
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    • 2003
  • The longitudinal thermosonic bonding method is investigated in this work for its application to the soldering process for electronic packaging. The effect of the ultrasonic is analyzed through lumped modeling, and the material properties of a viscoelastic model are measured experimentally. The thermosonic bonding method is verified by inserting the Cu pin and Au bump into solder block. As the solder thickness decreases, temperature of the solder is calculated to increase rapidly because of larger strain. Localized heating due to ultrasonic vibration is observed to melt the solder near the pin, which is adequate to the high density electronic package and Pb-free solder having high melting temperature.

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Quantitative Evaluation Method for Etch Sidewall Profile of Through-Silicon Vias (TSVs)

  • Son, Seung-Nam;Hong, Sang Jeen
    • ETRI Journal
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    • v.36 no.4
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    • pp.617-624
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    • 2014
  • Through-silicon via (TSV) technology provides much of the benefits seen in advanced packaging, such as three-dimensional integrated circuits and 3D packaging, with shorter interconnection paths for homo- and heterogeneous device integration. In TSV, a destructive cross-sectional analysis of an image from a scanning electron microscope is the most frequently used method for quality control purposes. We propose a quantitative evaluation method for TSV etch profiles whereby we consider sidewall angle, curvature profile, undercut, and scallop. A weighted sum of the four evaluated parameters, nominally total score (TS), is suggested for the numerical evaluation of an individual TSV profile. Uniformity, defined by the ratio of the standard deviation and average of the parameters that comprise TS, is suggested for the evaluation of wafer-to-wafer variation in volume manufacturing.

Nonlinear Earthquake Response Analysis of 2-D Underground Structures with Soil-Structure Interaction Including Separation and Sliding at Interface (지반-구조물 상호작용계의 경계면에서 미끄러짐과 분리현상을 고려한 이차원 지하구조물의 비선형 지진응답해석)

  • 최준성;이종세;김재민
    • Proceedings of the Computational Structural Engineering Institute Conference
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    • 2002.04a
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    • pp.174-181
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    • 2002
  • The paper presents an effective analytical method for SSI systems which can have separation or sliding at the soil-structure interface. The method is based on a hybrid approach which combines a linear SSI code KIESSI-2D in frequency domain with a commercial finite element package ANSYS to obtain nonlinear dynamic responses in time domain. The method is applied to a 2-D underground box structure which experiences separation and sliding at the soil-structure interface. Material nonlinearity of the concrete structure is also included in the analysis. Effects of the interface conditions are examined and some critical factors affecting the seismic performance of underground structures are identified.

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