• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.9
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• pp.1408-1414
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• 2004

The use of flip-chip technology has many advantages over other approaches for high-density electronic packaging. ACF (anisotropic conductive film) is one of the major flip-chip technologies, which has short chip-to-chip interconnection length, high productivity, and miniaturization of package. In this study, thermal fatigue lift of ACF bonding flip-chip package has been predicted. Elastic and thermal properties of ACF were measured by using DMA and TMA. Temperature dependent nonlinear hi-thermal analysis was conducted and the result was compared with Moire interferometer experiment. Calculated displacement field was well matched with experimental result. Thermal fatigue analysis was also conducted. The maximum shear strain occurs at the outmost located bump. Shear stress-strain curve was obtained to calculate fatigue life. Fatigue model for electronic adhesives was used to predict thermal fatigue life of ACF bonding flip-chip packaging. DOE (Design of Experiment) technique was used to find important design factors. The results show that PCB CTE (Coefficient of Thermal Expansion) and elastic modulus of ACF material are important material parameters. And as important design parameters, chip width, bump pitch and bump width were chose. 2$^{nd}$ DOE was conducted to obtain RSM equation far the choose 3 design parameter. The coefficient of determination ($R^2$) for the calculated RSM equation is 0.99934. Optimum design is conducted using the RSM equation. MMFD (Modified Method for feasible Direction) algorithm is used to optimum design. The optimum value for chip width, bump pitch and bump width were 7.87mm, 430$\mu$m, and 78$\mu$m, respectively. Approximately, 1400 cycles have been expected under optimum conditions. Reliability analysis was conducted to find out guideline for control range of design parameter. Sigma value was calculated with changing standard deviation of design variable. To acquire 6 sigma level thermal fatigue reliability, the Std. Deviation of design parameter should be controlled within 3% of average value.

• The Transactions of the Korean Institute of Power Electronics
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• v.10 no.5
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• pp.481-487
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• 2005

Proposed induction-heated system is innovative system which applied special high-frequency power circuit technique for thermal converse technique and IH(Induction-Heating) magnetic induction heating generated from induction-heated metallic package that is for distillation unit. In this occurs not burning, so that the working environment can be improved. This electromagnetic induction heating technique is used high frequency inverter, By using high frequency inverter high frequency alternative current in the range of [kHz] can be made with conventional alternative current. In this contribution IGBT module is used for high frequency inverter. This paper proposes new fluid heating method. Which is operated as follows. Working coil, which is wrapped outside of pipeline, makes the eddy current. Inside of heating vessel in isolated pipeline the specially designed stainless metallic package is inserted, which can be heated by eddy current losses. And then In this paper are discussed action analysis and characteristics analysis of 5[kW] class full-bridge resonant inverter system and resonant metallic package. In addition, by using this system, how high-efficiency heater is developed and application of system are also discussed.

• Journal of Welding and Joining
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• v.24 no.2
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• pp.64-70
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• 2006

The 3-dimensional (3D) chip stacking technology is a leading technology to realize a high density and high performance system in package (SiP). There are several kinds of methods for chip stacking, but the stacking and interconnection through Cu filled through-hole via is considered to be one of the most advanced stacking technologies. Therefore, we studied the optimum process of through-hole via formation and Cu filling process for Si wafer stacking. Through-hole via was formed with DRIE (Deep Reactive ion Etching) and Cu filling was realized with the electroplating method. The optimized conditions for the via formation were RE coil power of 200 W, etch/passivation cycle time of 6.5 : 6 s and SF6 : C4F8 gas flow rate of 260 : 100 sccm. The reverse pulsed current of 1.5 A/dm2 was the most favorable condition for the Cu electroplating in the via. The Cu filled Si wafer was chemically and mechanically polished (CMP) for the following flip chip bumping technology.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.26 no.2
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• pp.61-69
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• 2020

As post-harvest processes of onions are carried by a 20 kg-net package which results in high-cost and low-efficiency, especially, the insufficient drying and physical damage of onions after harvesting leads to a huge second loss in storage, we had developed a low-cost, high-efficiency post-harvest bulk handling machinery system by collecting onions on a farm using ton-bags, drying with forced air circulation, and sorting/packaging. The post-harvest bulk handling machinery system consisted of 6 devices, and this study designed an automatic feed hopper with a feeding rate control device, an inclined belt conveyor with a two-step chute, and an automatic pallet unloading device for feeding onions into the sorting/packing line. This study also analyzed the performance and control of the total system. The device had 1-ton handling capacity, but the operational condition was set to increase the capacity. The three-step filling method of pallet by the velocity control of the inclined belt conveyor was applied in the post-harvest bulk handling machinery system for the prevention of physical damage. If one worker was set to operate the total system, the time required to complete one palletized load was approximately 5 minutes and 5 seconds. The calculated daily handling capacity was approximately 94 tons, when the daily actual working time was 8 hours. When the developed system was applied to the managerial size of 2,000 ton, the processing cost per ton of the system was decreased by 19.5%, compared with the existing 20 kg-net package-based handling. The developed post-harvest bulk handling machinery system would be a good substitute for the rapid decline and aging of rural labor.

• Journal of the Ergonomics Society of Korea
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• v.30 no.5
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• pp.659-669
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• 2011

Objective: The aim of this study is to suggest a package layout guideline for low-floor bus by interview with passengers and observations of their behavior. Background: Increasing attention has been introduced the low-floor bus to be more suitable for use by transportation handicapped. Complex issues are involved in providing comfortable services to all people. We are going to suggest package layout guidelines for more comfortable and suitable travel to all people. Method: The two times of survey and video observation sessions were conducted on low-floor buses in Seoul; (1) a finding of potential issues in the first session, (2) a confirming of issues from the last session. Results: The three of major issues were founded in this study; (1) difficulties in supporting body when standing, (2) difficulties in sitting on front wheel pan seat, (3) difficulties in passing through the aisle. Conclusion: There were clear differences between public and transportation handicapped in using some tools which are used for support body such as roof hand rails, side hand rails, and hand rail rings. Some of design problems were founded to improve from the perspective of ergonomics and universal design. Such differences and design guidelines have to be considered in bus design as well as commercial vehicle. Application: The proposed design guidelines can be used to development of low-floor bus and other public transportations.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.17 no.2
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• pp.39-42
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• 2011

The aim of this study was to develop the appropriate packaging method for minimally processed sliced onions. The films of different gas permeabilities (LDPE $30{\mu}m$, PD900 and PD941) were used for packaging 1300g of onion slices cut into octuplicate pieces. Perforated LDPE package was prepared as control for comparison. The package atmosphere and onion quality were measured through storage at $1^{\circ}C$ for 38 days. PD900 package of the lowest gas permeability was the best in keeping the fresh-cut onions by maintaining MA conditions of 1-3% $O_2$ and 4-11% $CO_2$ concentrations. The benefits were reduced discoloration, decay and soakness.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.41-45
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• 2018

We have simulated the process induced warpage for panel level package using finite element method. Silicon chips of $5{\times}5mm^2$ were redistributed on $122.4{\times}93.6mm^2$ size panel and the total number of redistributed chips was 221. The warpage at each process step, for example, (1) EMC molding, (2) attachment of detach core, (3) heating, (4) removal of a carrier, and (5) cooling was simulated using ANSYS and the effects of detach core and carrier materials on the warpage were investigated. The warpage behaved complexly depending on the materials for the detach core and carrier. However, glass carrier showed the lower warpage than FR4 carrier regardless of detach core material, and the minimum warpage was observed when the glass was used for the detach core and carrier at the same time.

• Journal of Digital Convergence
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• v.19 no.1
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• pp.373-378
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• 2021

This study is a study on user experience design of Meal Kit product information. The purpose of this study is to derive the product information necessary for the purchaser and the necessity for the convenience of use, and to propose an improvement plan. When purchasing Meal Kit products, two types of domestic Meal Kit brands, Peacock and Fresheasy, were compared and analyzed for information on nutrition intake, package design, and environmental issues. As a research method, a questionnaire survey was conducted by deriving 7 factors for purchasing Meal Kit products through literature research and prior research. Proceeded. As a result of the study, the factors that satisfy buyers were in the order of cooking process, food, taste/nutrition, package, convenience, price, and information, and overpacking was also revealed as a problem. Through this, it was possible to derive improvements and develop plans for the Meal Kit product. It is expected that this study will help improve the dietary life of One person households and develop Meal Kit products in the future.

• Korean Journal of Remote Sensing
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• v.37 no.3
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• pp.567-575
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• 2021

In order to correct the provided RPC and DEM generated from the high-resolution satellite images, the acquisition of the ground control point (GCP) must be preceded. This task is a very complicate that requires field surveys, GPS surveying, and image coordinate reading corresponding to GCPs. In addition, since it is difficult to set up and measure a GCP in areas where access is difficult or impossible (tidal flats, polar regions, volcanic regions, etc.), an alternative method is needed. In this paper, we propose a 3D surface matching technique using only the established ground coordinate package, avoiding the ground-image-location survey of the GCP to correct the DEM produced from WorldView-2 satellite images and the provided RPCs. The location data of the public control points were obtained from the National Geographic Information Institute website, and the DEM was corrected by performing 3D surface matching with this package. The accuracy of 3-axis translation and rotation obtained by the matching was evaluated using pre-measured GPS checkpoints. As a result, it was possible to obtain results within 2 m in the plane location and 1 m in height.

• Food Science and Industry
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• v.50 no.2
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• pp.12-26
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• 2017

Processing steps such as washing and cutting, involved in preparing fresh-cut produce causes tissue damage, leading to rapid quality deterioration. Major defects of fresh-cut produce are discoloration, softening, off-odor development, and microbial growth. Packaging of fresh-cut produce has been changed to reduce these quality problems. Flexible packaging film is widely used to pack fresh-cut produce. Vacuum packaging was the popular packaging method in the beginning of fresh-cut industry in Korea. Vacuum packaging creates high $CO_2$ and low $O_2$ levels to control browning of fresh-cut produce. However, these conditions induce some visual defects and off-odor development. Discoloration problem was also found when fresh-cut produce was packaged with conventional packaging film or plastic tray. Modified atmosphere (MA) packaging is effective for prolonging shelf-life of fresh-cut produce by decreasing $O_2$ and increasing $CO_2$ concentration in the package. Retail MA packaging using different oxygen transmission rate (OTR) film and micro-perforated film has started to be applied to fresh-cut produce in Korea. Proper MA package design that provides optimum range of $O_2$ and $CO_2$ partial pressures is one of the major challenges in the industry. An initial package flushing with $N_2$ or an low $O_2$/high $CO_2$ atmosphere is also used to more rapidly establish steady-state MA condition. Film OTR and $O_2$ flushing affects the fermentative volatile production, off-odor development, electrolyte leakage, discoloration, $CO_2$ injury, microbial population of fresh-cut produce. There is also a demand for convenient packaging to attract consumers. Rigid fresh-cut produce container for retail market has increased since the packaging provides excellent protection from physical damage during transport. Rigid tray used as actual serving vessel for the consumer is increasing in Korea. The tray with flexible lid to wrap or seal fresh-cut produce is more and more gaining popularity. Further practical technology to control quality change and microbial growth for each fresh-cut product has been studied since various fresh-cut items were required. The fresh-cut industry also focuses on searching for more convenient and environmentally friendly packaging.