• 제어로봇시스템학회:학술대회논문집
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• 2005.06a
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• pp.2410-2413
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• 2005

Finite element method (FEM) has been widely used as a useful numerical method that can analyze complex engineering problems in electro-magnetics, mechanics, and others. CEMTool, which is similar to MATLAB, is a command style design and analyzing package for scientific and technological algorithm and a matrix based computation language. In this paper, we present new 3D FEM package in CEMTool environment. In contrast to the existing CEMTool 2D FEM package and MATLAB PDE (Partial Differential Equation) Toolbox, our proposed 3D FEM package can deal with complex 3D models, not a cross-section of 3D models. In the pre-processor of 3D FEM package, a new 3D mesh generating algorithm can make information on 3D Delaunay tetrahedral mesh elements for analyses of 3D FEM problems. The solver of the 3D FEM package offers three methods for solving the linear algebraic matrix equation, i.e., Gauss-Jordan elimination solver, Band solver, and Skyline solver. The post-processor visualizes the results for 3D FEM problems such as the deformed position and the stress. Consequently, with our new 3D FEM toolbox, we can analyze more diverse engineering problems which the existing CEMTool 2D FEM package or MATLAB PDE Toolbox can not solve.

• Journal of the Semiconductor & Display Technology
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• v.6 no.1 s.18
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• pp.17-22
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• 2007

Recent new packages such as MCP(Multi-Chip Package), QDP(Quadratic Die Package) and DDP(Dual Die Package) have stack type configuration. This kind of multi-layer package is thicker than single layer package. So there is need for the low height looping technology in wirebonder to make these packages thinner. There is stiff zone above ball in wirebonder wire which is called HAZ(Heat Affect Zone). When making low height loop (below $80\;{\mu}m$) with traditional forward loop, stiff wire in HAZ(Heat Affected Zone) above ball is bended and weakened. So the traditional forward looping method cannot be applied to low height loop. SSB(stand-off stitch) wire bonding method was applied to many packages which require very low loops. The drawback of SSB method is making frequent errors at making ball, neck damage above ball on lead and the weakness of ball bonding on lead. The alternative looping method is BNL(ball neckless) looping technology which is already applied to some package(DDP, QDP). The advantage of this method is faster in bonding process and making little errors in wire bonding compared with SSB method. This paper presents the result of BNL looping technology applied in assembly house and several issues related to low loop height consistence and BNL zone weakness.

• Korea Journal of Hospital Management
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• v.6 no.3
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• pp.90-108
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• 2001

This research examines the compensation package maximizing the utilities of internal customers by applying the market segmentation theory. Data were collected from four Korean hospitals in Seoul, Pusan and Kyunggi-do. The research is designed to seek the compensation package maximizing the utility of doctors and nurses by applying the market segmentation theory. The compensation package for doctors and nurses was classified into 5 attributes which are level of salary, payment method, education, promotion, reward method. The test results were as follows. First, the relative importance of each attribute in the compensation package is different. The level of salary is the most important, reward method is the next. Second, the utility of doctors increases by 8.7%, when they are segmented on the basis. of their preference for compensation attributes while that of nurses increases by 39.8%. The results of this study imply that the utility of doctors and nurses increases with differentiated compensation package for internal customer segmented by their preference.

• Proceedings of the KIEE Conference
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• 2004.07d
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• pp.2568-2570
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• 2004

CEMTool is a command style design and analyzing package for scientific and technological algorithm and a matrix based computation language. In this paper, we present new FEM (Finite Element Method) package in CEMTool environment. In contrast to the existing MATLAB PDE Toolbox, our proposed FEM package can deal with the combination of the reserved words. Also, we can control the mesh in a very effective way With the introduction of new mesh generation algorithm and NDM (Hosted Dissection Method), our FEM package can guarantee the shorter computational time than MATLAB PDE Toolbox. In addition, using the advanced electromagnetics library of CEMTool FEM package, we can analyze the practical problems such as the motor field analysis. Consequently, with our new FEM package, we can overcome some disadvantages of the existing MATLAB PDE Toolbox.

• The Korea Journal of Herbology
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• v.24 no.1
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• pp.9-14
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• 2009

Objectives : The purpose of this study is to investigate on storage characteristics of flavouring oriental medicine materials according to Packaging method(Aluminum package, PP). Methods : This experiments were carried out by field survey and storage characteristics were carried out by physicochemical determination. Results : Flavouring oriental medicine materials were used to in aluminum package to keep original flavour in Japan and Chinese by field and study survey. In view of this survey results, it is very desirable to use zipper Aluminum package in flavouring oriental medicine materials(Perilla perfrutescens var. acuta, Mentha arvensis L. var. piperascens malinvaud). Conclusions : This study results revealed that Aluminum package were superior to any other package method on the basis of keeping original flavour and to reduce microbial contamination in oriental medicine materials.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.12
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• pp.21-26
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• 2004

In this paper, a direct method is developed to extact RF equivalent circuit of a packaged BJT without optimization. First, parasitic components of plastic package are removed from measured S-parameters using open and short package patterns. Using package do-embedded S-parameters, a direct and simple method is proposed to extract bonding wire inductance and chip pad capacitance between package lead and chip pad. The small-signal model parameters of internal BJT are next determined by Z and Y-parameter formula derived from RF equivalent circuit. The modeled S-parameters of packaged BJT agree well with measured ones, verifying the accuracy of this new extraction method.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.31 no.2
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• pp.122-127
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• 2018

In an attempt to estimate the life projection of LED packages, IESNA published a paper regarding an LED package measurement test method in 2008, and a life projection technical document in 2011, to be used for LED life estimation. IESNA's publications regarding LED package measurement methods were functional, but they were not internationally standardized before 2017. In order to develop a standardized method, the International Standard chose to use the LM-80 as a measurement method for LED life projection in their publication in 2017. Many projection methods have been discussed by the IEC Technical Committee 34 working group, including the method using an exponential function, which reflects lumen degradation characteristics well. This study is designed to explore alternative LED package life estimation methods using an exponential function with statistical analysis, other than the one suggested by the International Standard.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.11a
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• pp.53-56
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• 2004

This paper presents the improved burn-in method for the reliability of SRAM in MCP Semiconductor reliability is commonly improved through the burn-in process. Reliability problem is more significant in the Multi Chip Package, because of including over two devices in a package. In the SRAM-based Multi Chip Package, the failure of SRAM has a large effect on the yield and quality of the other chips - Flash Memory, DRAM, etc. So, the quality of SRAM must be guaranteed. To improve the quality of SRAM, we applied the improved wafer level burn-in process using multi cell selection method in addition to the current used methods. That method is effective in detecting special failure. Finally, with the composition of some kinds of methods, we could achieve the high qualify of SRAM in Multi Chip Package.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1565-1568
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• 2003

The backward extrusion process is one of the commonly used metal forming processes. In this paper. a battery case which has the rectangular section, is analyzed using a 3D metal forming package(MSC.Superforge). This pacakge uses the finite volume analysis method. It is shown that the MSC.Superforge package using finite volume method provides result very close to those obtained from a finite element analysis package(MSC.Superform). However, the simulation time using the finite volume method was almost 10 % of the simulation time consumed by the other package using finite element method. Moreover, the finite volume method used in MSC.Superforge can eliminate the remeshing problems that make the simulating a metal forming process with severe deformation, such as the extrusion process, so difficult.

• Journal of the Korean Society for Nondestructive Testing
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• v.12 no.4
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• pp.18-25
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• 1993

This paper is to aim the microdefect evaluation of If package into a quantitative from NDI's image processing of ultrasonic wave. (1) Automatically repeated discrimination analysis method can be devided in the category of all kind of defects on IC package, and also can be possible to have a sampling of partial delamination. (2) It is possible that the information of edge section in silicon chip surrounding can be extractor by the partial image processing of IC package. Also, the crack detection is possible between the resin part and lead frame.