• Journal of the Microelectronics and Packaging Society
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• v.14 no.4
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• pp.9-14
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• 2007

In this study, the thermal reliability on flip chip package with non-conductive pastes (NCPs) was evaluated under accelerated conditions. As the number of thermal shock cycle and the dwell time of temperature and humidity condition increased, the electrical resistance of the flip chip package with NCPs increased. These phenomenon was occurred by the crack between Au bump and Au bump and the delamination between chip or substrate and NCPs during the thermal shock and temperature and humidity tests. And the variation of electrical resistance during temperature and humidity test was larger than that during thermal shock test. Therefore it was identified that the flip chip package with NCPs was sensitive to environment with moisture.

• Transactions on Electrical and Electronic Materials
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• v.18 no.2
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• pp.59-61
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• 2017

This research was analyzed thermal characteristics that was appointed disadvantage when smart LED driver ICs was packaged and we applied extracted thermal characteristics for optimal layout design. We confirmed reliability of smart LED driver ICs package without additional heat sink. If the package is not heat sink, we are possible to minimize package. For extracting thermal loss due to overshoot current, we increased driver current by two and three times. As a result of experiment, we obtained 22 mW and 49.5 mW thermal loss. And we obtained optimal data of 350 mA driver current. It is important to distance between power MOSFET and driver ICs. If the distance was increased, the temperature of package was decreased. And so we obtained optimal data of 3.7 mm distance between power MOSFET and driver ICs. Finally, we fabricated real package and we analyzed the electrical characteristics. We obtained constant 35 V output voltage and 80% efficiency.

• Food Science and Biotechnology
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• v.18 no.1
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• pp.73-78
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• 2009

Processed meatball products were packaged in a passive package without oxygen scavenger as 1 control and 3 active packages of which have PP-based oxygen scavenger master batch materials (OSMB) of 40, 80, and 100%(w/w) in the middle layer and stored at 23 and $30^{\circ}C$ up to 9 months. Quality changes of packaged products were evaluated by measuring the oxygen concentration of the headspace in containers, thiobarbituric acid (TBA), color, and flavor. The oxygen concentration of the package having 100% OSMB was lower than those of 40 and 80%. The color changes and TBA values of the meat ball in the package containing 100% OSMB were the least among the treatments. Using principal component analysis (PCA), the control showed more flavor change than the packages containing oxygen scavenger. As a result, all active packages could extend the shelf life of the meatball products compared with that of the passive package.

• Journal of Sensor Science and Technology
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• v.25 no.3
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• pp.173-177
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• 2016

Tape casting ceramics technology has been adopted for the fabrication of solid state electrochemical $CO_2$ sensors and the packaging substrates. The fabricated $CO_2$ sensors exhibit a fast response and a good recovery with the almost theoretical sensitivity of 37 mV/decade, corresponding to a sensor operating temperature of 373 K. The two packaging methods, the wire bonding package and the surface- mounted on the ceramic package, were compared with respect to their power consumption and mass production feasibility. In terms of the ease of fabrication, the surface mount packaging technology is superior to the wire bonding technology but its power consumption is approximately twice that of the wired package.

• Korean Journal of Materials Research
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• v.22 no.11
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• pp.587-590
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• 2012

Recently, the demand for the miniaturization of package substrates has been increasing. Technical innovation has occurred to move package substrate manufacturing steps into CMP applications. Electroplated copper filled trenches on the substrate need to be planarized for multi-level wires of less than $10{\mu}m$. This paper introduces a chemical mechanical planarization (CMP) process as a new package substrate manufacturing step. The purpose of this study is to investigate the effect of surfactant on the dishing and erosion of Cu patterns with the lines and spaces of around $10/10{\mu}m$ used for advanced package substrates. The use of a conventional Cu slurry without surfactant led to problems, including severe erosion of $0.58{\mu}m$ in Cu patterns smaller than $4/6{\mu}m$ and deep dishing of $4.2{\mu}m$ in Cu patterns larger than $14/16{\mu}m$. However, experimental results showed that the friction force during Cu CMP changed to lower value, and that dishing and erosion became smaller simultaneously as the surfactant concentration became higher. Finally, it was possible to realize more globally planarized Cu patterns with erosion ranges of $0.22{\mu}m$ to $0.35{\mu}m$ and dishing ranges of $0.37{\mu}m$ to $0.69{\mu}m$ by using 3 wt% concentration of surfactant.

• Journal of Fashion Business
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• v.27 no.2
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• pp.108-123
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• 2023

Recent increase of eco-conscious trends and pleasure from Do It Yourself (DIY) activities have led to a surge in sales of package products bundling together clothing patterns and raw materials. However, a well-structured market system is yet to be established. We surveyed 460 women with sewing as a hobby who had purchased these DIY clothing pattern packages. The survey revealed that majority of respondents had their hobby for over five years. Choosing the right fabric to match clothing patterns presented a common challenge. Most participants owned a sewing machine and an overlocker, with price being the primary concern when purchasing a package. For guidance during the sewing process, participants preferred print materials featuring real-life images. Those with less sewing experience leaned towards video tutorials. Items of interest or those commonly created included blouses, shirts, and dresses. Desire for further learning in sewing and pattern-making was prominent, with a clear preference for online classes. Several strategies are recommended to enhance the appeal of DIY clothing package products, including broadening range of packages that incorporate fabric, offering supplementary educational resources to improve users' skills, implementing affordable pricing structures, supplying comprehensive creation guidelines, and making available design modification guides. These considerations could significantly boost customer satisfaction. This research intends to lay groundwork for understanding DIY clothing creation market, ultimately fostering production of highly desirable products. Insights of this study will prove instrumental in refining product development and devising effective marketing tactics, leading to a more rewarding consumer experience.

• Korean Journal of Metals and Materials
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• v.48 no.11
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• pp.1035-1040
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• 2010

The research efforts on GaN-based light-emitting diodes (LEDs) keep increasing due to their significant impact on the illumination industry. Surface mount technology (SMT) is widely used to mount the LED packages for practical application. In surface mount soldering both the device body and leads are intentionally heated by a reflow process. We studied on the effects of multiple reflows on microstructural variation and joint strength of the solder joints between the LED package and the substrate. In this study, Pb-free Sn-3.0Ag-0.5Cu solder and a finished pad with organic solderability preservatives (OSP) were employed. A $Cu_6Sn_5$ intermetallic compound (IMC) layer was formed during the multiple reflows, and the thickness of the IMC layerincreased with an increasing number of reflows. The shear force decreased after three reflows. From the observation of the fracture surface after a shear test, partially brittle fractures were observed after five reflows.

• Archives of design research
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• v.21
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• pp.139-147
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• 1997

The concept of package in these day is getting changing with fluctuation of living and management circumstance. The is due to society trancefiguration and change of economic structure and induced to appear small paxkage. These package trend to covert from the class management to total management system and these system made a promotion to development current industry. In these day, with the development of industry and the progress of the life , the package is performing the first faculty such as perservation of manufacture, convenience of keeping and loading in , expedition of sale and additionally the role of package in modern economy is significant for the essen tial element of enterprise prosperity by improving its shape color and materials. It is readilly appearent to anyone in the recycling field that stable markets for collected materials are vitals to any successful program. The recycling movement has increased in popularity throughout the any country: however, it has brought with it a market for them. This attitute also prevails in the political arena where atates or municipalities who are committed to recycling major portion of the solid waste stream are asking these same question regarding the disposition of thte recycled material.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.05a
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• pp.79-84
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• 2002

The bottom-leaded plastic(BLP) packages have attracted substantial attention since its appearance in the electronic industry. Since the solder materials have relatively low creep resistance and are susceptible to low cycle fatigue, the life of the solder joints under the thermal loading is a critical issue for the reliability The represent study established a finite element model for the analysis of the solder joint reliability under thermal cyclic loading. An elasto-plastic constitutive relation was adopted for solder materials in the modeling and analysis. A 28-pin BLP assembly is modeled to investigate the effects of various epoxy molding compound, leadframe materials on solder joint reliability. The fatigue life of solder joint is estimated by the modified Coffin-Hanson equation. The two coefficients in the equation are also determined. A new design for lead is also evaluated by using finite element analysis. Parametric studies have been conducted to investigate the dependence of solder joint fatigue life on various package materials.

• Journal of the Korean institute of surface engineering
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• v.56 no.1
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• pp.77-83
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• 2023

The reliability of leadframe-based semiconductor package depends on the adhesion between metal and epoxy molding compound (EMC). In this study, the Ag surface was electrochemically treated in a solution containing silanes in order to improve the adhesion between Ag and epoxy substrate. After electrochemical treatment, the thin silane layer was deposited on the Ag surface, whereby the peel strength between Ag and epoxy substrate was clearly improved. The improvement of peel strength depended on the functional group of silane, implying the chemical linkage between Ag and epoxy.