• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2010.05a
• /
• pp.1455-1456
• /
• 2010

• IE interfaces
• /
• v.11 no.2
• /
• pp.125-137
• /
• 1998

A new vehicle design approach coupled with an ergonomic human model was proposed in the study. The seating package layout of a vehicle is very important to the driving comfort, and it has been one of the primary ergonomic research areas since the past 30 years. The diverse and interrelated design factors of seating package layout in the limited workspace make designers often neglect many parameters related with drivers which differ in their anthropometric characteristics. It is due to the lack of the proper tools by which the designer can easily apply several ergonomic design guidelines to the vehicle design. In this study. an iterative package layout procedure was developed, and the effectiveness of an ergonomic human model was examined in this procedure. A discomfort function was developed for the quantitative evaluation of the driving posture. This study clearly demonstrates that the package layout using an ergonomic human model is very helpful to improve the usability and driving comfort of the drivers or passengers.

• CDE review
• /
• v.2 no.1
• /
• pp.26-32
• /
• 1996

신규 차종의 개발시 차량의 exterior/interior의 design concept은 운전석주변의 driving package layout을 어떻게 구성하느냐에 따라 좌우되는 경향이 있다. 그것은 user가 그 차량의 선악의 판단함에 있어서 운전석 주변의 design 및 상품성이 큰 요인으로 작용하여 운전석 주변의 부품과 인간과의 적절한 조화를 이루어야 차량의 concept와 일치하는 최적의 design으로 user의 감성을 얻을 수 있는 것이다. 따라서 본 고에서는 신규 차종의 초기 개발 단계에서 최적의 design 및 상품성을 얻기 위한 보다 효과적인 driving package layout을 설정하기 위해 1차적 3차원 인체모형(3DM, 3-Dimensional Manikin)을 구성하고자 한다. 3DM은 human engineering에 의한 인체 치수와 각 관절의 운동방향 및 범위를 이용하여 인체의 동적 해석을 model을 도상 구현하고 이러한 3DM을 활용하여 조작성, 편의성 등의 package layout을 가시화 해 보고자 한다.

• Journal of the Ergonomics Society of Korea
• /
• v.21 no.2
• /
• pp.47-58
• /
• 2002

This research suggested the mathematical model (forward kinematics method) to provide the reference points of driver space more easily and accurately in designing the package layout of vehicle interiors. For this purpose, the lengths of body segments of drivers and various joint angles occurred while were used. The length data between joints for the mathematical model were extracted from $SAFEWORK^{\circed{R}}$ as well as 95th percentile male and 5th percentile female body dimensions were utilized. In addition, the angles of body segments were applied on its diverse values within proper ranges in order to compare them each other. the mathematical model in this study was based on the concept of converting polar coordinate system to Cartesian coordinate system so that reference points of driver space were acquired in Cartesian coordinate system after using the segment lengths of drivers and the joint angles of driving postures as an input of polar coordinate system. It is expected that reference points of driver space obtained from this research are helpful to the study on package layout that is appropriate for physical characteristics of drivers.

• Journal of the Microelectronics and Packaging Society
• /
• v.20 no.4
• /
• pp.75-79
• /
• 2013

A power distribution network (PDN) is a network that provides connection between the voltage source supply and the power/ground terminals of a microprocessor chip. It consists of a voltage regulator module, a printed circuit board, a package substrate, a microprocessor chip as well as decoupling capacitors. For power integrity analysis, the board and package layouts have to be transformed into an electrical network of resistor, inductor and capacitor components which may be expressed using the S-parameters models. This modeling process generally takes from several hours up to a few days for a complete board or package layout. When the board and package layouts change, they need to be re-extracted and the S-parameters models also need to be re-generated for power integrity assessment. This not only consumes a lot of resources such as time and manpower, the task of PDN modeling is also tedious and mundane. In this paper, a block-based PDN modeling is proposed. Here, the board or package layout is partitioned into sub-blocks and each of them is modeled independently. In the event of a change in power rails routing, only the affected sub-blocks will be reextracted and re-modeled. Simulation results show that the proposed block-based PDN modeling not only can save at least 75% of processing time but it can, at the same time, keep the modeling accuracy on par with the traditional PDN modeling methodology.

• The monthly packaging world
• /
• s.132
• /
• pp.142-153
• /
• 2004

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.29 no.2
• /
• pp.79-83
• /
• 2016

This research was analyzed thermal characteristics that was appointed disadvantage when smart LED driver ICs was packaged and we applied extracted thermal characteristics for optimal layout design. We confirmed reliability of smart LED driver ICs package without additional heat sink. If the package is not heat sink, we are possible to minimize package. For extracting thermal loss due to overshoot current, we increased driver current by two and three times. As a result of experiment, we obtained 22 mW and 49.5 mW thermal loss. And we obtained optimal data of 350 mA driver current. It is important to distance between power MOSFET and driver ICs. If thhe distance was increased, the temperature of package was decreased. And so we obtained optimal data of 3.7 mm distance between power MOSFET and driver ICs. Finally, we fabricated real package and we analyzed the electrical characteristics. We obtained constant 35 V output voltage and 80% efficiency.

• Journal of the Microelectronics and Packaging Society
• /
• v.24 no.4
• /
• pp.91-95
• /
• 2017

Package-On-Package (PoP) technology is developing toward smaller form factors with high-speed data transfer capabilities to cope with high DDR4x memory capacity. The common application processor (AP) used for PoP devices in smartphones has the bottom package as logic and the top package as memory, which requires both thermally and electrically enhanced functions. Therefore, it is imperative that PoP designs consider both thermal and power distribution network (PDN) issues. Stacked packages have poorer thermal dissipation than single packages. Since the bottom package usually has higher power consumption than the top package, the bottom package impacts the thermal budget of the top package (memory). This paper investigates the thermal and electrical characteristics of PoP designs, particularly the bottom package. Findings include that via and dense via-cluster volume have an important role to lower thermal resistance to the motherboard, which can be an effective way to manage chip hot spots and reduce the thermal impact on the memory package. A Cu block and dense via-cluster layout with an optimal location are proposed to drain the heat from the chip hot spots to motherboard which will enhance thermal and electrical performance at the design stage. The analytical thermal results can be used for design guidelines in 3D packaging.

• Nuclear Engineering and Technology
• /
• v.31 no.6
• /
• pp.83-100
• /
• 1999

As disposal packaging concepts of spent fuels generated from the domestic NPP, two types, one is to package PWR and CANDU spent fuels in different containers and the other is to package them together, were proposed. The configuration of the containers and the layout of underground repository, such as the container spacing and the deposition tunnel spacing, were developed. The layout of underground repository satisfies the thermal constraint of the bentonite buffer surrounding disposal container, which should be lower than $100^{\circ}C$ in order to keep the physical and chemical properties of bentonite From the spent fuel packaging concepts and container emplacement methods, seven options were developed. With a typical pair-wise comparison methods, AHP, the most promising disposal concept was selected based on the technology Point of view.

• IE interfaces
• /
• v.25 no.2
• /
• pp.264-275
• /
• 2012

The process of semiconductor(IC Package) manufacturing usually includes lots of complex and sequential processes. Many kinds of equipments are installed with the mixed concept of serial and parallel manufacturing system. The business environments of the semiconductor industry have been changed frequently, because new technologies are developed continuously. It is the main reason of new investment plan and layout consideration. However, it is difficult to change the layout after installation, because the major equipments are expensive and difficult to move. Furthermore, it is usually a multiple-objective problem. Thus, new investment or layout change should be carefully considered when the production environments likewise product mix and production quantity are changed. This paper introduces a simulation case study of a Korean company that produces packaging substrates(especially lead frames) and requires multi-objective decision support. $QUEST^{(R)}$ is used for simulation modelling and AHP(Analytic Hierarchy Process) and DEA(Data Envelopment Analysis) are used for weighting of qualitative performance measures and solving multiple-objective layout problem, respectively.