IE interfaces (산업공학)

Korean Institute of Industrial Engineers (대한산업공학회)
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Determination of New Layout in a Semiconductor Packaging Substrate Line using Simulation and AHP/DEA

시뮬레이션과 AHP/DEA를 이용한 반도체 부품 생산라인 개선안 결정

  • Kim, Dong-Soo (Department of Industrial and Systems Engineering, Changwon National University) ;
  • Park, Chul-Soon (Department of Industrial and Systems Engineering, Changwon National University) ;
  • Moon, Dug-Hee (Department of Industrial and Systems Engineering, Changwon National University)
  • 김동수 (창원대학교 산업시스템공학과) ;
  • 박철순 (창원대학교 산업시스템공학과) ;
  • 문덕희 (창원대학교 산업시스템공학과)
  • Received : 2011.11.01
  • Accepted : 2011.12.12
  • Published : 2012.06.01
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Abstract

The process of semiconductor(IC Package) manufacturing usually includes lots of complex and sequential processes. Many kinds of equipments are installed with the mixed concept of serial and parallel manufacturing system. The business environments of the semiconductor industry have been changed frequently, because new technologies are developed continuously. It is the main reason of new investment plan and layout consideration. However, it is difficult to change the layout after installation, because the major equipments are expensive and difficult to move. Furthermore, it is usually a multiple-objective problem. Thus, new investment or layout change should be carefully considered when the production environments likewise product mix and production quantity are changed. This paper introduces a simulation case study of a Korean company that produces packaging substrates(especially lead frames) and requires multi-objective decision support. $QUEST^{(R)}$ is used for simulation modelling and AHP(Analytic Hierarchy Process) and DEA(Data Envelopment Analysis) are used for weighting of qualitative performance measures and solving multiple-objective layout problem, respectively.

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References

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