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http://dx.doi.org/10.7232/IEIF.2012.25.2.264

Determination of New Layout in a Semiconductor Packaging Substrate Line using Simulation and AHP/DEA  

Kim, Dong-Soo (Department of Industrial and Systems Engineering, Changwon National University)
Park, Chul-Soon (Department of Industrial and Systems Engineering, Changwon National University)
Moon, Dug-Hee (Department of Industrial and Systems Engineering, Changwon National University)
Publication Information
IE interfaces / v.25, no.2, 2012 , pp. 264-275 More about this Journal
Abstract
The process of semiconductor(IC Package) manufacturing usually includes lots of complex and sequential processes. Many kinds of equipments are installed with the mixed concept of serial and parallel manufacturing system. The business environments of the semiconductor industry have been changed frequently, because new technologies are developed continuously. It is the main reason of new investment plan and layout consideration. However, it is difficult to change the layout after installation, because the major equipments are expensive and difficult to move. Furthermore, it is usually a multiple-objective problem. Thus, new investment or layout change should be carefully considered when the production environments likewise product mix and production quantity are changed. This paper introduces a simulation case study of a Korean company that produces packaging substrates(especially lead frames) and requires multi-objective decision support. $QUEST^{(R)}$ is used for simulation modelling and AHP(Analytic Hierarchy Process) and DEA(Data Envelopment Analysis) are used for weighting of qualitative performance measures and solving multiple-objective layout problem, respectively.
Keywords
multiple-objective layout problem; semiconductor process; simulation; capacity; layout; AHP; DEA;
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Times Cited By KSCI : 1  (Citation Analysis)
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1 Braglia, M., Frosolini, M., and Zammori, F. (2009), Overall Equipment Effectiveness of a Manufacturing Line (OEEML) : An Integrated Approach to Assess Systems Performance, Journal of Manufacturing Technology Management, 20(1), 8-29.   DOI   ScienceOn
2 Cho, K. T., Cho, Y. K., and Kang, Y. S. (2003), Decision-making the leader's class analysis enemy who go first, Dong Ah publishing company.
3 Charnes, A., Cooper, W. W., and Rhodes, E. (1978), Measuring the Efficiency of Decision Making Units, European Journal of Operational Research, 2, 429- 444.   DOI   ScienceOn
4 Dayhoff, J. E. and Athrrton, R. W. (1984), Simulation of VLSI Manufacturing Areas, VLSI Design, 84-92.
5 Han, Y. S., Park, D. S., and Lee, C. G. (2005), Standardization of a Simulation 300mm FAB Semiconductor Manufacturing, MASM 2005 3rd International Conference on Modeling and Analysis of Semiconductor Manufacturing, 111-118.
6 Hannan, E. L. (1983), Fuzzy Decison Making with Multiple Objectives and Discrete Membership Functions, International Journal of Man-Machine Studies, 18, 49-54.   DOI   ScienceOn
7 Jang, H. D. and Lee, J. H. (2011), An Efficient Selection of Promising Technology Using DEA and AHP, Korea Corporation Management Associator, 18(2), 67-85.
8 Kim, D. S. and Moon, D. H. (2011), A Case Study of Comparing the Measuring Methods for Workloads of Resources in a Manufacturing Process of Semiconductor-Parts, Journal of the Korea Society for Simulation, 20(3), 49-58.   DOI
9 Kim, J. B., Kim, W. J., and Cho, N. W. (2008), An Efficiency Evaluation among Manufacturing Processes using Hybrid DEA/AHP Model, IE Interfaces, 21(3), 302-311.
10 Lee, Y. H. (2001), Eastern Exposure of Production Management Study of Semiconductor industry, Journal of the Korean Production and Operations Management Society, 11(3), 85-110.
11 Moon, D. H., Shin, K. W., Park, C. S., and Kim, D. S. (2009), A Manufacturing System Simulation of Semiconductor Packaging Substrate, Proceedings of 2009 Spring SIM, San Diego, U.S.A., 283-288.
12 Saaty T. L. (1980), The Analytic Hierarchy Process, McGraw-Hill Inc., New York.
13 Saaty, T. L. (2001), Decision-Making with the AHP; Why is the Principal Eigenvector Necessary, Proceedings of the Sixth ISAHP, 383-396.
14 Sinuany-stern, Z., Meherz, Z., and Hadad., Y. (2000), An AHP/DEA Methodology for Ranking Decision Making Units, International Transactions in Operational research, 7, 109-124.   DOI   ScienceOn
15 Wein, L. M. (1992), On the relationship Between Yield and Cycle time in Semiconductor Wafer Fabrication, IEEE Transactions on Semiconductor Manufacturing, 5(1), 156-158.   DOI
16 Xu, T., Moon, D. H., Park, C. S., and Zhang, B. L. (2009), A Simulation Study on the Manufacturing Process of Semiconductor Parts Using AHP, Journal of the Korea Society for Simulation, 18(2), 65-75.
17 Xu, T., Moon, D. H., and Baek, S. G. (2011), A Simulation Study Integrated with Analytic Hierarchy Process (AHP) in an Automotive Manufacturing System, Simulation, in printing (Online available on May 23, 2011).
18 Yang, T. and Kuo, C. (2001), A Hierarchical AHP/DEA Methodology for the Facilities Layout Design Problem, European Journal of Operational Research, 147(1), 128-136.