• 제목/요약/키워드: Package design

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제품 속성에 기반한 패키지 디자인 구성 요건 연구 - 프리저브드 플라워 브랜드 '프리저빌' 패키지의 표현을 중심으로 - (The research of required components of package design based on the product attribute - Focus on the package design expressions of preserved flower brand 'Preserville' -)

  • 김내리;권혜진
    • 디자인융복합연구
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    • 제16권4호
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    • pp.81-98
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    • 2017
  • 이 연구는 프리저브드 플라워 패키지 디자인의 효율적 전개 여부를 평가하기 위해 조형 요소 뿐 아니라 제품 속성을 파악하여 접근하는 방향이 전제되어야 한다는 판단에서 시작되었다. 선행 연구를 기반으로 패키지 디자인의 구성 요건을 재정립하고, 제품 유형 분류 모형을 제안하였다. 패키지 디자인의 구성 원리는 6가지로 사용성, 심미성, 주목성, 독창성, 정체성, 상징성이며, 구성 요소는 크게 4가지 형태, 재질, 색상, 그래픽, 브랜드로 분류하였다. 제품 유형은 제품 정보 측면에서의 위험 지각과 제품 효익 측면에서의 사고 유형을 축으로 하여 4개 영역으로 구분하였다. 제품 유형 모형 영역별 대표 제품을 사례로 들어 패키지 디자인 구성 요소에서 발견되는 특징을 분석하여, 제품 유형에 따라 어떻게 디자인이 적용되어야 효과적이고 효율적인가에 대해 검토하였다. 이 모형에 대입해 프리저브드 플라워 패키지 디자인 전략적 방향성을 도출하였다. 최종적으로 연구용역으로 진행되어 제안된 평택시 프리저브드 플라워 브랜드 '프리저빌'의 패키지를 분석하여 한계점을 찾아보고 프리저브드 플라워라는 제품이 지향해야하는 패키지 디자인 관점을 제언하였다.

Thermal Performance Analysis for Cu Block and Dense Via-cluster Design of Organic Substrate in Package-On-Package

  • Lim, HoJeong;Jung, GyuIk;Kim, JiHyun;Fuentes, Ruben
    • 마이크로전자및패키징학회지
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    • 제24권4호
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    • pp.91-95
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    • 2017
  • Package-On-Package (PoP) technology is developing toward smaller form factors with high-speed data transfer capabilities to cope with high DDR4x memory capacity. The common application processor (AP) used for PoP devices in smartphones has the bottom package as logic and the top package as memory, which requires both thermally and electrically enhanced functions. Therefore, it is imperative that PoP designs consider both thermal and power distribution network (PDN) issues. Stacked packages have poorer thermal dissipation than single packages. Since the bottom package usually has higher power consumption than the top package, the bottom package impacts the thermal budget of the top package (memory). This paper investigates the thermal and electrical characteristics of PoP designs, particularly the bottom package. Findings include that via and dense via-cluster volume have an important role to lower thermal resistance to the motherboard, which can be an effective way to manage chip hot spots and reduce the thermal impact on the memory package. A Cu block and dense via-cluster layout with an optimal location are proposed to drain the heat from the chip hot spots to motherboard which will enhance thermal and electrical performance at the design stage. The analytical thermal results can be used for design guidelines in 3D packaging.

민박농가 농특산물 포장디자인 현황분석 및 개선방안 (Improvement by Survey Analysis on the Package Design for Agricultural Products of Farm Stay)

  • 채혜성;진혜련;안옥선
    • 농촌계획
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    • 제18권4호
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    • pp.141-152
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    • 2012
  • Recently the package design for agricultural product of farm stay is great interests for increasing the income of farmers and villages as it may fulfill the sensible needs of consumers who experience rural culture and farm stay. This paper presents the status of the package design for agricultural product of farm stay and proposed improvements to the package design as following; 1)to diversify the packaging capacity, 2)to develop the cultural products to applicate the traditional crafts technique, 3)to provide institutional strategies for presenting the identity of farm or village, 4)to develop the education program about package design. We sampled fifty pilot farms or villages, analyse the package design of them and questionnaire surveyed farmers and managers in order to find problems and suggest improvements.

Application of the Axiomatic Design Methodology to the Design of PBGA Package with Polyimide Coating Layer

  • Yang, Ji-Hyuck;Lee, Kang-Yong;Dong, C. Y.
    • Journal of Mechanical Science and Technology
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    • 제18권9호
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    • pp.1572-1581
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    • 2004
  • The purposes of the paper are to apply the axiomatic design methodology to the design of PBGA package with polyimide coating under hygrothermal loading in the IR soldering process and to suggest more reliable design conditions by stress analysis. The analysis model is a 256-pin perimeter Plastic Ball Grid Array (PBGA) package with the polyimide coating surrounding chip and above surface of BT-substrate. The polyimide coating is suggested to depress the maximum stresses occurred on the stress concentration positions. The axiomatic design methodology is proved to be useful to find the more reliable design conditions for PBGA package. Finally, the optimal values of design variables to depress the stress in the PBGA package are obtained.

일본의 캐릭터패키지디자인 사례분석 (A Case Study on Character Package Design of Japan)

  • 유현배
    • 디지털콘텐츠학회 논문지
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    • 제18권1호
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    • pp.47-54
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    • 2017
  • 본 연구는 일본의 캐릭터패키지를 사례 분석하여 소비자나 수용자들로부터 사랑받고 마케팅적으로도 성공한 디자인의 콘셉트를 추출하여 그 논리와 원칙을 정립하는 그 목적을 두고 있다. 또한 금후 우리나라의 캐릭터패키지디자인의 도입과 활용 시 객관적 타당성과 공감력 있는 패키지디자인을 개발하는데 본 연구가 그 지침이 되도록 하려한다. 다양한 미디어를 믹스하고 판매를 확대시켜 나간 토하토(Tohato)사의 5가지 캐릭터패키지디자인을 대상으로 하여, 디자인콘셉트를 파악하고 그 원칙을 찾아내어 성공의 원인을 밝히고자 하며, 따라서 캐릭터디자인의 개념과 캐릭터패키지디자인의 사례분석을 통한 상품 전략을 기업 측과 크리에이티브 측면에서 이론과 원칙을 연구하였다. 그 결과, 기능적인 측면을 떠나 스토리를 갖도록 하고 추억을 만들어가도록 하며 친근감을 유발하도록 한 디자인이 리뉴얼의 성공사례로 파악되었다. 패키지디자인에 있어서 때에 따라서는 디자인의 콘셉트를 명확히 하고 그 콘셉트의 성공을 위해 기존의 원칙을 벗어나서 과감한 디자인의 추진과 소비자의 행태 분석에 따른 이론적 체계 하에서 패키지디자인의 실행이 무엇보다 중요하다는 것을 알 수 있었다.

Efficient Decoupling Capacitor Optimization for Subsystem Module Package

  • Lim, HoJeong;Fuentes, Ruben
    • 마이크로전자및패키징학회지
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    • 제29권1호
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    • pp.1-6
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    • 2022
  • The mobile device industry demands much higher levels of integration and lower costs coupled with a growing awareness of the complete system's configuration. A subsystem module package is similar to a board-level circuit that integrates a system function in a package beyond a System-in-Package (SiP) design. It is an advanced IC packaging solution to enhance the PDN and achieve a smaller form factor. Unlike a system-level design with a decoupling capacitor, a subsystem module package system needs to redefine the role of the capacitor and its configuration for PDN performance. Specifically, the design of package's form factor should include careful consideration of optimal PDN performance and the number of components, which need to define the decoupling capacitor's value and the placement strategy for a low impedance profile with associated cost benefits. This paper will focus on both the static case that addresses the voltage (IR) drop and AC analysis in the frequency domain with three specific topics. First, it will highlight the role of simulation in the subsystem module design for the PDN. Second, it will compare the performance of double-sided component placement (DSCP) motherboards with the subsystem module package and then prove the advantage of the subsystem module package. Finally, it will introduce three-terminal decoupling capacitor (decap) configurations of capacitor size, count and value for the subsystem module package to determine the optimum performance and package density based on the cost-effective model.

한·중 저가 화장품 콘텐츠의 패키지 디자인요소 비교 분석 (Comparison Analysis on Package Design Elements of Low-Price Cosmetic Contents in Korea and China)

  • 왕소혜;박영심;김치용;이창근
    • 한국멀티미디어학회논문지
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    • 제19권8호
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    • pp.1553-1563
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    • 2016
  • Thesedays, not only a quality of a product but also a design of it plays an important role. Throughout this analysis, I would like to discuss how a design of package works in the cosmetics with the fact that low cost cosmetics sales better than high cost cosmetics. In this research, there are five samples each for Korean and Chinese low-costed cosmetics to yield a result about an element of package design. Based on that result, there was an survey about two different package design followed by the research problems. Throughout research, an attention and familiarity of package which was considered of characteristics of China was more effective on Chinese consumers. In order to activate the content market of cosmetics, it is utilized to manufacture taking into account the maximum of the design elements in the package design is a conclusion that affect the time of purchase. In this paper, one in which I hope to help in the development of being utilized as a basis article content market industry for pre-market research foray into the Chinese market is South Korean cosmetics.

농·특산물 구매만족도 향상을 위한 포장디자인 개선에 관한 연구 (A Study on improving packaging design for Farm·Specialty purchase satisfaction)

  • 박동진;신황호;우수곤
    • 농촌계획
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    • 제20권4호
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    • pp.157-164
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    • 2014
  • This study clarified the correlation between the satisfaction of farm experience village visitors and the package design of farm specialty products and identified the factors to consider when improving the package design. It was found that the satisfaction with package design when purchasing farm specialty products affected the satisfaction of farm experience village visitors. In case of farm experience village visitors, they were more satisfied with the purchase when they were satisfied with the package design of farm specialty products they purchased. The results of analysis of correlation between the satisfaction of farm experience village visitors and the improvement of package design of farm specialty products showed that the important factors of package design are easiness of transport handling, easiness of storage, and functionality of packaging materials.

여성 화장품 용기디자인이 구매성향에 미치는 영향에 관한 연구 (A Study on the Influence of Package Design of Female Cosmetics on Purchasing Preference)

  • 이재하;김제준
    • 산업경영시스템학회지
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    • 제27권3호
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    • pp.52-58
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    • 2004
  • This study investigated the influence of package design of female cosmetics on the purchasing preferences of view The subjects of this study were the consumers of female cosmetics from their twenties to the forties, and were 195 consumers who dropped into beauty counters to buy their cosmetics. With this study, it can be said that package design Is an effective factor on purchasing of female cosmetics. In general, most consumers prefer to practical and useful package design. But the younger consumers tend to be more influenced by luxury and expensive package design than an elderly consumers on purchasing cosmetics. And it made a little difference in purchasing preferences by academic background.

시선추적장치를 활용한 라면 패키지 디자인의 시각적 요소에 대한 시각적 주의집중도 분석 (Analysis of Visual Attention on Visual Elements of Ramen Package Design using Eye-Tracking Device)

  • 박민희;권만우;황미경;김현성
    • 한국멀티미디어학회논문지
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    • 제25권7호
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    • pp.945-952
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    • 2022
  • In a market situation full of brands and products, packaging requires a differentiated design that reflects the needs and trends of the times, as well as the characteristics of the product. Therefore, in this study, through literature reviews, market research methods, questionnaire surveys, eye-tracking experiments, etc., we derived related research and current status of ramen package design, and visual expression elements that induce consumers' subjective perception and interest. As a result, the ramen package design was generally simplified and tended to visualize the spicy taste. Second, consumers buy bag ramen once a week on average at a large discount mart, consider the color of the ramen package design as important, and recognize that the aesthetics of the package design can improve quality. Finally, the spicy phrases and ramen illustrations were the first visual elements of the ramen package design, and for the longest time, attention was focused on the brand name.