• 마이크로전자및패키징학회지
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• 제9권3호
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• pp.31-36
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• 2002

PBGA에 비해 상대적으로 큰 칩을 실장하는 고속 SRAM용 153 FC-BGA을 대상으로 2차 솔더접합부의 신뢰성을 평가하였다. 실험은 열사이클 시험에서 발생하는 단면과 양면 실장, 패키지 구조, 언더 필 재료, 기판의 종류와 두께, 솔더 볼의 크기에 따른 영향을 분석하였다. BT기판의 두께가 0.95mm에서 1.20mm로 증가하고, 낮은 영률 의 언더 필 재료에서 솔더접합부의 피로 수명이 30% 향상됨을 확인하였다. 또한 솔더 볼의 크기가 0.76 mm에서 0.89mm로 증가하면, 솔더접합부에서 균열에 대한 저항성은 2배 정도 증가하였다.

• 마이크로전자및패키징학회지
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• 제16권1호
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• pp.27-31
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• 2009

본 논문에서는 웨이퍼 레벨 기술을 이용한 CIS용 폴리머 접합 기술을 연구하고 접합 후의 warpage 분석과 개별 패키지의 신뢰성 테스트를 수행하였다. 균일한 접합 높이를 유지하기 위하여 glass 웨이퍼 상에 dam을 형성하고 접합용 폴리머 층을 patterning하여 Si과 glass 웨이퍼의 접합 테스트를 수행하였다. Si 웨이퍼의 접합온도, 접합 압력 그리고 접합 층이 낮을수록 warpage 결과가 감소하였으며 접합시간과 승온 시간이 짧을수록 warpage 결과가 증가하는 것을 확인하였다. 접합 된 웨이퍼를 dicing 하여 각 개별 칩 단위로 TC, HTC, Humidity soak의 신뢰성 테스트를 수행하였으며 warpage 결과가 패키지의 신뢰성 결과에 미치는 영향은 미비한 것으로 확인되었다.

• The Journal of Korean Physical Therapy
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• 제34권2호
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• pp.73-79
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• 2022

Purpose: This descriptive study aimed at physical therapists to determine the actual conditions of sexual harassment occurring in the workplace, their coping strategies, and effective coping methods. Methods: In total, 186 responses were collected through Google from June 28 to August 21, 2021. The questionnaire consisted of 102 questions about the subject's general characteristics, sexual harassment, psychological stress, physical stress, and sexual harassment prevention education. Statistical Package For The Social Sciences (SPSS) was used for analysis, frequency analysis, percentage, standard deviation, and corresponding sample t-test, and the significance level was set to 0.05. Results: The perception of sexual harassment was 7.1, which was lower than that of other occupations. The perpetrators of visual, verbal, and physical sexual harassment appeared in the order of patients, coworkers, and guardians. Psychological and physical stresses were higher than the average due to damage caused by sexual harassment, requiring some attention. Work stress showed an average level. With the higher perception, a negative correlation was observed in the face of mitigation (p<0.001). Conclusion: The number of victims of sexual harassment is increasing every year. To cope with sexual harassment, there should be a department capable of counseling and processing in the workplace, and what occurs should be analyzed. In addition, educational programs are needed to prevent sexual harassment in consideration of the characteristics of hospitals.

• 대한영양사협회학술지
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• 제11권2호
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• pp.233-241
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• 2005

The purpose of the study was to evaluate the perception of importance about prerequisite program(PRP) of dietitians. A questionnaire was developed to achieve research objectives and sent to random samples of 450 dietitians by a mail from July to August in 2000 ; 242(54%) responses were analyzed. The respondents used three-point-scale to rate their perception of importance about PRP from 1-"will be necessary" to 3-"very important". All statistical analyses were conducted using SAS package(version 8.12) in order to have means, standard deviations, One-way analysis of variance, Duncan’s multiple range test and t-test. The study results were summarized as follows. The rates of perception of importance about PRP were significantly different from 21 of the 37 contents among business and industry, health care and school foodservice and were significantly different from 16 of the 37 contents among direct and contract management(p<.05 or p<.01 or p<.001). Dietitians in business and industry had lowest perception of importance about PRP of other respondents. Generally, the item related to ‘‘employee hygiene practice’ had the highest perception level score among PRP in foodservice facilities. Results indicate that there is a need for increased education of dietitians about PRP and appropriate practices.

• 대한기계학회논문집B
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• 제30권12호
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• pp.1139-1146
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• 2006

Light Oil Flow Standard System(LOFSS) in Korea Research Institute of Standards and Science(KRISS) was designed for oil flowmeter calibration. In order to extend the flow range from 120 $m^3/h$ to 200 $m^3/h$, the build-up technique was applied with two positive displacement flowmeters as master flowmeter. The master flowmeters were calibrated against with LOFSS, which has 0.04 % uncertainty of flow quantity determination, then the test flowmeter is calibrated against two master flowmeters. For uncertainty analysis, the repeatability of master flowmeters, the variation of the fluid density and the pipe volume due to temperature change were scrutinized. The contribution of each uncertainty factors to the calibrator and the correlation of each factors were discussed. For investigating the feasibility of uncertainty analysis, a turbine flowmeter as a transfer package was tested with LOFSS and two reference flowmeter. The hypothesis test for both results was coincide with a 95 % significant level. This means that the uncertainty analysis procedure of the calibrator is reasonable and the extension of flow range with master meters was carry out successfully.

• Asian Pacific Journal of Cancer Prevention
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• 제16권2호
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• pp.401-406
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• 2015

Background: This study was planned as comparative and descriptive in order to measure and evaluate the knowledge and attitudes regarding early diagnosis of women with and without a family history of cervical cancer. Materials and Methods: The study sample consisted of the relatives of female patients (N=253) who were admitted to Istanbul University of Medicine. Women with a family history of cervical cancer formed the case group, while those without family history of cervical cancer constituted the control group. Two distinct data collection tools, a questionnaire and the Miller Behavioral Style Scale (MBSS), were used in order to obtain data for evaluation with SPSS for Windows 20.0 statistics package program. Results: It was found that 61.0% of the case group with family history of cervical cancer and 19.0% of the control group without family history of cervical cancer were using early diagnostic methods. Thus the presence of an individual with cervical cancer in the family affected the attitudes towards early diagnosis. It was further found that the level of knowledge on cervical cancer and PAP smear test was higher in the case group, which was more sensitive with regard to being informed about cervical cancer as compared to general society. However, the average MBSS scores were not significantly different compared to the control group. Conclusions: It was noted that, women participating this study knowledgeable, but this did not necessarily transform into better behavior.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• 한국의류학회지
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• 제23권7호
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• pp.1007-1018
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• 1999

The purpose of this study were : 1) to examine the apparel product purchasing tendency of PC communication and internet users in home shopping 2) to analyze the difference of apparel product purchasing tendency accordint to consumer factors. The data was administered to 160 subjects who had communicated the PC communication and internet. And the data was collected from May through August in 1998. SPSS package was used for analysis and the following methods such as Means Percentage Frequencies Factor analysis Crosstabulation analysis t-test and one-way ANOVA, The results of this study were as follows : 1) The users of PC communication and internet were young and high-education level and a metropolitan area dwellers. They received a purchase offer through catalog PC communication and internet cable TV and paid out credit card Experience to purchasing apparel product of home shopping was very low but intention to purchasing was relative high. item that consumer wanted to buy using home shopping were casual clothing and fashion goods which were not important to fit and without regard to style. 2) Between purchasing apparel product of home shopping and mainly consideration factors were shown to have the significant differences according to age residential quarters whether or not marriage. income level. A metropolitan area dwellers the low-age unmarried and the low-income groups thought much of convenience shopping time and effort's saving. A person of the higher-income and the married thought much of the facility of an exchange or returned goods. A region dwellers were to purchase a speciality product or gift goods. 3) Between purchasing apparel product of home shopping and satisfaction degree were shown to have significant differences according to sex whether or not marriage education level an occupation. The woman than the man was satisfied with the benefit of the shopping time and effort's saving. And the unmarried than the married was satisfied with the benefit of the home shopping's convenience. The higher-education level than the lower-education level was satisfied with the quality guarantee of the product.

• 한국콘텐츠학회논문지
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• 제16권4호
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• pp.666-674
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• 2016

본 연구는 베이비붐 세대의 소비수준이 삶의 만족도에 미치는 영향을 살펴보고, 주관적 기대감(생활수준 및 정부정책)의 매개효과를 검증하였다. 연구에서 활용된 자료는 한국노동연구원의 2012년 제4차 고령화연구패널 조사이며, 베이비붐 세대인 1955년생부터 1961년생 1,756명을 연구대상으로 하였다. 자료 분석은 빈도분석 및 기술통계를 실시하였고, SPSS 21.0 패키지 프로그램을 사용하여 연구모형을 분석하였으며, Sobel test를 통해 매개효과를 검증하였다. 분석결과 첫째, 베이비붐 세대의 소비수준이 높을수록 삶의 만족도가 높아지는 것으로 나타났다. 둘째, 베이비붐 세대의 삶의 만족도에 소비수준이 미치는 효과는 주관적 기대감에 부분 매개되는 것으로 나타났다. 이에 본 연구는 분석결과를 바탕으로 베이비붐 세대의 주관적 기대감 및 삶의 질 향상을 위해 나아가야할 방향에 대해서 이론적 정책적 함의를 제시하였다.